Extended research on software hybrid testing combining reliability and directed testing

The software reliability testing has many disadvantages in practice, such as high complexity of constructing operational profiles and poor fault detection efficiency. Oppositely, the directed testing with a high fault detection rate is incapable of estimating reliability quantificationally. To solve this problem, a hybrid testing combining reliability and directed testing as well as a reliability model based on the order statistic （OS） model were presented by Mitchell. An extended research on Mitchell＇s work is proposed. Firstly, the most proper distribution of the fault＇s failure rate which tends to be Iognormal is suggested, and a detailed form of the OS model based on Iognormal and the corresponding parameter estimation method are proposed, respectively. Secondly, an im- plementing framework for the hybrid testing is proposed. Finally, the hybrid testing and the OS model are applied on a real website system. The experimental results indicate： the hybrid testing has more efficient fault detection power and lower testing cost than the reliability testing; compared with three traditional software reliabil ity growth models, the OS model has a best or pretty estimation or prediction power for each data set; and for the failure data set collected from hybrid testing, the OS model also achieves an ac- ceptable estimation result.

NHPP-based software reliability model considering testing effort and multivariate fault detection rate

In recent decades,many software reliability growth models（SRGMs） have been proposed for the engineers and testers in measuring the software reliability precisely.Most of them is established based on the non-homogeneous Poisson process（NHPP）,and it is proved that the prediction accuracy of such models could be improved by adding the describing of characterization of testing effort.However,some research work indicates that the fault detection rate（FDR） is another key factor affects final software quality.Most early NHPPbased models deal with the FDR as constant or piecewise function,which does not fit the different testing stages well.Thus,this paper first incorporates a multivariate function of FDR,which is bathtub-shaped,into the NHPP-based SRGMs considering testing effort in order to further improve performance.A new model framework is proposed,and a stepwise method is used to apply the framework with real data sets to find the optimal model.Experimental studies show that the obtained new model can provide better performance of fitting and prediction compared with other traditional SRGMs.

Exponential System Reliability Test Design Based on Information Fusion

By analyzing the shortage of reliability test design and thinking over the producer's risk and consumer's risk, the information fusion technology is used to set up a reliability test design model( RTDM). By analyzing the demands and constraint conditions of the RTDM and with applications of Bayesian approach and Monte Carlo method( MCM),this paper puts forward the exponential distributed subsystems and the information fusion technology among them. According to the posteriori risk criteria,formulas of producer's risk and consumer's risk were also inferred,and with the help of Matlab software,selection of the optimum test plan was solved. Finally,validity of the model had been proved by a test of series parallel system.

Efficient Method for Accelerated Reliability Qualification Testing

Based on the theoretical inference and experiment verification,a method was proposed to carry out the accelerated reliability qualification testing. First,theoretical inference was used to get the acceleration coefficients of super Gauss vibration stress and temperature stress. Then, by applying these coefficients, an accelerated reliability qualification testing curve was obtained from the standard tests. Finally,the actual experiment on a digital marine control device was carried out under the proposed testing method.The experiment result shows that the proposed method can reduce the total experiment time and improve the efficiency of the reliability qualification test.

Reliability and Validity Test of Questionnaire on the Adaptation Strategy of Cryosphere Changes in Arid Inland River Basin

[Objective] The aim was to test the reliability and validity of questionnaire on the adaptation strategy of cryosphere changes in arid inland river basin. [Method] A questionnaire on 'the adaptation strategy of cryosphere changes in arid inland river basin' was carried out in Urumchi River basin and Aksu River basin, and its reliability and validity were tested by means of statistical method, so as to investigate the stability and accuracy of questionnaire. [Result] Reliability analysis of questionnaire showed that the split-half reliability coefficient of questionnaire in Urumchi River basin and Aksu River basin was 0.729 and 0.750, respectively, and Cronbach’s α reliability coefficient was 0.613 and 0.616, respectively, which revealed that the questionnaire had good equivalence and internal consistency which reflected good reliability and stability. According to validity analysis on questionnaire, there was significant correlation between the score of most questions and questionnaire, and it indicated that questionnaire had high content validity. There were 8 common factors collected from 26 questions, which were summarized as agricultural planting, agricultural water conservation, life satisfaction, cultivated land variation, social integration sense, climate and cryosphere changes, capital input improved by environment and family economic condition, respectively. Meanwhile, the contribution rate of various questions in corresponding indexes was higher, and reflected structure was in full accord with questionnaire content, which revealed that questionnaire owned good construct validity. [Conclusion] With higher stability and accuracy, the questionnaire could determine the desired topic and content and was suitable for the study on the perception of common people and choices of adaptive strategy under cryosphere changes in arid inland river basin in northwestern China.

