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Advanced Process and Electron Device Technology 被引量:1
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作者 Dan Zhang Xiaojing Su +21 位作者 Hao Chang Hao Xu Xiaolei Wang Xiaobin He Junjie Li Fei Zhao Qide Yao yanna luo Xueli Ma Hong Yang Yongliang Li Zhenhua Wu Yajuan Su Tao Yang Yayi Wei Anyan Du Huilong Zhu Junfeng Li Huaxiang Yin Jun luo Tianchun Ye Wenwu Wang 《Tsinghua Science and Technology》 SCIE EI CAS CSCD 2022年第3期534-558,共25页
This article reviews advanced process and electron device technology of integrated circuits,including recent featuring progress and potential solutions for future development.In 5 years,for pushing the performance of ... This article reviews advanced process and electron device technology of integrated circuits,including recent featuring progress and potential solutions for future development.In 5 years,for pushing the performance of fin field-effect transistors(FinFET)to its limitations,several processes and device boosters are provided.Then,the three-dimensional(3 D)integration schemes with alternative materials and device architectures will pave paths for future technology evolution.Finally,it could be concluded that Moore’s law will undoubtedly continue in the next 15 years. 展开更多
关键词 advanced process gate-all-around devices three-dimensional(3D)integration high-mobility channel integrated circuits
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