Hydraulic technology with smaller sizes and higher reliability trends,including fault prediction and intelligent control,requires high-performance temperature and pressure-integrated sensors.Current designs rely on pl...Hydraulic technology with smaller sizes and higher reliability trends,including fault prediction and intelligent control,requires high-performance temperature and pressure-integrated sensors.Current designs rely on planar wafer-or chip-level integration,which is limited by pressure range,chip size,and low reliability.We propose a small-size temperature/high-pressure integrated sensor via the flip-chip technique.The pressure and temperature units are arranged vertically,and the sensing signals of the two units are integrated into one plane through silicon vias and gold–gold bonding,reducing the lateral size and improving the efficiency of signal transmission.The flip-chip technique ensures a reliable electrical connection.A square diaphragm with rounded corners is designed and optimised with simulation to sense high pressure based on the piezoresistive effect.The temperature sensing unit with a thin-film platinum resistor measures temperature and provides back-end high-precision compensation,which will improve the precision of the pressure unit.The integrated chip is fabricated by MEMS technology and packaged to fabricate the extremely small integrated sensor.The integrated sensor is characterised,and the pressure sensor exhibits a sensitivity and sensitivity drift of 7.97mV/MPa and−0.19%FS in the range of 0–20 MPa and−40 to 120℃.The linearity,hysteresis,repeatability,accuracy,basic error,and zero-time drift are 0.16%FS,0.04%FS,0.06%FS,0.18%FS,±0.23%FS and 0.04%FS,respectively.The measurement error of the temperature sensor and temperature coefficient of resistance is less than±1°C and 3142.997 ppm/℃,respectively.The integrated sensor has broad applicability in fault diagnosis and safety monitoring of high-end equipment such as automobile detection,industrial equipment,and oil drilling platforms.展开更多
In the precipitation-hardened Ni-based superalloy,typified by ATI 718 Plus,the nano-scaleγandγphase in duplet or triple coprecipitate morphology can provide superior high-temperature strength.Thus,it is of great sen...In the precipitation-hardened Ni-based superalloy,typified by ATI 718 Plus,the nano-scaleγandγphase in duplet or triple coprecipitate morphology can provide superior high-temperature strength.Thus,it is of great sense to study the evolution ofγ’/γ’’coprecipitate during long term service at elevated temperature.In this study,the new-typeγ’/γ’’coprecipitates with a sandwich or compact configuration were found firstly in wrought ATI 718 Plus superalloy during long term thermal exposure at 705℃.These co-structure of theγ’/γ’’precipitates evidently inhibit the coarsening ofγ’phase.The increase of thermal exposure time evidently leads to the increase of the volume fraction ofγ’/γ’’coprecipitate and transformation of sandwich-typeγ’/γ’’coprecipitate to compact-typeγ’/γ’’coprecipitate,which is characterized asγphase precipitate at several faces of theγphase.The main evolution mechanism ofγ’/γ’’coprecipitates is element segregation,especially the composition variations of Al+Ti and Nb and their ratio of Al+Ti/Nb.In addition,the interfacial energy betweenγ’’phase andγmatrix also plays a key role on theγ’/γ’’coprecipitates evolution.The calculated results show that the longer thermal exposure time leads to the higher interfacial energy,which is beneficial for nucleation and precipitation ofγ’’phase on the faces ofγ’phase.展开更多
基金supported in part by the National Natural Science Foundation of China(52105589 and U1909221)in part by the China Postdoctoral Science Foundation(2021M692590)+2 种基金in part by the Beijing Advanced Innovation Center for Intelligent Robots and Systems(2019IRS08)in part by the Fundamental Research Funds for the Central Universities(China)(xzy012021009)in part by the State Key Laboratory of Robotics and Systems(HIT)(SKLRS2021KF17)。
基金supported in part by the National Key Research&Development(R&D)Plan(2022YFB3205800)the National Natural Science Foundation of China(52305618).
文摘Hydraulic technology with smaller sizes and higher reliability trends,including fault prediction and intelligent control,requires high-performance temperature and pressure-integrated sensors.Current designs rely on planar wafer-or chip-level integration,which is limited by pressure range,chip size,and low reliability.We propose a small-size temperature/high-pressure integrated sensor via the flip-chip technique.The pressure and temperature units are arranged vertically,and the sensing signals of the two units are integrated into one plane through silicon vias and gold–gold bonding,reducing the lateral size and improving the efficiency of signal transmission.The flip-chip technique ensures a reliable electrical connection.A square diaphragm with rounded corners is designed and optimised with simulation to sense high pressure based on the piezoresistive effect.The temperature sensing unit with a thin-film platinum resistor measures temperature and provides back-end high-precision compensation,which will improve the precision of the pressure unit.The integrated chip is fabricated by MEMS technology and packaged to fabricate the extremely small integrated sensor.The integrated sensor is characterised,and the pressure sensor exhibits a sensitivity and sensitivity drift of 7.97mV/MPa and−0.19%FS in the range of 0–20 MPa and−40 to 120℃.The linearity,hysteresis,repeatability,accuracy,basic error,and zero-time drift are 0.16%FS,0.04%FS,0.06%FS,0.18%FS,±0.23%FS and 0.04%FS,respectively.The measurement error of the temperature sensor and temperature coefficient of resistance is less than±1°C and 3142.997 ppm/℃,respectively.The integrated sensor has broad applicability in fault diagnosis and safety monitoring of high-end equipment such as automobile detection,industrial equipment,and oil drilling platforms.
基金the National Natural Science Foundation of China(Nos.52034004,51974201 and 52122409)for grant and financial support。
文摘In the precipitation-hardened Ni-based superalloy,typified by ATI 718 Plus,the nano-scaleγandγphase in duplet or triple coprecipitate morphology can provide superior high-temperature strength.Thus,it is of great sense to study the evolution ofγ’/γ’’coprecipitate during long term service at elevated temperature.In this study,the new-typeγ’/γ’’coprecipitates with a sandwich or compact configuration were found firstly in wrought ATI 718 Plus superalloy during long term thermal exposure at 705℃.These co-structure of theγ’/γ’’precipitates evidently inhibit the coarsening ofγ’phase.The increase of thermal exposure time evidently leads to the increase of the volume fraction ofγ’/γ’’coprecipitate and transformation of sandwich-typeγ’/γ’’coprecipitate to compact-typeγ’/γ’’coprecipitate,which is characterized asγphase precipitate at several faces of theγphase.The main evolution mechanism ofγ’/γ’’coprecipitates is element segregation,especially the composition variations of Al+Ti and Nb and their ratio of Al+Ti/Nb.In addition,the interfacial energy betweenγ’’phase andγmatrix also plays a key role on theγ’/γ’’coprecipitates evolution.The calculated results show that the longer thermal exposure time leads to the higher interfacial energy,which is beneficial for nucleation and precipitation ofγ’’phase on the faces ofγ’phase.
