Full-Heusler alloy Fe_(2)TiSn was predicted to be a potential thermoelectric material with high mechanical properties and stability.Fe_(2)TiSn was usually prepared by arc-melting followed by annealing for 2 weeks,whic...Full-Heusler alloy Fe_(2)TiSn was predicted to be a potential thermoelectric material with high mechanical properties and stability.Fe_(2)TiSn was usually prepared by arc-melting followed by annealing for 2 weeks,which takes a long time and consumes a large amount of energy.In this paper,Fe_(2)TiSn was prepared by an ultra-fast method,self-propagating high-temperature synthesis (SHS) combined with spark plasma sintering.The bulk materials with uniform element distribution,well controlled composition and relative densities of over 97.5% were prepared.The undoped Fe_(2)TiSn samples show p-type transport behavior.Co was heavily doped at the Fe site to prepare n-type Fe_(2-2x)Co_(2x) TiSn samples.The thermoelectric properties measurements carried out on the Co-doped samples show a highest ZT=0.02 at 300 K,which is about tripe the performance of the pristine Fe_(2)TiSn.This study provides a new approach for the rapid and low-cost preparation of full-Heusler thermoelectric materials.展开更多
The thin-film thermoelectric cooler(TEC)is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect.When an electric current pulse is applied to the thin-film TE...The thin-film thermoelectric cooler(TEC)is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect.When an electric current pulse is applied to the thin-film TEC,the TEC can achieve an instantaneous lower temperature compared to that created by a steady current.In this paper,we developed a novel strategy to reduce the peak temperature of the chip working under dynamic power,thus making the semiconductor chip operate reliably and efficiently.A three-dimensional numerical model was built to study the transient cooling performance of the thin-film TEC on chips.The effects of parameters,such as the current pulse,the heat flux,the thermoelement length,the number of thermoelements,and the contact resistance on the performance of the thin-film TEC,were investigated.The results showed that when a current pulse of 0.6 A was applied to the thin-film TEC before the peak power of the chip,the peak temperature of the chip was reduced by more than 10℃,making the thin-film thermoelectric cooler a promising technology for the temperature control of modern chips with high peak powers.展开更多
基金Funded by the Laboratory Open Fund of Beijing Smart-chip Microelectronics Technology Co.,Ltd。
文摘Full-Heusler alloy Fe_(2)TiSn was predicted to be a potential thermoelectric material with high mechanical properties and stability.Fe_(2)TiSn was usually prepared by arc-melting followed by annealing for 2 weeks,which takes a long time and consumes a large amount of energy.In this paper,Fe_(2)TiSn was prepared by an ultra-fast method,self-propagating high-temperature synthesis (SHS) combined with spark plasma sintering.The bulk materials with uniform element distribution,well controlled composition and relative densities of over 97.5% were prepared.The undoped Fe_(2)TiSn samples show p-type transport behavior.Co was heavily doped at the Fe site to prepare n-type Fe_(2-2x)Co_(2x) TiSn samples.The thermoelectric properties measurements carried out on the Co-doped samples show a highest ZT=0.02 at 300 K,which is about tripe the performance of the pristine Fe_(2)TiSn.This study provides a new approach for the rapid and low-cost preparation of full-Heusler thermoelectric materials.
基金the National Natural Science Foundation of China(Grant No.51778511)Natural Science Foundation of Hubei Province(Grant No.2018CFA029)+3 种基金Key Research and Design Projects of Hubei Province(Grant No.2020BAB129)Key Project of ESI Discipline Development of Wuhan University of Technology(Grant No.2017001)Scientific Research Foundation of Wuhan University of Technology(Nos.40120237 and 40120551)the Fundamental Research Funds for the Central Universities(WUT:2021IVA037)。
文摘The thin-film thermoelectric cooler(TEC)is a promising solid-state heat pump that can remove the high local heat flux of chips utilizing the Peltier effect.When an electric current pulse is applied to the thin-film TEC,the TEC can achieve an instantaneous lower temperature compared to that created by a steady current.In this paper,we developed a novel strategy to reduce the peak temperature of the chip working under dynamic power,thus making the semiconductor chip operate reliably and efficiently.A three-dimensional numerical model was built to study the transient cooling performance of the thin-film TEC on chips.The effects of parameters,such as the current pulse,the heat flux,the thermoelement length,the number of thermoelements,and the contact resistance on the performance of the thin-film TEC,were investigated.The results showed that when a current pulse of 0.6 A was applied to the thin-film TEC before the peak power of the chip,the peak temperature of the chip was reduced by more than 10℃,making the thin-film thermoelectric cooler a promising technology for the temperature control of modern chips with high peak powers.
