In the paper, the finite element method (FEM) , engineering calculationmethod (ECM) and empirical fromular method (EFM) were used to calculatethe strengths of fillet joints in an Al-alloy vehicle. The results obtained...In the paper, the finite element method (FEM) , engineering calculationmethod (ECM) and empirical fromular method (EFM) were used to calculatethe strengths of fillet joints in an Al-alloy vehicle. The results obtained withdifferent calculation methods were analysed, and then each method wasreviewed and assessed. FEM is accurate, but complicated, and its results haveno strength reserve; ECM and EFM are simple and convenient, butconservative.展开更多
The geometry of solder joint in SMT is one of the important factors whichdetermine the solder joint reliability. In this study, a type of solder joint specimen has beendesigned and is subjected to thermal cycling to f...The geometry of solder joint in SMT is one of the important factors whichdetermine the solder joint reliability. In this study, a type of solder joint specimen has beendesigned and is subjected to thermal cycling to failure between -55 ℃ to +125 ℃ with a 36℃/min heating and cooling rate and 10 min temperature holding times. The solder jointgeometry is castellated and controlled with different solder fillet shape and stand off height.A statistical analysis of the scattered thermal cycle lives of solder joints by two parameterWeibull's probability density function has been carried out in this paper. The experimentalresults show that the more reliable solder joint geometry has flat or slight convex solderfillet with a stand off height larger than 0.1 mm. The results may be the recommendedguideline to design optimal solder joint geometry.展开更多
文摘In the paper, the finite element method (FEM) , engineering calculationmethod (ECM) and empirical fromular method (EFM) were used to calculatethe strengths of fillet joints in an Al-alloy vehicle. The results obtained withdifferent calculation methods were analysed, and then each method wasreviewed and assessed. FEM is accurate, but complicated, and its results haveno strength reserve; ECM and EFM are simple and convenient, butconservative.
文摘The geometry of solder joint in SMT is one of the important factors whichdetermine the solder joint reliability. In this study, a type of solder joint specimen has beendesigned and is subjected to thermal cycling to failure between -55 ℃ to +125 ℃ with a 36℃/min heating and cooling rate and 10 min temperature holding times. The solder jointgeometry is castellated and controlled with different solder fillet shape and stand off height.A statistical analysis of the scattered thermal cycle lives of solder joints by two parameterWeibull's probability density function has been carried out in this paper. The experimentalresults show that the more reliable solder joint geometry has flat or slight convex solderfillet with a stand off height larger than 0.1 mm. The results may be the recommendedguideline to design optimal solder joint geometry.