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Preparation and Electrochemical Characteristics of Three-dimensional Manganese Oxide Micro-supercapacitor Electrode
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作者 Chun-ming wen zhi-yu wen +1 位作者 Zheng You Xiao-feng Wang 《Chinese Journal of Chemical Physics》 SCIE CAS CSCD 2012年第2期209-213,I0004,共6页
以便增加电极表面区域并且提高费用存储能力,我们学习微电镀物品制作三维的高方面比率的机械系统技术微电极的结构基于玻璃。阳极的经常的潜在的方法被采用在微电极的表面上作为 electroactive 物质扔锰氧化物。周期的 voltammetry 和... 以便增加电极表面区域并且提高费用存储能力,我们学习微电镀物品制作三维的高方面比率的机械系统技术微电极的结构基于玻璃。阳极的经常的潜在的方法被采用在微电极的表面上作为 electroactive 物质扔锰氧化物。周期的 voltammetry 和经常的当前的费用分泌物方法两个都被用来电气化学的性能测试准备电极,与没有为比较的结构的一个二维的电极。试验性的结果证明那三维的电极结构能有效地提高费用存储能力。在 1.0 mA/cm2 费用分泌物密度,三维的电极显示出 17.88 mF/cm2 的一个电容,比二维的电极高七倍。 展开更多
关键词 电化学特性 超级电容器 三维电极 锰氧化物 微电极 微机电系统技术 制备 微型
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Low temperature Si/Si wafer direct bonding using a plasma activated method 被引量:4
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作者 Dong-ling LI Zheng-guo SHANG +1 位作者 Sheng-qiang WANG zhi-yu wen 《Journal of Zhejiang University-Science C(Computers and Electronics)》 SCIE EI 2013年第4期244-251,共8页
Manufacturing and integration of micro-electro-mechanical systems(MEMS) devices and integrated circuits(ICs) by wafer bonding often generate problems caused by thermal properties of materials.This paper presents a low... Manufacturing and integration of micro-electro-mechanical systems(MEMS) devices and integrated circuits(ICs) by wafer bonding often generate problems caused by thermal properties of materials.This paper presents a low temperature wafer direct bonding process assisted by O2 plasma.Silicon wafers were treated with wet chemical cleaning and subsequently activated by O2 plasma in the etch element of a sputtering system.Then,two wafers were brought into contact in the bonder followed by annealing in N2 atmosphere for several hours.An infrared imaging system was used to detect bonding defects and a razor blade test was carried out to determine surface energy.The bonding yield reaches 90%-95% and the achieved surface energy is 1.76 J/m2 when the bonded wafers are annealed at 350 ℃ in N2 atmosphere for 2 h.Void formation was systematically observed and elimination methods were proposed.The size and density of voids greatly depend on the annealing temperature.Short O2 plasma treatment for 60 s can alleviate void formation and enhance surface energy.A pulling test reveals that the bonding strength is more than 11.0 MPa.This low temperature wafer direct bonding process provides an efficient and reliable method for 3D integration,system on chip,and MEMS packaging. 展开更多
关键词 晶片直接键合 等离子体处理 硅晶片 低温 活化法 MEMS封装 微机电系统 集成电路
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An intelligent electronic capsule system for automated detection of gastrointestinal bleeding 被引量:2
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作者 Hong-ying LIU Gang WANG +4 位作者 Kang WEI Xi-tian PI Lan ZHU Xiao-lin ZHENG zhi-yu wen 《Journal of Zhejiang University-Science B(Biomedicine & Biotechnology)》 SCIE CAS CSCD 2010年第12期937-943,共7页
In clinical practice,examination of the hemorrhagic spot (HS) remains difficult.In this paper,we describe a remote controlled capsule (RCC) micro-system with an automated,color-based sensor to identify and localize th... In clinical practice,examination of the hemorrhagic spot (HS) remains difficult.In this paper,we describe a remote controlled capsule (RCC) micro-system with an automated,color-based sensor to identify and localize the HS of the gastrointestinal (GI) tract.In vitro testing of the detecting sensor demonstrated that it was capable of discriminating mimetic intestinal fluid (MIF) with and without the hemoglobin (Hb) when the concentration of Hb in MIF was above 0.05 g/ml.Therefore,this RCC system is able to detect the relatively accurate location of the HS in the GI tract. 展开更多
关键词 聪明的囊 肠的流血 颜色传感器 生物医学的微机电的系统(BioMEMS )
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