A two-step transient liquid phase diffusion bonding process of T91 steels

In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9／ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend＇s strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.

Transient liquid phase bonding of TiC particulate reinforced magnesium metal matrix composite (TiC_p/AZ91D)

Microstructures and mechanical properties of transient liquid phase （TLP） bonded magnesium metal matrix composite （ MMC） joints using copper interlayer have been investigated. With an increase of bonding times from 5 min to 50 min at bonding temperature of 510 ℃ , the average concentration of copper in the bonded zone decreased, the microstructure in the zone changed from Cu, α-Mg and CuMg2 to α-Mg, CuMg2 and TiC, and mechanical properties of the joint increased. The shear strength of the joint bonded at 510 ℃ for 50 min reached 64 MPa due to the metallurgical bonding of the joint and improving its homogeneity of composition and microstructure. It is favorable to increase the bonding time for improving mechanical properties of TLP bonded magnesium MMC joint.

Dynamic study in partial transient liquid phase bonding of Si_3N_4

Dynamics in partial transient liquid phase bonding (PTLP bonding) of Si_3N_4 ceramic with Ti/Cu/Ti multi-interlayer was systematically studied through micro-analysis of joint interfaces. The results show that growth of reaction layer and isothermal solidification procession do at the same time. Growth of reaction layer and moving of isothermal solidification interface obey the parabolic law governed by the diffusion of participating elements during the PTLP bonding. Coordination of the above two dynamics process is done through time and temperature. When reaction layer thickness is suitable and isothermal solidification process is finished, the high bonding strength at room temperature and high temperature are obtained.

A study on the two-step transient liquid phase diffusion bonding of K640 superalloy

A new technology, the two-step transient liquid phase diffusion bonding （TLP-DB） technology for cobalt-based K640 superalloy, was investigated. The method consists of a short-time high temperature heating to melt interlayer followed by isothermal solidification of liquid phase at a lower temperature than that of the conventional TLP-DB. The result indicates that the two-step TLP-DB can reliably produce an ideal joint with uniform chemical composition, which is superior to the joint welded by conventional TLP-DB in microstructure and mechanical properties. Bonding parameters of new process are 1 250℃ for 0. 5 h and 1 180℃ for 3 h. The high-temperature tensile strength of the joint by two-step TLP-DB reaches 74% of that of the base material on an equal basis, but the high-temperature tensile strength of the joint by conventional TLP-DB is only 58% of that of the base material.

Features of microstructure and fracture in the transient liquid phase bonded aluminium-based metal matrix composite joints

Transient liquid phase (TLP) bonded aluminium based metal matrix composite (MMC) joints can be classified into three distinct regions, i.e. the particulate segregation region, the denuded particulate region and the base material region. The microstructure of the particulate segregation region consists of alumina particulate and Al alloy matrix with the Al 2Cu and MgAl 2O 4. It contains more and smaller alumina particulates compared with the base material region. The TLP bonded joints have the tensile strength of 150 MPa ～200 MPa and the shear strength of 70 MPa ～100 MPa . With increasing tensile stress, cracks initiate in the particulate segregation region, especially in the particulate/particulate interface and the particulate/matrix interface, and propagate along particulate/matrix interface, througth thin matrix metal and by linking up the close cracks. The particulate segregation region is the weakest during tensile testing and shear testing due to obviously increased proportion of weak bonds (particulate particulate bond and particulate matrix bond).

Time-dependent effects in transient liquid phase bonding of 304L and Cp-Ti using an Ag-Cu interlayer

One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.

Simultaneous intermetallics suppression and residual-stress relaxation of heat-resistant Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints via one-step transient liquid phase bonding and brazing

This work has successfully proposed a solution to produce robust Nb-interlayer-inserted Ti-6Al-4V/Si_(3)N_(4)joints optimized for a maximum operating temperature of 873 K;transient liquid phase bonding(TLPB)of Ti-6Al-4V/Nb side was carried out with Cu and Ni fillers to suppress brittle intermetallic compounds(IMCs),whereas brazing of Nb/Si_(3)N_(4)side was performed using a highly ductile Ti-added Ag-rich filler for effective residual-stress relaxation.A sound yet simple one-step bonding process incorporating simul-taneous TLPB and brazing was achieved with a relatively short holding time of 10 min at 1213 K.TLPB of Ti-6Al-4V/Nb side with Cu and Ni foils of 2-μm-thick each as a laminated filler suppressed brittle Ti-based IMCs and developed a homogenized microstructure consisting mainly of(α+β)-Ti via isothermal solidification.Meanwhile,brazing of Nb/Si_(3)N_(4)side with 100-μm-thick SILVER-ABA filler(92.75Ag-5Cu-1Al-1.25Ti mass%)foil enhanced interfacial bonding with sufficient total Ti content and accommodated residual stress better than conventional eutectic Ag-Cu-based fillers,and it was verified by finite element analysis with consideration of materials’temperature-dependent elasto-plastic properties.All joints with a bonding area of 10 mm×10 mm were tested via symmetrical four-point bending from room temper-ature(RT)to 873 K fractured from Nb/Si_(3)N_(4)side.When re-heating the joints from RT to 673 K,frac-ture initiation gradually shifted from Si_(3)N_(4)towards interfacial-compounds/Si_(3)N_(4)interface and bending strengths maintained∼220 MPa as weakening of SILVER-ABA filler was compensated by residual-stress relaxation in Si_(3)N_(4).When tested at 873 K,joints fractured mainly across the Ag-rich solid solution in a ductile manner and bending strength degraded by∼20%to 171 MPa as weakening of SILVER-ABA filler dominated.

