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Low-valence ion addition induced more compact passive films on nickel-copper nano-coatings 被引量:2
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作者 Quangquan Do Hongze An +6 位作者 Guozhe Meng Weihua Li Lai-Chang Zhang yangqiu wang Bin Liu Junyi wang Fuhui wang 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2019年第10期2144-2155,共12页
Ni-Cu nano-coatings were prepared by pulsed electroplating technique in the baths containing various amount of boric acid. Their microstructure, morphologies and corrosion resistance were characterized in detail. The ... Ni-Cu nano-coatings were prepared by pulsed electroplating technique in the baths containing various amount of boric acid. Their microstructure, morphologies and corrosion resistance were characterized in detail. The addition of boric acid strongly influences on the microstructure of the Ni-Cu coatings.The coating with a grain size of 130 nm, obtained from the bath containing 35 g L^-1 boric acid, shows the highest corrosion resistance. This is attributed to the low-valence Cu ion(Cu^+) additions in nickel oxide, which could significantly decrease the oxygen ion vacancy density in the passive film to form a more compact passive film. The higher Cu^+ additions and the lower diffusivity of point defects(D0) are responsible for the formation of more compact passive film on the coating obtained from the bath with 35 g L^-1 boric acid. 展开更多
关键词 PASSIVE film Point DEFECT Corrosion ELECTROPLATING Coating
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