A Novel Multiple DBC-staked units Package to Parallel More Chips for SiC Power Module

Silicon carbide(SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper(DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

DSN-BR-Based Online Inspection Method and Application for Surface Defects of Pharmaceutical Products in Aluminum-Plastic Blister Packages

Ensuring high product quality is of paramount importance in pharmaceutical drug manufacturing,as it is subject to rigorous regulatory practices.This study presents a research focused on the development of an on-line detection method and system for identifying surface defects in pharmaceutical products packaged in aluminum-plastic blisters.Firstly,the aluminum-plastic blister packages exhibit multi-scale features and inter-class indistinction.To address this,the deep semantic network with boundary refinement(DSN-BR)model is proposed,which leverages semantic segmentation domain knowledge,to accurately segment the defects in pixel level.Additionally,a specialized image acquisition module that minimizes the impact of ambient light is established,ensuring high-quality image capture.Finally,the image acquisition module,image detection module,and data management module are designed to construct a comprehensive online surface defect detection system.To validate the effectiveness of our approach,we employ a real dataset for instance verification on the implemented system.The experimental results substantiate the outstanding performance of the DSN-BR,achieving the mean intersection over union(MIoU)of 90.5%.Furthermore,the proposed system achieves an inference speed of up to 14.12 f/s,while attaining an F1-Score of 98.25%.These results demonstrate that the system meets the actual needs of the enterprise and provides theoretical and methodological support for intelligent inspection of product surface quality.By standardizing the control process of pharmaceutical manufacturing and improving the management capability of the manufacturing process,our approach holds significant market application prospects.

Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment

Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits.

Multi-Objective Prediction and Optimization of Vehicle Acoustic Package Based on ResNet Neural Network

Vehicle interior noise has emerged as a crucial assessment criterion for automotive NVH(Noise,Vibration,and Harshness).When analyzing the NVH performance of the vehicle body,the traditional SEA(Statistical Energy Analysis)simulation technology is usually limited by the accuracy of the material parameters obtained during the acoustic package modeling and the limitations of the application conditions.In order to effectively solve these shortcomings,based on the analysis of the vehicle noise transmission path,a multi-level objective decomposition architecture of the interior noise at the driver’s right ear is established.Combined with the data-driven method,the ResNet neural network model is introduced.The stacked residual blocks avoid the problem of gradient dis-appearance caused by the increasing network level of the traditional CNN network,thus establishing a higher-precision prediction model.This method alleviates the inherent limitations of traditional SEA simulation design,and enhances the prediction performance of the ResNet model by dynamically adjusting the learning rate.Finally,the proposed method is applied to a specific vehicle model and verified.The results show that the proposed meth-od has significant advantages in prediction accuracy and robustness.

Bisphenol A (BPA) Contamination in Whole Milk Marketed in Different Packages

Bisphenol A (BPA), an important endocrine disruptor, is used in the manufacturing of various materials, including food packaging. Ingestion of contaminated foodstuffs is, in fact, the most relevant form of exposure to this substance. However, scarce data on the presence of this contaminant in milk, or whether different types of food packaging influence food contamination are available in Brazil. This study, therefore, aimed to evaluate the BPA contamination of whole milk (fluid and powder) samples packaged in different types of packaging (Tetra Pak?;PET: Poly (ethylene terephthalate;Metallic can (epoxy resin);Polyethylene (PE) and poly (vinylidene chloride) (PVDC);Laminated Film - Metallized Polyester-Polyethylene and glass) and marketed metropolitan region of Rio de Janeiro, Brazil. An analytical method for the BPA determination in milk was optimized for both fluid (pasteurized and ultra-high temperature) and powdered milk samples. A modified QuEChERS method was applied, and BPA determinations were conducted by ultra-performance liquid chromatography coupled with sequential mass spectrometry (HPLC-MS/MS). The validated method was then applied to 51 milk samples, where BPA was detected in five samples (9.8%) and quantified in two (3.8%).

Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in wafer level chip scale package

To reveal the drop failure modes of the wafer level chip scale packages （WLCSPs） with Sn-3.0Ag-0.5Cu solder joints, board level drop tests were performed according to the JEDEC standard. Six failure modes were identified, i.e., short FR-4 cracks and complete FR-4 cracks at the printing circuit board （PCB） side, split between redistribution layer （RDL） and Cu under bump metallization （UBM）, RDL fracture, bulk cracks and partial bulk and intermetallic compound （IMC） cracks at the chip side. For the outmost solder joints, complete FR-4 cracks tended to occur, due to large deformation of PCB and low strength of FR-4 dielectric layer. The formation of complete FR-4 cracks largely absorbed the impact energy, resulting in the absence of other failure modes. For the inner solder joints, the absorption of impact energy by the short FR-4 cracks was limited, resulting in other failure modes at the chip side.

