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Microstructural Evolution of a Ni-base Alloy DZ468 Joint Bonded with a New Co-base Filler 被引量:3
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作者 yanhong jing Zhi Zheng +1 位作者 Enze Liu Yi Guo 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2014年第5期480-486,共7页
Ni-base alloy DZ468 has been joined by transient liquid phase bonding technique with a newly developed Co-based filler. The microstructures of the Co-base filler and the joint, the effects of heat treatment on microst... Ni-base alloy DZ468 has been joined by transient liquid phase bonding technique with a newly developed Co-based filler. The microstructures of the Co-base filler and the joint, the effects of heat treatment on microstructure and hardness of the joint have been investigated by various experimental methods. Results show that the Co-base filler consists of γ, M2B, M5B3 and M23B6 phases. Because of the interdiffusion between the base metal and the filler, γ, MC, M5B3 and M23B6 phases are formed in the bonding zone. And localized liquidation of substrate occurs in the diffusion affected zone, with MC and M3B2 precipitating in this area. During heat treatment, the volume of the intermetallic phases in the bonding zone resulting from incomplete isothermal solidification decreases obviously. On the contrary, the width of the diffusion affected zone increases at the solution stage and subsequently decreases at the aging stages. 展开更多
关键词 Transient liquid phase (TLP) bonding Microstructure evolution Ni-base alloy Co-base rifler
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