The evolutionary process and intermetallic compounds of Cu/A1 couples during isothermal heating at a constant bonding tem- perature of 550℃ were investigated in this paper. The interracial morphologies and microstruc...The evolutionary process and intermetallic compounds of Cu/A1 couples during isothermal heating at a constant bonding tem- perature of 550℃ were investigated in this paper. The interracial morphologies and microstructures were examined by optical microscopy, scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. The results suggest that bonding is not achieved between Cu and A1 at 550℃ in 10 min due to undamaged oxide films. Upon increasing the bonding time from 15 to 25 min, however, metallurgical bonding is obtained in these samples, and the thickness of the reactive zone varies with holding time. In the interfacial region, the final microstructure consists of Cu9A14, CuAl, CuA12, and ct-A1 ＋ CuAl2. Furthermore, these results provide new insights into the mechanism of the imerfacial reaction between Cu and A1. Microhardness measurements show that the chemical composition exerts a signifi- cant influence on the mechanical properties of Cu/A1 couples.展开更多
Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bond-ing temperature and cooling rate on the microstructure and morphology of Cu/Al composites...Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bond-ing temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper. The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and field-emission scanning electron mi-croscopy equipped with energy-dispersive X-ray spectroscopy. The results indicate that effective Cu-Al bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals. The microstructural characteristics are associated with various bonding tem-peratures, which impact the driving force of interdiffusion. It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region. Meanwhile, microhardness measurements show that hardness varies with the bonding temperature and rate of cooling.展开更多
基金financially supported by the National Natural Science Foundation of China (No. 51274038)
文摘The evolutionary process and intermetallic compounds of Cu/A1 couples during isothermal heating at a constant bonding tem- perature of 550℃ were investigated in this paper. The interracial morphologies and microstructures were examined by optical microscopy, scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. The results suggest that bonding is not achieved between Cu and A1 at 550℃ in 10 min due to undamaged oxide films. Upon increasing the bonding time from 15 to 25 min, however, metallurgical bonding is obtained in these samples, and the thickness of the reactive zone varies with holding time. In the interfacial region, the final microstructure consists of Cu9A14, CuAl, CuA12, and ct-A1 ＋ CuAl2. Furthermore, these results provide new insights into the mechanism of the imerfacial reaction between Cu and A1. Microhardness measurements show that the chemical composition exerts a signifi- cant influence on the mechanical properties of Cu/A1 couples.
基金supported by the National Science Foundation of China(No.51274038)
文摘Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bond-ing temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper. The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and field-emission scanning electron mi-croscopy equipped with energy-dispersive X-ray spectroscopy. The results indicate that effective Cu-Al bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals. The microstructural characteristics are associated with various bonding tem-peratures, which impact the driving force of interdiffusion. It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region. Meanwhile, microhardness measurements show that hardness varies with the bonding temperature and rate of cooling.
