In this work,the GaN p-MISFET with LPCVD-SiN_(x) is studied as a gate dielectric to improve device performance.By changing the Si/N stoichiometry of SiN_(x),it is found that the channel hole mobility can be effectivel...In this work,the GaN p-MISFET with LPCVD-SiN_(x) is studied as a gate dielectric to improve device performance.By changing the Si/N stoichiometry of SiN_(x),it is found that the channel hole mobility can be effectively enhanced with Si-rich SiN_(x) gate dielectric,which leads to a respectably improved drive current of GaN p-FET.The record high channel mobility of 19.4 cm2/(V∙s)was achieved in the device featuring an Enhancement-mode channel.Benefiting from the significantly improved channel mobility,the fabricated E-mode GaN p-MISFET is capable of delivering a decent-high current of 1.6 mA/mm,while simultaneously featuring a negative threshold-voltage(VTH)of–2.3 V(defining at a stringent criteria of 10μA/mm).The device also exhibits a well pinch-off at 0 V with low leakage current of 1 nA/mm.This suggests that a decent E-mode operation of the fabricated p-FET is obtained.In addition,the VTH shows excellent stability,while the threshold-voltage hysteresisΔVTH is as small as 0.1 V for a gate voltage swing up to–10 V,which is among the best results reported in the literature.The results indicate that optimizing the Si/N stoichiometry of LPCVD-SiN_(x) is a promising approach to improve the device performance of GaN p-MISFET.展开更多
报道了在采用 L PCVD法制备的富硅 Si Nx 膜中发现的部分晶化的硅镶嵌微结构 .视生长条件和工艺不同 ,该结构的尺度范围从数十到几百纳米不等 .利用不同条件下生长的 Si Nx 膜的应力测试结果和透射电镜观测结果 ,分析了富硅型 Si Nx 膜...报道了在采用 L PCVD法制备的富硅 Si Nx 膜中发现的部分晶化的硅镶嵌微结构 .视生长条件和工艺不同 ,该结构的尺度范围从数十到几百纳米不等 .利用不同条件下生长的 Si Nx 膜的应力测试结果和透射电镜观测结果 ,分析了富硅型 Si Nx 膜的微结构的成因及其与膜内应力之间的相互影响 ,对富硅型 Si Nx 膜的 L PCVD生长工艺进行优化 ,大大降低了膜的张应力 ,无支撑成膜面积可达 4 0 m m× 4 0 mm.通过这一研究结果 ,实现了 L PCVD可控制生长确定张应力的 Si Nx展开更多
Single crystalline 3C-SiC epitaxial layers are grown on φ 50mm Si wafers by a new resistively heated CVD/LPCVD system,using SiH_4,C_2H_4 and H_2 as gas precursors.X-ray diffraction and Raman scattering measurements a...Single crystalline 3C-SiC epitaxial layers are grown on φ 50mm Si wafers by a new resistively heated CVD/LPCVD system,using SiH_4,C_2H_4 and H_2 as gas precursors.X-ray diffraction and Raman scattering measurements are used to investigate the crystallinity of the grown films.Electrical properties of the epitaxial 3C-SiC layers with thickness of 1～3μm are measured by Van der Pauw method.The improved Hall mobility reaches the highest value of 470cm 2/(V·s) at the carrier concentration of 7.7×10 17 cm -3 .展开更多
基金This work was supported in part by the Natural Science Foundation of China under Grant 62174019in part by the Guangdong Basic and Applied Basic Research Foundation China under Grant 2021B1515140039in part by the Zhuhai Industry-University Research Cooperation Project under Grant ZH22017001210041PWC.
文摘In this work,the GaN p-MISFET with LPCVD-SiN_(x) is studied as a gate dielectric to improve device performance.By changing the Si/N stoichiometry of SiN_(x),it is found that the channel hole mobility can be effectively enhanced with Si-rich SiN_(x) gate dielectric,which leads to a respectably improved drive current of GaN p-FET.The record high channel mobility of 19.4 cm2/(V∙s)was achieved in the device featuring an Enhancement-mode channel.Benefiting from the significantly improved channel mobility,the fabricated E-mode GaN p-MISFET is capable of delivering a decent-high current of 1.6 mA/mm,while simultaneously featuring a negative threshold-voltage(VTH)of–2.3 V(defining at a stringent criteria of 10μA/mm).The device also exhibits a well pinch-off at 0 V with low leakage current of 1 nA/mm.This suggests that a decent E-mode operation of the fabricated p-FET is obtained.In addition,the VTH shows excellent stability,while the threshold-voltage hysteresisΔVTH is as small as 0.1 V for a gate voltage swing up to–10 V,which is among the best results reported in the literature.The results indicate that optimizing the Si/N stoichiometry of LPCVD-SiN_(x) is a promising approach to improve the device performance of GaN p-MISFET.
文摘报道了在采用 L PCVD法制备的富硅 Si Nx 膜中发现的部分晶化的硅镶嵌微结构 .视生长条件和工艺不同 ,该结构的尺度范围从数十到几百纳米不等 .利用不同条件下生长的 Si Nx 膜的应力测试结果和透射电镜观测结果 ,分析了富硅型 Si Nx 膜的微结构的成因及其与膜内应力之间的相互影响 ,对富硅型 Si Nx 膜的 L PCVD生长工艺进行优化 ,大大降低了膜的张应力 ,无支撑成膜面积可达 4 0 m m× 4 0 mm.通过这一研究结果 ,实现了 L PCVD可控制生长确定张应力的 Si Nx
文摘Single crystalline 3C-SiC epitaxial layers are grown on φ 50mm Si wafers by a new resistively heated CVD/LPCVD system,using SiH_4,C_2H_4 and H_2 as gas precursors.X-ray diffraction and Raman scattering measurements are used to investigate the crystallinity of the grown films.Electrical properties of the epitaxial 3C-SiC layers with thickness of 1～3μm are measured by Van der Pauw method.The improved Hall mobility reaches the highest value of 470cm 2/(V·s) at the carrier concentration of 7.7×10 17 cm -3 .
