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Hybrid-integrated 200 Gb/s REC-DML array transmitter based on photonic wire bonding technology
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作者 Yuxin Ma Jie Zhao +6 位作者 Tongtong Yang yipeng mei Zhenxing Sun Jun Lu Shaobo Li Xiang Ma Xiangfei Chen 《Chinese Optics Letters》 SCIE EI CAS CSCD 2024年第8期64-69,共6页
An 8-channel hybrid-integrated chip for 200 Gb/s(8×25 Gb/s)signal transmission has been demonstrated.The channels are all within the O-band,and with a spacing of 800 GHz.The core of this chip is a monolithic inte... An 8-channel hybrid-integrated chip for 200 Gb/s(8×25 Gb/s)signal transmission has been demonstrated.The channels are all within the O-band,and with a spacing of 800 GHz.The core of this chip is a monolithic integrated multi-wavelength laser array of 8 directly-modulated distributed feedback(DFB)lasers.By using the reconstruction equivalent chirp technique,multi-wavelength integration and asymmetric phase shift structures are achieved in the laser array.The output laser beams of the array are combined by a planar light-wave circuit,which is hybrid-integrated with the laser array by photonic wire bonding.Experiment results of this transmitter chip show good single-mode working of each unit laser,with a sidemode suppression ratio above 50 dB,and the modulation bandwidth is above 20 GHz.Clear eye diagrams are obtained in the lasers for 25 Gb/s non-return-to-zero modulation,which implies a total 200 Gb/s transmission rate for the whole chip. 展开更多
关键词 direct modulation laser array reconstruction equivalent chirp photonic wire bonding hybrid integration
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