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EFFECT OF RESIDUAL STRESS ON THE MARTENSITIC TRANSFORMATION OF SPUTTER-DEPOSITED SMA THIN FILMS 被引量:3
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作者 L.Wang,D.Xu and B.C.Caiinformation Storage Research Center, Shanghai Jiao Tong University, Shanghai 200030, China Manuscript received 14 September 2001 in revised form 27 november 2001 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2002年第4期391-395,共5页
TiNi thin films were sputter-deposited on circular single-crystal silicon substrates un-der various sputtering parameters. The crystal structure and residual stress of the as-deposited films were determined by X-ray d... TiNi thin films were sputter-deposited on circular single-crystal silicon substrates un-der various sputtering parameters. The crystal structure and residual stress of the as-deposited films were determined by X-ray diffraction and substrate-curvature method. The phenomenon of stress-suppressed martensitic transformation was observed. R is considered that the residual stresses in SMA thin films based on circular substrates act as balanced biaxial tensile stresses. The status of equilibrant delays the align-ment of self-accommodated variants and the volume shrinkage during the martensitic transformation. 展开更多
关键词 martensitic transformation residual stress TINI thin film shape memory alloy
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