An efficient method to engage oxide ceramics in low-temperature interfacial reactions: Microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint

Ductile transient liquid phase(TLP)bonding joints reinforced by multiple precipitates were produced using novel pre-sintered coatings and Au-Si fillers;therefore,the highest strength of NiTi/sapphire joints brazed at 460℃ for 30 min reached 72 MPa.The pre-sintering process improved the surface-active of sapphire by forming metastable Ti_(3)O and non-stoichiometric Al_(2)O_(3).The typical brazing seam consisted of O-rich compounds,TiSi_(2),and Ti-Ni-Si,wherein the O-rich phase featured different crystallinity depending on the oxygen content.The sapphire/seam interface was either a nanoscale diffusion region or a Si-rich amorphous layer.The breakdown of the Stokes-Einstein relation(SER)occurred,and the deviation from SER increased with a higher cooling rate.The influence of coating thickness was reflected in(i)the supercooling related to the viscosity and fractional exponent of liquids and(ii)the microstructural change of the joint related to the driving force for crystal growth.This work presented a new strategy for joining ceramics to metals at lower temperatures but using the joint at higher temperatures;furthermore,gave an insight into the microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint.

TLP bonding of alumina ceramic and 5A05 aluminum alloy using Ag-Cu-Ti interlayer

In order to join alumina ceramic to 5A05 aluminum alloy and obtain the excellent airtightness of joints whose maximum service temperature is 623 K, transient liquid phase （TLP） bonding technique was ,investigated using Ag-Cu-Ti alloy as interlayer. The wetting experimental results confirm that Ti can react with alumina ceramic at 833 K by adding 2 wt.% Ti in Sn. But during bonding alumina ceramic and 5A05 aluminum alloy with Ag-Cu-Ti interlayer at 833 K, Ti preferentially reacts with Al and there is no reaction layer on alumina ceramic/Ag-Cu-Ti interface, which finally results in a poorly airtight joint.

Transient Liquid Phase Bonding of IN738LC/MBF-15/IN738LC:Solidification Behavior and Mechanical Properties

Transient liquid phase（TLP） bonding of IN738 LC superalloy was carried out using a rapidly solidified MBF-15 Ni-based foil. The effects of bonding temperature（1130–1170 °C） and time（5–120 min） as well as foil thickness（35–140 μm） were studied on the microstructure of joint region and its mechanical properties. The solidification sequence in the joint region was found to be（i） formation of γ solid solution in the isothermally solidified zone, followed by（ii） ternary eutectic of γ ＋ Ni3 B ＋ Cr B, and finally（iii） binary eutectic of γ ＋ Ni3 Si in the athermally solidified zone. Fine Ni3 Si particles were also formed via a solid state transformation within the γ matrix in the vicinity of eutectic products. A deviation of isothermal solidification kinetics from the standard parabolic TLP model was observed by increasing the bonding temperature to 1170 °C, which resulted in the formation of eutectic constituents at the joint centerline.The analysis of mechanical and fractographic test results revealed that the samples with complete isothermal solidification exhibit the highest shear strength, whereas the hard eutectic constituents act as preferential failure sites and lead to a significant reduction in the joint shear strength in samples with incomplete isothermal solidification.

Fabrication of Open-cell Al Foam Core Sandwich by Vibration Aided Liquid Phase Bonding Method and Its Mechanical Properties

The open-cell Al foam core sandwiches（AFCSs） were successfully fabricated by using a specially designed Zn-Al-Cu based filler alloy via vibration aided liquid phase bonding method.The effects of the vibration on the bonding seam were investigated and the bonding strength between Al foam core and solid Al alloy face sheet was tested by shearing tests.The results show that vibration can significantly improve the quality of the bonding and the shearing strength of the bonding seam,which implies that this joining method has a good potential in practical applications.

