Milling is one of the main methods for processing titanium alloy.At present,the complex process of milling is usually simulated by finite element method,which often has problems in mesh distortion and mesh reconstruct...Milling is one of the main methods for processing titanium alloy.At present,the complex process of milling is usually simulated by finite element method,which often has problems in mesh distortion and mesh reconstruction.Therefore,a meshless three-dimensional milling simulation model was established for TC4 titanium alloy using the smooth particle hydrodynamics(SPH)method.Firstly,the established SPH model was analyzed by the LS-DYNA software,and the stress distribution,temperature field,and cutting force during milling were studied under specific conditions.Subsequently,the cutting force was simulated under different cutting parameters and the effects of these parameters on the cutting force were determined.Finally,based on a series of cutting force experiments,the accuracy of the simulation model was verified.This study proves the feasibility of SPH method in the simulation of titanium alloy milling process and provides novel methods for investigating the processing mechanism and optimizing the processing technology of titanium alloys.展开更多
Back grinding of wafer with outer rim(BGWOR)is a new method for carrier-less thinning of silicon wafers.At present,the effects of process parameters on the grinding force remain debatable.Therefore,a BGWOR normal grin...Back grinding of wafer with outer rim(BGWOR)is a new method for carrier-less thinning of silicon wafers.At present,the effects of process parameters on the grinding force remain debatable.Therefore,a BGWOR normal grinding force model based on grain depth-of-cut was established,and the relationship between grinding parameters(wheel infeed rate,wheel rotational speed,and chuck rotational speed)and normal grinding force was discussed.Further,a series of experiments were performed to verify the BGWOR normal grinding force model.This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck,and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored.Moreover,this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.展开更多
文摘Milling is one of the main methods for processing titanium alloy.At present,the complex process of milling is usually simulated by finite element method,which often has problems in mesh distortion and mesh reconstruction.Therefore,a meshless three-dimensional milling simulation model was established for TC4 titanium alloy using the smooth particle hydrodynamics(SPH)method.Firstly,the established SPH model was analyzed by the LS-DYNA software,and the stress distribution,temperature field,and cutting force during milling were studied under specific conditions.Subsequently,the cutting force was simulated under different cutting parameters and the effects of these parameters on the cutting force were determined.Finally,based on a series of cutting force experiments,the accuracy of the simulation model was verified.This study proves the feasibility of SPH method in the simulation of titanium alloy milling process and provides novel methods for investigating the processing mechanism and optimizing the processing technology of titanium alloys.
基金support from the National Key Research and Development Program of China(Grant No.2016YFB1102205)the National Natural Science Foundation of China(Grant No.51775084).
文摘Back grinding of wafer with outer rim(BGWOR)is a new method for carrier-less thinning of silicon wafers.At present,the effects of process parameters on the grinding force remain debatable.Therefore,a BGWOR normal grinding force model based on grain depth-of-cut was established,and the relationship between grinding parameters(wheel infeed rate,wheel rotational speed,and chuck rotational speed)and normal grinding force was discussed.Further,a series of experiments were performed to verify the BGWOR normal grinding force model.This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck,and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored.Moreover,this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.
