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Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase(PTLP) Bonding with Multiple Interlayers 被引量:1
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作者 Xin Zhang Xiaohong Shi +3 位作者 Jie Wang Hejun Li Kezhi Li yancai ren 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2014年第4期663-669,共7页
With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on ... With the use of Ti/Ni/Cu/Ni multiple foils as interlayer,carbon/carbon(C/C) composite was bonded to Nibased superalloy GH3044 by partial transient liquid-phase bonding technique.The effect of bonding temperature on the microstructures and strengths of the joints was investigated.The results showed that gradient structural multiple interlayers composed of ‘‘C–Ti reaction layer/Ti–Ni intermetallic compound layer/Ni–Cu sosoloid/residual Cu layer/Ni-GH3044 diffusion layer'' were formed between C/C composite and GH3044.The shear strength of the C/C composite/GH3044 joint reached the highest value of 26.1 MPa when the bonding temperature was 1,030 °C.In addition,the fracture morphology showed that the fracture mode changed with the increase of bonding temperature. 展开更多
关键词 Partial transient liquid-phase bonding C/C composite Ni-based superalloy Microstructure Joint shear strength
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