期刊文献+
共找到2篇文章
< 1 >
每页显示 20 50 100
SiC(0001)面和(000-1)面CMP抛光对比研究 被引量:3
1
作者 潘章杰 冯玢 +1 位作者 王磊 郝建民 《电子工业专用设备》 2013年第4期19-23,共5页
研究了SiC衬底(0001)面和(000-1)面不同的CMP抛光特性。分别采用pH值为10.38和1.11的改性硅溶胶抛光液对SiC衬底的(0001)Si面和(000-1)C面进行对比抛光实验。使用精密天平测量晶片抛光前后的质量,计算出CMP抛光工艺的材料去除速率。并... 研究了SiC衬底(0001)面和(000-1)面不同的CMP抛光特性。分别采用pH值为10.38和1.11的改性硅溶胶抛光液对SiC衬底的(0001)Si面和(000-1)C面进行对比抛光实验。使用精密天平测量晶片抛光前后的质量,计算出CMP抛光工艺的材料去除速率。并使用强光灯、微分干涉显微镜和原子力显微镜检测晶片表面质量。发现采用酸性抛光液和碱性抛光液进行抛光,均有VC>VSi;而对于(0001)Si面,有VSi酸>VSi碱;对于(000-1)C面,有VC酸>VC碱。该结论对于探索最佳碳化硅的CMP抛光工艺具有较高价值。 展开更多
关键词 碳化硅 (0001)si (000 1)C 化学机械抛光(CMP) 材料去除速率 粗糙度
下载PDF
Density Functional Theory Study for Adsorption of Oxygen and Water Molecules on 6H-SiC(0001) Surface 被引量:2
2
作者 Chun-he Fu Hui-li Lu Shao-rui Sun 《Chinese Journal of Chemical Physics》 SCIE CAS CSCD 2019年第4期451-456,I0002,I0003,共8页
6H-SiC is an important semiconductor material. The 6H-SiC wafer is always exposed to a high-humidity environment and the effect from the absorbed water molecule and some relative adsorbates is not negligible. Here, th... 6H-SiC is an important semiconductor material. The 6H-SiC wafer is always exposed to a high-humidity environment and the effect from the absorbed water molecule and some relative adsorbates is not negligible. Here, the oxygen and water molecules absorbed on the 6H-SiC(0001) surface and the dissociation process were studied with density functional theory. On the 6H-SiC(0001) surface, absorbed O2 is spontaneously dissociated into O*, which is absorbed on a hollow site, and further transforms the 6H-SiC(0001) surface into SiO2. The absorbed H2O is spontaneously broken into OH*and H*, which are both absorbed on the top of the Si atom, and OH* is further reversibly transformed into O* and H*. The H* could saturate the dangling Si bond and change the absorption type of O*, which could stabilize the 6H-SiC(0001) surface and prevent it from transforming into SiO2. 展开更多
关键词 6H-siC(0001) surface H2O absorption Dangling si bond Stability Density functional theory
下载PDF
上一页 1 下一页 到第
使用帮助 返回顶部