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Laser-based defect characterization and removal process for manufacturing fused silica optic with high ultraviolet laser damage threshold
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作者 Xiaocong Peng Xin Cheng +7 位作者 Chaoyang Wei Songlin Wan Kaizao Ni zhenqi niu Yichi Han Zhigang Jiang Zhen Cao Jianda Shao 《Light(Advanced Manufacturing)》 2023年第3期181-194,共14页
Residual processing defects during the contact processing processes greatly reduce the anti-ultraviolet(UV)laser damage performance of fused silica optics,which significantly limited development of high-energy laser s... Residual processing defects during the contact processing processes greatly reduce the anti-ultraviolet(UV)laser damage performance of fused silica optics,which significantly limited development of high-energy laser systems.In this study,we demonstrate the manufacturing of fused silica optics with a high damage threshold using a CO_(2)laser process chain.Based on theoretical and experimental studies,the proposed uniform layer-by-layer laser ablation technique can be used to characterize the subsurface mechanical damage in three-dimensional full aperture.Longitudinal ablation resolutions ranging from nanometers to micrometers can be realized;the minimum longitudinal resolution is<5 nm.This technique can also be used as a crack-free grinding tool to completely remove subsurface mechanical damage,and as a cleaning tool to effectively clean surface/subsurface contamination.Through effective control of defects in the entire chain,the laser-induced damage thresholds of samples fabricated by the CO_(2)laser process chain were 41%(0%probability)and 65.7%(100%probability)higher than those of samples fabricated using the conventional process chain.This laser-based defect characterization and removal process provides a new tool to guide optimization of the conventional finishing process and represents a new direction for fabrication of highly damage-resistant fused silica optics for high-energy laser applications. 展开更多
关键词 Fused silica Laser materials processing Defect characterization Subsurface damage Process chain
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