Natural Graphene Plasmonic Nano-Resonators for Highly Active Surface-Enhanced Raman Scattering Platforms

Highly sensitive and uniform three-dimensional(3D)hybrid heterogeneous structures for use in surface-enhanced Raman scattering(SERS)experiments were fabricated by sequentially decorating high-quality,ultra-clean,graphene quantum dots(GQDs)and Ag nanoparticles(Ag-NPs)onto 3D-graphene.Finite-difference time-domain calculations and scanning Kelvin probe microscopy were used to verify that the Ag-NPs/GQDs/3D-graphene system facilitates substantial electromagnetic enhancement(due to the occurrence of two kinds of"gaps"between the Ag-NPs that form 3D"hot spots")and additional chemical enhancement(in detecting someπ-conjugated molecules).The SERS mechanism was explored in further detail via experimental analysis and confirmed by performing theoretical calculations.The large surface area of the 3D substrate(due to the large specific surface areas of the GQDs and 3D-graphene)results in a better enrichment effect which helps produce lower detection limits.In particular,the detection limits obtained using the Ag-NPs/GQDs/3D-graphene platform can reach 10^(-11)M for rhodamine 6G,10^(-10)M for methylene blue and dopamine,and 10^(-7)M for tetramethylthiuram disulfide and methyl parathion in apple juice(these are superior to most of the results reported using graphene-based SERS substrates).In summary,the 3D-platform Ag-NPs/GQDs/3D-graphene/Si shows outstanding SERS performance.It therefore has excellent application prospects in biochemical molecular detection and food safety monitoring.

轻掺杂硅基神经电极的光噪声消减

硅基神经电极是记录神经细胞放电活动的一种实用工具。使用标准的集成电路加工技术,在宽度仅为70μm的单个硅基针上能排布上千个电极记录位点。光遗传学的发展使控制神经元活动更加精确,通过在给予光刺激的同时记录神经元的电活动,可以获取更丰富的脑活动信息。当使用黄光或蓝光刺激神经元时,光子的能量大于硅衬底的禁带宽度,价带电子被激发到导带,从而生成电子-空穴对。因此,在光刺激下使用硅基神经电极时,硅基板中的光生载流子将严重干扰电极的信噪比。为满足在光刺激同时记录电活动的应用需求,必须减少光对硅基神经电极的噪声干扰。传统的降噪方法是使用重掺杂硅作为衬底材料,通过增加杂质浓度来降低载流子寿命,从而降低硅电极的光学噪声。但是,重掺杂的硅衬底比轻掺杂的硅衬底具有更多的晶格缺陷,这使得硅基电极更加脆弱,并且该方法与标准的集成电路加工技术不兼容。通过分析在轻掺杂硅衬底上制造电极的光致噪声机理,我们发现由光激发产生的载流子的不均匀分布将使轻掺杂硅衬底极化。由光致极化引起的电势将影响在其上制造的电极。将轻掺杂硅衬底金属化和接地将有效降低极化电位。使用这种方法,由光诱发的噪声幅度将下降到原始值的0.87%。为了确保神经元的放电率,将光刺激脉冲频率选择为20 Hz。在1 mW·mm^(-2)的光照下,电极的背景噪声可控制在45μV以下,可以满足一般光遗传学应用的需求。经过上述方式改造后的轻掺杂硅衬底将满足光遗传学应用对神经探针的要求。与传统的通过重掺杂整个衬底降低光噪声方法不同,该方法与标准的集成电路加工技术兼容,为利用标准集成电路加工技术制备高密度、高通量硅电极提供了噪声消除方法。

Novel function of perforin in negatively regulating CD4^＋ T cell activation by affecting calcium signaling

