An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct ch...An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.展开更多
介绍了一种X波段四通道T/R组件的设计思路和实现方法。针对组件工作频率高、工作频段宽、通道数多、功能复杂、裸芯片多、重量要求严格等难点,组件采用低温共烧陶瓷设计、MCM设计、新型硅铝盒体材料设计等先进技术,成功研制出了低噪声...介绍了一种X波段四通道T/R组件的设计思路和实现方法。针对组件工作频率高、工作频段宽、通道数多、功能复杂、裸芯片多、重量要求严格等难点,组件采用低温共烧陶瓷设计、MCM设计、新型硅铝盒体材料设计等先进技术,成功研制出了低噪声、轻质量、功能齐全的小型化四通道T/R组件,该组件工作带宽在X波段达到2 GHz,发射功率达到＋41 d Bm,发射效率达到32%,接收噪声系数达到2.5~2.8 d B,移相精度达到20（RMS）,整体重量为96 g。组件已实现批量化生产。展开更多
随着电子封装微型化、多功能化的发展,三维封装已成为封装技术的主要发展方向,叠层CSP封装具有封装密度高、互连性能好等特性,是实现三维封装的重要技术。针对超薄芯片传统叠层CSP封装过程中容易产生圆片翘曲、金线键合过程中容易出现O...随着电子封装微型化、多功能化的发展,三维封装已成为封装技术的主要发展方向,叠层CSP封装具有封装密度高、互连性能好等特性,是实现三维封装的重要技术。针对超薄芯片传统叠层CSP封装过程中容易产生圆片翘曲、金线键合过程中容易出现OBOP不良、以及线弧(wire loop)的CPK值达不到工艺要求等问题,文中简要介绍了芯片减薄方法对圆片翘曲的影响,利用有限元(FEA)的方法进行芯片减薄后对悬空功能芯片金线键合(Wirebond)的影响进行分析,Film on Wire(FOW)的贴片(Die Attach)方法在解决悬空功能芯片金线键合中的应用,以及FOW贴片方式对叠层CSP封装流程的简化。采用FOW贴片技术可以达到30%的成本节约,具有很好的经济效益。展开更多
The nano-Ag paste consisted of Ag nanoparticles and organic solvents.These organics would be removed by evaporation or decomposition during sintering.When the sintering temperature was 300℃,the resistivity of sintere...The nano-Ag paste consisted of Ag nanoparticles and organic solvents.These organics would be removed by evaporation or decomposition during sintering.When the sintering temperature was 300℃,the resistivity of sintered bulk was 8.35×10^-6Ωcm,and its thermal conductivity was 247 W m^-1 K^-1.The Si/SiC chips and direct bonding copper(DBC)substrates could be bonded by this nano-Ag paste at low temperature.The bonding interface,sintered microstructure and shear strength of Si/SiC chip attachment were investigated by scanning electron microscopy,transmission electron microscopy and shear tests.Results showed that the sintered Ag layer was porous structure and tightly adhered to the electroless nickel immersion gold surface of DBC substrate and formed the continuous Ag–Au interdiffusion layer.The shear strength of Si and SiC chip attachments was higher than 35 MPa when the sintering pressure was 10 MPa.The fracture occurred inside the sintered Ag layer,and the fracture surface had obvious plastic deformation.展开更多
基金supported by the National Natural Science Foundation of China(No.61076071)
文摘An advanced direct chip attaching packaged two-dimensional ceramic thermal wind sensor is studied. The thermal wind sensor chip is fabricated by metal lift-off processes on the ceramic substrate. An advanced direct chip attaching （DCA） packaging is adopted and this new packaged method simplifies the processes of packaging further. Simulations of the advanced DCA packaged sensor based on computational fluid dynamics （CFD） model show the sensor can detect wind speed and direction effectively. The wind tunnel testing results show the advanced DCA packaged sensor can detect the wind direction from 0° to 360° and wind speed from 0 to 20 m/s with the error less than 0.5 m/s. The nonlinear fitting based least square method in Matlab is used to analyze the performance of the sensor.
文摘介绍了一种X波段四通道T/R组件的设计思路和实现方法。针对组件工作频率高、工作频段宽、通道数多、功能复杂、裸芯片多、重量要求严格等难点,组件采用低温共烧陶瓷设计、MCM设计、新型硅铝盒体材料设计等先进技术,成功研制出了低噪声、轻质量、功能齐全的小型化四通道T/R组件,该组件工作带宽在X波段达到2 GHz,发射功率达到＋41 d Bm,发射效率达到32%,接收噪声系数达到2.5~2.8 d B,移相精度达到20（RMS）,整体重量为96 g。组件已实现批量化生产。
文摘随着电子封装微型化、多功能化的发展,三维封装已成为封装技术的主要发展方向,叠层CSP封装具有封装密度高、互连性能好等特性,是实现三维封装的重要技术。针对超薄芯片传统叠层CSP封装过程中容易产生圆片翘曲、金线键合过程中容易出现OBOP不良、以及线弧(wire loop)的CPK值达不到工艺要求等问题,文中简要介绍了芯片减薄方法对圆片翘曲的影响,利用有限元(FEA)的方法进行芯片减薄后对悬空功能芯片金线键合(Wirebond)的影响进行分析,Film on Wire(FOW)的贴片(Die Attach)方法在解决悬空功能芯片金线键合中的应用,以及FOW贴片方式对叠层CSP封装流程的简化。采用FOW贴片技术可以达到30%的成本节约,具有很好的经济效益。
基金financially supported by the National Key Research and Development Program of China(No.2017YFB1104900)the China Postdoctoral Science Foundation(No.2019M650425)。
文摘The nano-Ag paste consisted of Ag nanoparticles and organic solvents.These organics would be removed by evaporation or decomposition during sintering.When the sintering temperature was 300℃,the resistivity of sintered bulk was 8.35×10^-6Ωcm,and its thermal conductivity was 247 W m^-1 K^-1.The Si/SiC chips and direct bonding copper(DBC)substrates could be bonded by this nano-Ag paste at low temperature.The bonding interface,sintered microstructure and shear strength of Si/SiC chip attachment were investigated by scanning electron microscopy,transmission electron microscopy and shear tests.Results showed that the sintered Ag layer was porous structure and tightly adhered to the electroless nickel immersion gold surface of DBC substrate and formed the continuous Ag–Au interdiffusion layer.The shear strength of Si and SiC chip attachments was higher than 35 MPa when the sintering pressure was 10 MPa.The fracture occurred inside the sintered Ag layer,and the fracture surface had obvious plastic deformation.