Integrated power electronics module based on chip scale packaged power devices

High performance can be obtained for the integrated power electronics module（IPEM） by using a three-dimensional packaging structure instead of a planar structure. A three- dimensional packaged half bridge-IPEM （HB-IPEM）, consisting of two chip scale packaged MOSFETs and the corresponding gate driver and protection circuits, is fabricated at the laboratory. The reliability of the IPEM is controlled from the shape design of solder joints and the control of assembly process parameters. The parasitic parameters are extracted using Agilent 4395A impedance analyzer for building the parasitic parameter model of the HB- IPEM. A 12 V/3 A output synchronous rectifier Buck converter using the HB-IPEM is built to test the electrical performance of the HB-IPEM. Low voltage spikes on two MOSFETs illustrate that the three-dimensional package of the HB-IPEM can decrease parasitic inductance. Temperature distribution simulation results of the HB-IPEM using FLOTHERM are given. Heat dissipation of the solder joints makes the peak junction temperature of the chip drop obviously. The package realizes three-dimensional heat dissipation and has better thermal management.

Application of wavelet package filtering in the de-noising of fiber optic gyroscopes

To reduce the drift error existing in the output signal of fiber optic gyroscopes （FOG）, a mathematical model of the FOG output signal is set up; the error characteristics of the FOG output signal are analyzed, and semi-soft threshold filtering is chosen based on the comparison of hard threshold and soft threshold filtering. The semi-soft threshold wavelet package filtering method is applied in the filtering of the FOG output signal. Experiments of the stationary and dynamic FOG output signals filtered with the wavelet package analysis are carried out in a lab environment, respectively. Experiments done with the real-time measured FOG signal show that the method of semi-soft threshold wavelet package filtering reduces the mean square error from 5 （°）/h to 1 （°）/h, so it is effective in eliminating the white noises and the fractal noises existing in the FOG. The novel method proposed here is proved valid in reducing the FOG drift error, satisfying the technical demands of high precision and realtime processing.

Effect of Freshness Protection Package on Storage and Preservation of Chinese Cabbage

The effect of freshness protection package on Chinese cabbage placed in the self-made shelf in ventilated storage was investigated, and the physiological-qual-ity indexes change were determined during the storage period. The results showed that the losses of weight and vitamin C were significantly reduced. The accumula-tion of crude fiber was effectively inhibited. But protein content was maintained at a low level and the rotting more serious of Chinese cabbage at the end of the stor-age packaged with the fresh keeping bags.

Model of gas exchange dynamics for modified-atmosphere packages containing fresh produce

A model for modified-atmosphere packaging （MAP） systems containing fruits and vegetables was developed.The computer simulation was performed to predict the gas mass concentrations inside the packages and was successfully verified by experiments with yellow peaches at 5,15 and 25 ℃ using two types of packaging films.A Michaelis-Menten type respiration model with noncompetitive inhibition mechanism due to CO2 was adopted while the respiration rates were measured with an improved permeable system method suitable for either steady or unsteady state.The applicability of the model in the design of MAP systems was demonstrated with a calculation to evaluate film specification and equilibrium concentrations of O2 and CO2 in the package containing yellow peaches.

利用Oracle PL/SQL Package实现Dispatcher设计模式

Dispatcher设计模式可以使用各种技术来实现。以社会保险业务处理为基础,有效地利用ORACLEPL/SQLPac-kage语言及支撑环境对面向对象技术的支持,通过定义消息ID、传递消息ID、撰写处理函数、连接消息ID和处理函数来实现Dispatcher设计模式,并且构造出能处理各项社会保险管理业务的Package组件。

利用ORACLE PL/SQL PACKAGE实现DISPATCHER设计模式

以ORACLEPACKAGE语言及支撑环境为基础,有效地利用其对面向对象技术的支持,实现DISPATCHER设计模式。

Thermal-Mechanical Simulation and Analysis on Structural Caused Package Induced Stress in Stacked Chip Scale Package

Stacked chip scale package(SCSP) attracts more and more attentions in advanced packages application with light weight,thin and small size,high reliability,low power and high storage capability.However,more and more physical and electrical issues being caused by package-induced stress in SCSP were reported recently.The effect of structural factors,including die thickness,die attach film thickness,die attach film type,and spacer size on package induced stress,was investigated.Analyses were given based on simulation results and provide important suggestion for package design.

