Ferroelectric effect and equivalent polarization charge model of PbZr_(0.2)Ti_(0.8)O_(3)on AlGaN/GaN MIS-HEMT

PbZr_(0.2)Ti_(0.8)O_(3)(PZT)gate insulator with the thickness of 30 nm is grown by pulsed laser deposition(PLD)in AlGaN/GaN metal-insulator-semiconductor high electron mobility transistors(MIS-HEMTs).The ferroelectric effect of PZT AlGaN/GaN MIS-HEMT is demonstrated.The polarization charge in PZT varies with different gate voltages.The equivalent polarization charge model(EPCM)is proposed for calculating the polarization charge and the concentration of two-dimensional electron gas(2DEG).The threshold voltage(V_(th))and output current density(I_(DS))can also be obtained by the EPCM.The theoretical values are in good agreement with the experimental results and the model can provide a guide for the design of the PZT MIS-HEMT.The polarization charges of PZT can be modulated by different gate-voltage stresses and the V_(th)has a regulation range of 4.0 V.The polarization charge changes after the stress of gate voltage for several seconds.When the gate voltage is stable or changes at high frequency,the output characteristics and the current collapse of the device remain stable.

Comparative study on characteristics of Si-based AlGaN/GaN recessed MIS-HEMTs with HfO2 and Al2O3 gate insulators

Two types of enhancement-mode(E-mode)AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors(MIS-HEMTs)with different gate insulators are fabricated on Si substrates.The HfO2 gate insulator and the Al2O3 gate insulator each with a thickness of 30 nm are grown by the plasma-enhanced atomic layer deposition(PEALD).The energy band diagrams of two types of dielectric MIS-HEMTs are compared.The breakdown voltage(VBR)of HfO2 dielectric layer and Al2O3 dielectric layer are 9.4 V and 15.9 V,respectively.With the same barrier thickness,the transconductance of MIS-HEMT with HfO2 is larger.The threshold voltage(Vth)of the HfO2 and Al2O3 MIS-HEMT are 2.0 V and 2.4 V,respectively,when the barrier layer thickness is 0 nm.The C-V characteristics are in good agreement with the Vth's transfer characteristics.As the barrier layer becomes thinner,the drain current density decreases sharply.Due to the dielectric/AlGaN interface is very close to the channel,the scattering of interface states will lead the electron mobility to decrease.The current collapse and the Ron of Al2O3 MIS-HEMT are smaller at the maximum gate voltage.As Al2O3 has excellent thermal stability and chemical stability,the interface state density of Al2O3/AlGaN is less than that of HfO2/AlGaN.