Reliability Design of Ice-Maker System Subjected to Repetitive Loading

Parametric Accelerated Life Testing (ALT) was used to improve the reliability of ice-maker system with a fractured helix upper dispenser in field. By using bond graphs and state equations, a variety of mechanical loads in the assembly were analyzed. The acceleration factor was derived from a generalized life-stress failure model with a new load concept. To reproduce the failure modes and mechanisms causing the fracture, new sample size equation was derived. The sample size equation with the acceleration factor also enabled the parametric accelerated life testing to quickly reproduce early failure in field. Consequently, the failure modes and mechanisms found were identical with those of the failed sample. The design of this testing should help an engineer uncover the design parameters affecting the reliability of fractured helix upper dispenser in field. By eliminating the design flaws, gaps and weldline, the B1 life of the redesign of helix upper dispenser is now guaranteed to be over 10 years with a yearly failure rate of 0.1% that is the reliability quantitative test specifications (RQ).

BAYESIAN DEMONSTRATION TEST METHOD WITH MIXED BETA DISTRIBUTION

A complex mechatronics system Bayesian plan of demonstration test is studied based on the mixed beta distribution. During product design and improvement various information is appropriately considered by introducing inheritance factor, moreover, the inheritance factor is thought as a random variable, and the Bayesian decision of the qualification test plan is obtained, and the correctness of a Bayesian model presented is verified. The results show that the quantity of the test is too conservative according to classical methods under small binomial samples. Although traditional Bayesian analysis can consider test information of related or similar products, it ignores differences between such products. The method has solved the above problem, furthermore, considering the requirement in many practical projects, the differences among this method, the classical method and Bayesian with beta distribution are compared according to the plan of reliability acceptance test.

Review on failure analysis of interconnections in power devices

Interconnections in microelectronic packaging are not only the physical carrier to realize the function of electronic circuits,but also the weak spots in reliability tests.Most of failures in power devices are caused by the malfunction of interconnections,including failure of bonding wire as well as cracks of solder layer.In fact,the interconnection failure of power devices is the result of a combination of factors such as electricity,temperature,and force.It is significant to investigate the failure mechanisms of various factors for the failure analysis of interconnections in power devices.This paper reviews the main failure modes of bonding wire and solder layer in the interconnection structure of power devices,and its failure mechanism.Then the reliability test method and failure analysis techniques of interconnection in power device are introduced.These methods are of great significance to the reliability analysis and life prediction of power devices.

Novel Accelerating Life Test Method and Its Application by Combining Constan Stress and Progressive Stress

Constant stress accelerated life tests(ALTs) can be applied to obtain a high estimation accuracy of reliability measure?ments, but these are time?consuming tests. Progressive stress ALTs can yield failures more quickly but cannot guaran tee the estimation accuracy of reliability measurements. In this paper, a progressive?constant combination stress ALT is proposed to combine the merits of both tests. The optimal plan, in which the design variables are the initial pro?gressive stress level, the progressive stress ramp rate, the sample allocation proportion of the progressive stress and the constant stress level, is determined using the principle of minimizing the asymptotic variance of the maximum likelihood estimator of the natural log reliable life for the connectors. A comparison between the optimal PCCSALT plan and the CSALT plan with the same sample size and estimation accuracy shows that the test time is reduced by 13.59% by applying the PCCSALT.

THREE-DIMENSIONAL ISODYNE STRESS ANALYSIS——PRESENT STATE, TRENDS, THEORETICAL PROBLEMS

The paper presents and discusses theoretical bases and methodology of development of two- and three-dimensional analytical and optical isodynes. Atten- tion is given to the theoretical admissibility of the major components of the physical and mathematical models which are taken as the theoretical basis of the isodynes, and of the related analytical and experimental procedures of stress analysis. Efficiency and reliability of the nondestructive isodyne stress analysis are discussed.

