Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient

A novel solid-liquid interdiffusion(SLID)bonding method with the assistance of temperature gradient(TG)was carried out to bonding Cu and Ni substrates with Sn as interlayer.The element distribution and grain morphology of interfacial intermetallic compound(IMC)in Cu/Sn/Ni micro-joints during both SLID and TG-SLID bonding and in the final Cu/(Cu,Ni)_(6)Sn_(5)/Ni full IMC micro-joints were analyzed.Under the effect of Cu-Ni cross-interaction,interfacial(Cu,Ni)_(6)Sn_(5) dominated the IMC growth at all the interfaces.The morphology of the(Cu,Ni)_(6)Sn_(5) grains was closely related to Ni content with three levels of low,medium and high.The full IMC micro-joints consisted of L-(Cu,Ni)_(6) Sn_(5),M-(Cu,Ni)_(6)Sn_(5) and H-(Cu,Ni)_(6)Sn_(5) grains after SLID bonding or TG-SLID bonding with Ni as hot end,while only L-(Cu,Ni)_(6)Sn_(5) grains after TG-SLID bonding with Cu as hot end,showing that the direction of TG had a remarkably effect on the growth and morphology of the interfacial(Cu,Ni)_(6)Sn_(5) during TG-SLID bonding.Thermodynamic analysis revealed the key molar latent heat and critical Ni content between fine-rounded-like(Cu,Ni)_(6)Sn_(5) and block-like(Cu,Ni)_(6)Sn_(5) were 17,725.4 J and 11.0 at.%at 260℃,respectively.Moreover,the growth kinetic of the interfacial IMC was analyzed in detail during bonding with and without TG.Under the combination of TG and Cu-Ni cross-interaction,void-free full IMC micro-joints were fast formed by TG-SLID bonding with Cu as hot end.This bonding method may present a feasible solution to solve the problems of low formation efficiency and inevitable Cu_(3) Sn growth of full IMC joints for 3 D packaging applications.

Morphology and orientation evolution of Cu_(6)Sn_(5)grains on(001)Cu and(011)Cu single crystal substrates under temperature gradient

The morphology and orientation evolution of Cu_(6)Sn_(5)grains formed on(001)Cu and(011)Cu single crystal substrates under temperature gradient(TG)were investigated.The initial orientated prism-type Cu_(6)Sn_(5)grains transformed to non-orientated scallop-type after isothermal reflow.However,the Cu_(6)Sn_(5)grains with strong texture were revealed on cold end single crystal Cu substrates by imposing TG.The Cu_(6)Sn_(5)grains on(001)Cu grew along their c-axis parallel to the substrate and finally merged into one grain to form a fully IMC joint,while those on(011)Cu presented a strong texture and merged into a few dominant Cu_(6)Sn_(5)grains showing about 30°angle with the substrate.The merging between neighboring Cu_(6)Sn_(5)grain pair was attributed to the rapid grain growth and grain boundary migration.Accordingly,a model was put forward to describe the merging process.The different morphology and orientation evolutions of the Cu_(6)Sn_(5)grains on single crystal and polycrystal Cu substrates were revealed based on crystallographic relationship and Cu flux.The method for controlling the morphology and orientation of Cu_(6)Sn_(5)grains is really benefitial to solve the reliability problems caused by anisotropy in 3 D packaging.