High-entropy(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C ceramics,with different contents(0,5,10,and 20 vol.%)of Si C whiskers(SiCw),were fabricated by spark plasma sintering using raw powders synthesized via carbother...High-entropy(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C ceramics,with different contents(0,5,10,and 20 vol.%)of Si C whiskers(SiCw),were fabricated by spark plasma sintering using raw powders synthesized via carbothermal reduction.The application of a uniaxial compaction force led to texture development of the SiCw within the(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C matrix.Fracture toughness increased with the increase in SiCw content,while Vickers hardness remains almost unchanged.The toughness of(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C-20 vol.%SiCw ceramics reached 4.3±0.3 MPa m^(1/2),which was approximately 43%higher than that of the monolithic(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C ceramic(3.0±0.2 MPa m1/2).The main toughening mechanisms were attributed to crack deflection,whisker debonding,and whisker pullout.展开更多
基金financially supported by the National Natural Science Foundation of China(Nos.51832002,51402055,51602060,U1401247)the Science and Technology Program of Guangzhou(No.201704030095)。
文摘High-entropy(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C ceramics,with different contents(0,5,10,and 20 vol.%)of Si C whiskers(SiCw),were fabricated by spark plasma sintering using raw powders synthesized via carbothermal reduction.The application of a uniaxial compaction force led to texture development of the SiCw within the(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C matrix.Fracture toughness increased with the increase in SiCw content,while Vickers hardness remains almost unchanged.The toughness of(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C-20 vol.%SiCw ceramics reached 4.3±0.3 MPa m^(1/2),which was approximately 43%higher than that of the monolithic(Ti_(0.2)Zr_(0.2)Hf_(0.2)Nb_(0.2)Ta_(0.2))C ceramic(3.0±0.2 MPa m1/2).The main toughening mechanisms were attributed to crack deflection,whisker debonding,and whisker pullout.
