To explore the possibility of using solid-liquid phase change cooling to those periodically or intermit-tently operated electronic equipment, a detail of experimeatal study of time-dependent melting heattransfer in a ...To explore the possibility of using solid-liquid phase change cooling to those periodically or intermit-tently operated electronic equipment, a detail of experimeatal study of time-dependent melting heattransfer in a rectangular encforure with three discrete protruding heat sources is presented. A seriesof experimntal measurement in an enclosure with phase change materials (PCM) of n-octadecaneheated by three discrete Protruding heat sources at a constant rate on one of its vertical wall has beendescribed. The opposite wall of the enclosure is cooled at a constant temperature and all other wallsof the enclosure are insulated. The time-dependent solid-liquid shapes of the interface during meltingprocess, the variation of surface temperature and the effects of subcooling are investigated. An empirical correlation predicting the relationship between tbe liquid phase fraction and subcooling is given.展开更多
文摘To explore the possibility of using solid-liquid phase change cooling to those periodically or intermit-tently operated electronic equipment, a detail of experimeatal study of time-dependent melting heattransfer in a rectangular encforure with three discrete protruding heat sources is presented. A seriesof experimntal measurement in an enclosure with phase change materials (PCM) of n-octadecaneheated by three discrete Protruding heat sources at a constant rate on one of its vertical wall has beendescribed. The opposite wall of the enclosure is cooled at a constant temperature and all other wallsof the enclosure are insulated. The time-dependent solid-liquid shapes of the interface during meltingprocess, the variation of surface temperature and the effects of subcooling are investigated. An empirical correlation predicting the relationship between tbe liquid phase fraction and subcooling is given.
