Impact of interconnections and renewable energy integration on the Philippine-Sabah Power Grid systems

This study presents a comprehensive impact analysis of the rotor angle stability of a proposed international connection between the Philippines and Sabah,Malaysia,as part of the Association of Southeast Asian Nations(ASEAN)Power Grid.This study focuses on modeling and evaluating the dynamic performance of the interconnected system,considering the high penetration of renewable sources.Power flow,small signal stability,and transient stability analyses were conducted to assess the ability of the proposed linked power system models to withstand small and large disturbances,utilizing the Power Systems Analysis Toolbox(PSAT)software in MATLAB.All components used in the model are documented in the PSAT library.Currently,there is a lack of publicly available studies regarding the implementation of this specific system.Additionally,the study investigates the behavior of a system with a high penetration of renewable energy sources.Based on the findings,this study concludes that a system is generally stable when interconnection is realized,given its appropriate location and dynamic component parameters.Furthermore,the critical eigenvalues of the system also exhibited improvement as the renewable energy sources were augmented.

The stability of a novel weakly alkaline slurry of copper interconnection CMP for GLSI

Chemical mechanical polishing（CMP） is one of the important machining procedures of multilayered copper interconnection for GLSI, meanwhile polishing slurry is a critical factor for realizing the high polishing performance such as high planarization efficiency, low surface roughness. The effect of slurry components such as abrasive（colloidal silica）, complexing agent（glycine）, inhibitor（BTA） and oxidizing agent（H_2O_2） on the stability of the novel weakly alkaline slurry of copper interconnection CMP for GLSI was investigated in this paper. First, the synergistic and competitive relationship of them in a peroxide-based weakly alkaline slurry during the copper CMP process was studied and the stability mechanism was put forward. Then 1 wt% colloidal silica, 2.5 wt% glycine,200 ppm BTA, 20 m L/L H_2O_2 had been selected as the appropriate concentration to prepare copper slurry, and using such slurry the copper blanket wafer was polished. From the variations of copper removal rate, root-mean square roughness（Sq） value with the setting time, it indicates that the working-life of the novel weakly alkaline slurry can reach more than 7 days, which satisfies the requirement of microelectronics further development.