In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjetpri...In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjetprinted silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics.展开更多
基金supported by the National Key Basic Research Program of China(Nos.2014CB648300,2017YFB0404501)the National Natural Science Foundation of China(Nos.21422402,21674050)+8 种基金the Natural Science Foundation of Jiangsu Province(Nos.BK20140060,BK20130037,BK20140865,BM2012010)the Program for Jiangsu Specially-Appointed Professors(No.RK030STP15001)the Program for New Century Excellent Talents in University(No.NCET-13-0872)the NUPT"1311 Project"and Scientific Foundation(Nos.NY213119,NY213169)the Synergetic Innovation Center for Organic Electronics and Information Displays,the Priority Academic Program Development of Jiangsu Higher Education Institutions(PAPD)the Leading Talent of Technological Innovation of National Ten Thousands Talents Program of Chinathe Excellent Scientific and Technological Innovative Teams of Jiangsu Higher Education Institutions(No.TJ217038)the Program for Graduate Students Research and Innovation of Jiangsu Province(No.KYZZ16-0253)the 333 Project of Jiangsu Province(Nos.BRA2017402,BRA2015374)
文摘In this work, a simple methodology was developed to enhance the patterning resolution of inkjet printing, involving process optimization as well as substrate modification and treatment. The line width of the inkjetprinted silver lines was successfully reduced to 1/3 of the original value using this methodology. Large-area flexible circuits with delicate patterns and good morphology were thus fabricated. The resultant flexible circuits showed excellent electrical conductivity as low as 4.5 Ω/□ and strong tolerance to mechanical bending. The simple methodology is also applicable to substrates with various wettability, which suggests a general strategy to enhance the printing quality of inkjet printing for manufacturing high-performance large-area flexible electronics.