MUTI-FUNCTIONAL PACKAGE多功能DESIGN包装设计的研究

随着经济的发展,商品的包装越来越受到大家的重视,包装产业亦是迅猛发展,且取得了瞩目的成就。但是随着包装材料使用量的逐渐增大,包装废弃物污染环境的问题也越来越严重。包装绿色设计已日益显现出对环保的积极作用,其作用可以总结为：有利于保护自然资源,以及在包装的整个设计、制造、使用和回收利用的过程中对生态环境损失最小。

Signal and Power Integrity Challenges for High Density System-on-Package

As the increasing desire for more compact,portable devices outpaces Moore’s law,innovation in packaging and system design has played a significant role in the continued miniaturization of electronic systems.Integrating more active and passive components into the package itself,as the case for system-on-package(SoP),has shown very promising results in overall size reduction and increased performance of electronic systems.With this ability to shrink electrical systems comes the many challenges of sustaining,let alone improving,reliability and performance.The fundamental signal,power,and thermal integrity issues are discussed in detail,along with published techniques from around the industry to mitigate these issues in SoP applications.

EFFECTS OF LEAD WIDTHS AND PITCHES ON RELIABILITY OF QUAD FLAT PACKAGE(QFP)SOLDERED JOINTS

The finite element method（FEM） is used to analyze the effects of lead widths and pitches on reliability of soldered joints. The optimum simulation for QFP devices is also researched. The results indicate that when the lead pitches are the same, the maximum equivalent stress of the soldered joints increases with the increasing of lead widths, while the reliability of the soldered joints reduces. When the lead widths are the same, the maximum equivalent stress of the soldered joints doesn＇t decrease completely with the increasing of lead pitches, a minimum value of the maximum equivalent stress values exists in all the curves. Under this condition the maximum equivalent stress of the soldewed joints is relatively the least, the reliability of soldered joints is high and the assembly is excellent. The simulating results indicate the best parameter： The lead width is 0.2 mm and lead pitch is 0.3 mm （the distance between two leads is 0.1 mm）, which are benefited for the micromation of QFP devices now. The minimum value of the maximum equivalent stress of soldered joints exists while lead width is 0.25 mm and lead pitch is 0.35 mm （the distance between two leads is 0.1 mm）, the devices can serve for a long time and the reliability is the highest, the assembly is excellent. The simulating results also indicate the fact that the lead width is 0.15 mm and lead pitch is 0.2 mm maybe the limit of QFP, which is significant for the high lead count and micromation of assembly.

Ultrasonic C-scan Detection for Stainless Steel Spot Welding Based on Wavelet Package Analysis

An ultrasonic test of spot welding for stainless steel is conducted. Based on wavelet packet decomposition, the ultrasonic echo signal has been analyzed deeply in time - frequency domain, which can easily distinguish the nugget from the corona bond. The 2D C-scan images produced by ultrasonic C scan which contribute to quantitatively calculate the nugget diameter for the computer are further analyzed. The spot welding nugget diameter can be automatically obtained by image enhancement, edge detection and equivalent diameter algorithm procedure. The ultrasonic detection values in this paper show good agreement with the metallographic measured values. The mean value of normal distribution curve is 0.006 67, and the standard deviation is 0.087 11. Ultrasonic C-scan test based on wavelet packet signal analysis is of high accuracy and stability.

HOTCAP:a new software package for high-speed oscilloscopebased three-dimensional bunch charge and position measurement

A software package to be used in high-speed oscilloscope-basedthree-dimensionalbunch-by-bunch charge and position measurement is presented.The software package takes the pick-up electrode signal waveform recorded by the high-speed oscilloscope as input,and it calculates and outputs the bunch-by-bunch charge and position.In addition to enabling a three-dimensional observation of the motion of each passing bunch on all beam position monitor pick-up electrodes,it offers many additional features such as injection analysis,bunch response function reconstruction,and turn-by-turn beam analysis.The software package has an easy-to-understand graphical user interface and convenient interactive operation,which has been verified on the Windows 10 system.

Integrated physics package of a chip-scale atomic clock

The physics package of a chip-scale atomic clock （CSAC） has been successfully realized by integrating vertical cavity surface emitting laser （VCSEL）, neutral density （ND） filter, λ/4 wave plate, 87Rb vapor cell, photodiode （PD）, and magnetic coil into a cuboid metal package with a volume of about 2.8 cm3. In this physics package, the critical component, 87Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of 87Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7 × 10^-10τ-1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.

Effect of microstructure of Au80Sn20 solder on the thermal resistance TO56 packaged GaN-based laser diodes

Au80Sn20 alloy is a widely used solder for laser diode packaging.In this paper,the thermal resistance of Ga N-based blue laser diodes packaged in TO56 cans were measured by the forward voltage method.The microstructures of Au80Sn20 solder were then investigated to understand the reason for the difference in thermal resistance.It was found that the microstructure with a higher content of Au-rich phase in the center of the solder and a lower content of(Au,Ni)Sn phase at the interface of the solder/heat sink resulted in lower thermal resistance.This is attributed to the lower thermal resistance of Au-rich phase and higher thermal resistance of(Au,Ni)Sn phase.