Gallium-based liquid metal,as a high-performance thermal interface material,can improve the performance and service life of electronic equipment.This study focuses on the use of diamond as a thermal conductivity enhan...Gallium-based liquid metal,as a high-performance thermal interface material,can improve the performance and service life of electronic equipment.This study focuses on the use of diamond as a thermal conductivity enhancement phase to improve the thermal conductivity of GaInSn liquid metal and avoid the overflow of liquid metal during application.In this study,diamond/GaInSn composites were prepared by an ultrasonic-assisted wetting method.The thermal conductivity and contact thermal resistance of diamond/GaInSn composites were characterized by the transient method.The morphology and thermal conductivity of diamond/GalnSn composites were investigated when diamond particles of different diameters were added to GaInSn liquid metal.The addition of large-sized diamond particles can effectively improve the thermal conductivity of thermal interface materials (TIMs) but willcause liquid metal to pump out.展开更多
基金financially supported by Beijing Natural Science Foundation (No.2224105)the Science and Technology Innovation Fund of GRINM (No.12366)。
文摘Gallium-based liquid metal,as a high-performance thermal interface material,can improve the performance and service life of electronic equipment.This study focuses on the use of diamond as a thermal conductivity enhancement phase to improve the thermal conductivity of GaInSn liquid metal and avoid the overflow of liquid metal during application.In this study,diamond/GaInSn composites were prepared by an ultrasonic-assisted wetting method.The thermal conductivity and contact thermal resistance of diamond/GaInSn composites were characterized by the transient method.The morphology and thermal conductivity of diamond/GalnSn composites were investigated when diamond particles of different diameters were added to GaInSn liquid metal.The addition of large-sized diamond particles can effectively improve the thermal conductivity of thermal interface materials (TIMs) but willcause liquid metal to pump out.