An Energy Model of a Failure Mechanism and its Application

The energy expression is presented for a failure mechanism, and it is appliedin an Accelerated Life Test (ALT) and an Accelerated Reliability Growth Test (ARGT). The conditionsof the common failure mechanism are obtained. The essential relationship between the conditions andthe Accelerated Factor (A_f) is proposed by using the energy model.

Reliability test and failure analysis of high power LED packages

A new type application specific light emitting diode （LED） package （ASLP） with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85℃/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing.

Simulation on Reliability Enhancement Testing Technology of Ramming System

Ramming system is the key device to guarantee the firing speed of self-propelled gun. Based on traditional reliability enhancement testing method, a new kind of reliability enhancement testing simulation method of ramming system is put forward firstly. In CAD software Pro/E and dynamic simulation software ADAMS, the virtual prototype of ramming system is established. In EASY5 software, the corresponding hydraulic system and control system models are built. The reliability enhancement testing virtual environment of ramming system is developed using the mechanical-electrical-hydraulic co-simulation technology. Based on the load spectra provided by virtual prototype, and the stress distribution provided by finite element analysis and material's S-N curve(S is fatigue strength, N is fatigue life), a model of fatigue enhancement coefficient is established through the failure mechanism analysis. The simulation processes and simulation results show the feasibility of reliability enhancement testing based on virtual prototype, and provide sufficient theory reference for structure improvement and optimization of ramming system.

DETERMINING THE RELIABILITY AND VALIDITY OF A MODIFICATION OF THE CET 4 WRITING TEST

The CET 4 writing test is widely used in China,but whether it is a more reliable and valid test ofwriting for CET 4 than other methods of evaluation is still not clear.The purpose of this study was to examine the reliability and the validity of a modification of this test.In carrying out the study,a total of 60 Band 4 students in Zhejiang University took the modified test,aCET 4 test and a First Certificate Practice Test.The results of this study demonstrate that themodified version is a significantly more reliable and valid writing test than the present CET 4 writingtest.These results suggest that the CET 4 writing test needs modification.

Research of Step-down Stress Accelerated Degradation Data Assessment Method of a Certain Type of Missile Tank

The performance degradation rates of the missile tank are generally time-varying functions uneasily evaluated by general classical evaluation methods. This paper develops a segmented nonlinear accelerated degradation model （SNADM） based on the equivalent method of accumulative damage theory, which tackles the problem that product life is difficult to be determined with degradation rate being a function of the variable of time. A segmented expression of the function of population accumulative degradation is derived. And combined with nonlinear function, an accelerated degradation function, i.e., SNADM is obtained. The parameters of the SNADM are identified by numerical iteration, and the statistical function of degradation track is extrapolated. The reliability function is determined through the type of random process of the degradation distribution. Then an evaluation of product storage life is undertaken by combining the statistical function of degradation track, reliability function and threshold. An example of a missile tank undergoes a step-down stress accelerated degradation test （SDSADT）, in which the results with the SNADM and the classical method are evaluated and compared. The technology introduced is validated with the resultant coincidence of both evaluated and field storage lives.

Wafer-level SLID bonding for MEMS encapsulation

Hermetic packaging is often an essential requirement to enable proper functionality throughout the device＇s lifetime and ensure the optimal performance of a micro electronic mechanical system （MEMS） device. Solid-liquid interdiffusion （SLID） bonding is a novel and attractive way to encapsulate MEMS devices at a wafer level. SLID bonding utilizes a low-melting-point metal to reduce the bonding process temperature; and metallic seal rings take out less of the valuable surface area and have a lower gas permeability compared to polymer or glass- based sealing materials. In addition, ductile metals can adopt mechanical and thermo-mechanical stresses during their service lifetime, which improves their reliability. In this study, the principles of Au-Sn and Cu-Sn SLID bonding are presented, which are meant to be used for wafer-level hermetic sealing of MEMS resonators. Seal rings in 15.24 cm silicon wafers were bonded at a width of 60 gin, electroplated, and used with Au-Sn and Cu-Sn layer structures. The wafer bonding temperature varied between 300 ℃ and 350 ℃, and the bonding force was 3.5 kN under the ambient pressure, that is, it was less than 0.1 Pa. A shear test was used to compare the mechanical properties of the interconnections between both material systems, in addition, important factors pertaining to bond ring design are discussed according to their effects on the failure mechanisms. The results show that the design ofmetal structures can significantly affect the reliability of bond rings.