Perforin 是主要从事调停的形成毛孔的蛋白质目标 T 房间死亡并且被细胞毒素的 T 淋巴细胞(CTL ) 和自然漂亮房间采用。然而，它是否也在常规 CD4+ T 房间功能起一个作用，仍然保持不清楚。这里，我们报导那在 perforin 缺乏(PKO ) 老鼠， CD4+ T 房间是响应 T 的 hyperproliferative 房间受体(TCR ) 刺激。hyperproliferation 的这个特征被改进在房间分割并且在 IL-2 分泌物伴随。看起来， perforin 缺乏不在胸腺怒气和淋巴节点影响 T 房间开发。在 vivo， perforin 缺乏导致增加的抗原特定的 T 房间增长和抗体生产。而且， PKO 老鼠更产生试验性的自体免疫的眼色素层炎。探讨分子的机制，我们发现在 TCR 刺激以后，从 PKO 老鼠的 CD4+ T 房间显示增加的细胞内部的钙流动并且随后提高抄写因素 NFAT1 的激活。我们的结果显示 perforin 在由影响 TCR 依赖的 Ca2+ 发信号调整 CD4+ T 房间激活和有免疫力的反应起一个否定作用。

Distributed implantation of a flexible microelectrode array for neural recording

Flexible multichannel electrode arrays(fMEAs)with multiple flaments can be flexibly implanted in various patterns.It is necessary to develop a method for implanting the fMEA in different locations and at various depths based on the recording demands.This study proposed a strategy for reducing the microelectrode volume with integrated packaging.An implantation system was developed specifically for semiautomatic distributed implantation.The feasibility and convenience of the fMEA and implantation platform were verified in rodents.The acute and chronic recording results provied the effectiveness of the packaging and implantation methods.These methods could provide a novel strategy for developing fMEAs with more flaments and recording sites to measure functional interactions across multiple brain regions.

Enhanced thermal conductivity of epoxy composites with core-shell SiC@SiO_(2) nanowires

Electronic packaging materials and thermal interface materials(TIMs)are widely used in thermal management.In this study,the epoxy composites with core-shell structure SiC@SiO_(2) nanowires(SiC@SiO_(2) NWs)as fillers could effectively enhance the thermal conductivity of epoxy composites.The unique structure of fillers results in a high thermal conductivity of epoxy composites,which is attributed to good interfacial compatibility epoxy matrix and bridging connections of SiC@SiO_(2) NWs.From neat epoxy to 2.5 wt%loading of SiC@SiO_(2) NWs,the thermal conductivity is significantly increased from 0.218 to 0.391 W m^(−1) K^(−1),increased by 79.4%.In addition,the composite with 2.5 wt%filler possess lower coefficient of thermal expansion and better thermal stability than that of neat epoxy.All these outstanding properties imply that epoxy/SiC@SiO_(2) NWs composites could be the ideal candidate for TIM.

A Spiral Graphene Framework Containing Highly Ordered Graphene Microtubes for Polymer Composites with Superior Through-Plane Thermal Conductivity

As the power density of electronic devices increases,there has been an urgent demand to develop highly conductive polymer composites to address the accompanying thermal management issues.Due to the ultra-high intrinsic thermal conductivity,graphene is considered a very promising filler to improve the thermal conductivity of polymers.However,graphene-based polymer composites prepared by the conventional mixing method generally have limited thermal conductivity,even under high graphene loading,due to the failure to construct efficient heat transfer pathways in the polymer matrix.Here,a spiral graphene framework(SGF)containing continuous and highly ordered graphene microtubes was developed based on a modified CVD method.After embedding into the epoxy(EP)matrix,the graphene microtubes can act as efficient heat pathways,endowing the SGF/EP composites with a high through-plane thermal conductivity of 1.35 W·m^(-1)·K^(-1) at an ultralow graphene loading of 0.86 wt%.This result gives a thermal conductivity enhancement per 1 wt%filler loading of 710%,significantly outperforming various graphene structures as fillers.In addition,we demonstrated the practical application of the SGF/EP composite as a thermal interface material for efficient thermal man-agement of the light-emitting diode(LED).