Molecular simulation of interfacial reaction between TiAl alloy melts and different coatings

The effect of coatings(Y_2O_3, Zr O_2 and Al_2O_3) on the interfacial reaction of Ti Al alloys was studied with molecular dynamics. The binding energy of coatings and the diffusion process of oxygen in the melt were simulated, and then the simulation results were compared with the experimental results. The simulation results indicate that for each of the three simulated coatings, inordinate interfacial reactions have occurred between the coating and the melt. The binding energy results show that Y_2O_3 has the best stability and is the most difficult to break down. Zr O_2 has the greatest decomposition energy and is the easiest to break down in the melt. Besides, the molecular dynamics indicate that the diffusion coefficient of the oxygen atom in Al_2O_3 is larger than that in the other two coatings, indicating that oxygen diffusion in Al_2O_3 is the fastest at a given temperature. The experimental results show that the oxygen concentration of the melt with Al_2O_3 coating is the highest, and the oxygen diffusion is of similar magnitude to the simulation values, from which the conclusion can be obtained that the oxygen concentration is significantly influenced by the coating materials.

Morphologies and evolution of intermetallic compounds formed between Sn_(1.0)Ag_(0.7)Cu composite solder and Cu substrate

This study investigated the morphologies of the intermetallic compounds(IMC)formed during soldering reaction between Sn_(1.0)Ag_(0.7)Cu-1.0SnO_(2) composite solder and Cu substrate at various temperatures.The prismtype Cu_(6)Sn_(5) forms when the soldering temperature is 260or 2800C,while those grains transform from prism type to scallop type at the temperatures of 300 and 320℃.It can be found that the morphologies of Cu6Sn5 grains affect adsorption of Ag_(3)Sn nanoparticles during soldering reaction.The scallop-type grains with a higher growth rate need to adsorb large amounts of Ag_(3)Sn particles.In terms of mechanical behavior,the shear strength of solder joint is improved from 40 to 46 MPa at soldering temperature of 300℃.In addition,the thickness of IMC increases with the extension of aging time.During aging,the morphology of Cu6Sn5 grains remains scallop type,but the number of Ag_(3)Sn nanoparticles is reduced largely.The scallop-type Cu^(6)Sn_(5) can increase in size and flatten in morphology with the aging time increasing.