Microstructure and mechanical properties of transient liquid phase bonding DD5 single-crystal superalloy to CrCoNi-based medium-entropy alloy

This study focuses on the transient liquid phase(TLP)bonding of DD5 single-crystal superalloy to Cr Co Nibased medium-entropy alloy(MEA)using a BNi-2 filler alloy.The microstructure and mechanical properties of the TLP-bonded DD5/MEA joint were evaluated,and the microstructural evolution mechanism was investigated.The formation of the isothermal solidification zone(ISZ)depended on the diffusion of the melting-point depressants(Si and B elements)from the liquid filler into the DD5 and MEA substrates,as well as the dissolution of the substrates.Boron diffused along theγchannel of DD5 and reacted to form M_(5)B_(3)boride,herein referred to as the diffusion-affected zone(DAZ I).Similarly,the Cr_(5)B_(3)boride precipitated in the Ni-rich MEA matrix adjacent to the MEA substrate(i.e.,DAZ II).Additionally,a coherent orientation of[0]_(BCY)//[011]_(FCC)and(002)_(BCY)//(200)_(FCC)was detected between M_(5)B_(3)boride with a body-centered tetragonal(BCT)structure and the face-centered cubic(FCC)matrix.The performance of the joint was dominated by the properties of the bonding seam.As the bonding time increased from 20to 80 min,the athermal solidification zone(including eutectic microstructure)was gradually replaced by the ISZ exhibiting excellent plastic deformation capability,and the shear strength of the joint was improved.The maximum shear strength(752 MPa)was achieved when the eutectic-free joint was bonded at 1050℃ for 80 min.The fracture morphology revealed a mixture mode,indicating the initiation of cracks in the DAZ II,mainly propagating in the ISZ,and passing through the DAZ I.

Development of three kinds of active ternary filler metals of AI-Si-Ti, Zn-AI-Ti and Cu-AI-Ti systems for AI metal matrix composites

To improve the wettability of common fiUer metals on Al metal matrix composites （ AI-MMCs ） , three kinds of active ternary filler metals, Al-Si-Ti, Zn-Al-Ti and Cu-Al-Ti systems, were prepared by the addition of Ti. Excessive melting temperature made the gravity segregation of Ti remarkable in ingot. The effect of Ti content on the melting point for AI-Si-Ti ternary system was not as sensitive as that for Al-Ti binary system. The Al-12Si-1Ti filler metal showed good ability to form brazing foil during rapid cooling, ductile fracture surface and similar shear strength to conventional Al-12Si filler metal. Moreover, the Al2 03 reinforcements on initial surface could be covered by the Al-12Si-1Ti filler metal without interfacial gaps after sessile drop test. For Zn-9.5Al-0. 5 Ti braze alloy, severe vaporization of Zn and severe segregation of Ti Occurred. During wettability test for traditional Al-12Si and Zn-9.5Al-0. 5Ti, although some Si or Zn could penetrate into the composite, interfacial gap still remained. The prepared Cu-19Al-1 Ti interlayer consisted of primary phase of Al4Cu9 and network Cu-Al-Ti ternary intermetaUic compound, showing poor ability to form foil and very brittle nature. These results demonstrated that Al-Si-Ti system should be promising for Al-MMCs.

Joining of metal bars by a new process of transformation-diffusion brazing

Within the bonded interface of metal bars joint produced by conventional solid state bonding process （ such as flash welding, resistance butt welding, friction welding and so on）, the inclusions are often present, which degrade the ductility of joint. A new process of transformation-diffusion brazing is proposed, in which an amorphous foil containing melting point depressant is preplaced between the interfaces to be joined, and the assembly is repeatedly heated/cooled without holding time at peak temperature. A low carbon steel bars, BNi-2 amorphous foil and resistance butt welding machine were used. The results show that surfuce contamination can be disrupted by the dissolution of base metal into molten interlayer in comparison with conventional process, and the ductility of joint can be improved by increasing the times of temperature cycles on line. In addition, transformation-diffusion brazing can be done with relatively simple and inexpensive system in comparison with transient liquid phase bonding.

Influence of the Substrate Orientation on the Isothermal Solidification during TLP Bonding Single Crystal Superalloys

Angle deviations between the two substrates during transient liquid phase （TLP） bonding single crystal superalloys cannot be avoided. In the present work, specimens have been prepared to investigate the influences of the various substrate orientations. It is found that the width of the non-isothermal solidification zone （NSZ） is linear with the square root of the isothermal solidification time. This suggests that the isothermal solidification process is B-diffusion controlled in different substrate orientation deviations. And also the width of the NSZ increases with increasing angle deviation, indicating that the isothermal solidification time needed in the TLP bonding increases with increasing orientation deviation between the two substrates.

Microstructural Evolution of a Ni-base Alloy DZ468 Joint Bonded with a New Co-base Filler

Ni-base alloy DZ468 has been joined by transient liquid phase bonding technique with a newly developed Co-based filler. The microstructures of the Co-base filler and the joint, the effects of heat treatment on microstructure and hardness of the joint have been investigated by various experimental methods. Results show that the Co-base filler consists of γ, M2B, M5B3 and M23B6 phases. Because of the interdiffusion between the base metal and the filler, γ, MC, M5B3 and M23B6 phases are formed in the bonding zone. And localized liquidation of substrate occurs in the diffusion affected zone, with MC and M3B2 precipitating in this area. During heat treatment, the volume of the intermetallic phases in the bonding zone resulting from incomplete isothermal solidification decreases obviously. On the contrary, the width of the diffusion affected zone increases at the solution stage and subsequently decreases at the aging stages.