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Electron Cyclotron Resonance Plasma-Assisted Atomic Layer Deposition of Amorphous Al_2O_3 Thin Films
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作者 熊玉卿 桑利军 +3 位作者 陈强 杨丽珍 王正铎 刘忠伟 《Plasma Science and Technology》 SCIE EI CAS CSCD 2013年第1期52-55,共4页
Without extra heating, Al2O3 thin films were deposited on a hydrogen-terminated Si substrate etched in hydrofluoric acid by using a self-built electron cyclotron resonance (ECR) plasma-assisted atomic layer depositi... Without extra heating, Al2O3 thin films were deposited on a hydrogen-terminated Si substrate etched in hydrofluoric acid by using a self-built electron cyclotron resonance (ECR) plasma-assisted atomic layer deposition (ALD) device with Al(CH3)3 (trimethylaluminum; TMA) and O2 used as precursor and oxidant, respectively. During the deposition process, Ar was in- troduced as a carrier and purging gas. The chemical composition and microstructure of the as-deposited Al2O3 films were characterized by using X-ray diffraction (XRD), an X-ray photo- electric spectroscope (XPS), a scanning electron microscope (SEM), an atomic force microscope (AFM) and a high-resolution transmission electron microscope (HRTEM). It achieved a growth rate of 0.24 nm/cycle, which is much higher than that deposited by thermal ALD. It was found that the smooth surface thin film was amorphous alumina, and an interfacial layer formed with a thickness of ca. 2 nm was observed between theAl2O3 film and substrate Si by HRTEM. We conclude that ECR plasma-assisted ALD can growAl2O3 films with an excellent quality at a high growth rate at ambient temperature. 展开更多
关键词 ECR ALD al2o3thin film TMA HRTEM
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Enhancing the thermal conductivity of polymer-assisted deposited Al_2O_3 film by nitrogen doping 被引量:2
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作者 黄江 张胤 +3 位作者 潘泰松 曾波 胡国华 林媛 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第12期372-376,共5页
Polymer-assisted deposition technique has been used to deposit Al2O3 and N-doped Al2O3 (AION) thin films on Si(100) substrates. The chemical compositions, crystallinity, and thermal conductivity of the as-grown fi... Polymer-assisted deposition technique has been used to deposit Al2O3 and N-doped Al2O3 (AION) thin films on Si(100) substrates. The chemical compositions, crystallinity, and thermal conductivity of the as-grown films have been characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and 3-omega method, respectively. Amorphous and polycrystalline Al2O3 and AlON thin films have been formed at 700 ℃ and 1000 ℃. The thermal conductivity results indicated that the effect of nitrogen doping on the thermal conductivity is determined by the competition of the increase of Al-N bonding and the suppression of crystallinity. A 67% enhancement in thermal conductivity has been achieved for the samples grown at 700 ℃, demonstrating that the nitrogen doping is an effective way to improve the thermal performance of polymer-assisted-deposited Al2O3 thin films at a relatively low growth temperature. 展开更多
关键词 nitrogen-doped Al2O3 thin film thermal conductivity polymer-assisted deposition
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电沉积-热解法制备的Al_2O_3薄膜的抗高温氧化性能研究 被引量:5
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作者 马静 孟凡曼 《河北科技大学学报》 CAS 2015年第4期413-418,共6页
采用电沉积-热解法在304不锈钢表面沉积了Al2O3薄膜,研究了电解液浓度、电沉积电压对Al2O3薄膜900℃抗高温氧化性能的影响。表面宏观形貌、XRD分析、氧化增重和氧化膜剥落动力学曲线结果表明电沉积-热解法制备的Al2O3薄膜降低了氧化初... 采用电沉积-热解法在304不锈钢表面沉积了Al2O3薄膜,研究了电解液浓度、电沉积电压对Al2O3薄膜900℃抗高温氧化性能的影响。表面宏观形貌、XRD分析、氧化增重和氧化膜剥落动力学曲线结果表明电沉积-热解法制备的Al2O3薄膜降低了氧化初期基体表面的氧分压,促进了选择氧化的发生,因此显著提高了304不锈钢的抗高温氧化性能。在电沉积电压为25V、硝酸铝酒精浓度为0.10mol/L条件下制备的Al2O3薄膜抗高温氧化性能最佳。 展开更多
关键词 材料失效与保护 电沉积-热解 AL2O3薄膜 高温氧化 选择氧化
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氧化铝基有机无机复合耐腐蚀薄膜的制备与研究 被引量:1
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作者 林学山 《舰船科学技术》 北大核心 2016年第14期181-183,共3页
选择Al2O2微型无机膜为基膜,选用溶胶—凝胶法(sol-gel)进行制备Al2O2无机膜,在这个无机氧化铝薄膜上又复合了有机功能薄膜,使得该薄膜的性能变得非常优良,并且自身的分离性很好,具有非常好的耐压密性以及物化稳定性。利用X射线衍射仪... 选择Al2O2微型无机膜为基膜,选用溶胶—凝胶法(sol-gel)进行制备Al2O2无机膜,在这个无机氧化铝薄膜上又复合了有机功能薄膜,使得该薄膜的性能变得非常优良,并且自身的分离性很好,具有非常好的耐压密性以及物化稳定性。利用X射线衍射仪、扫描电子显微镜研究薄膜的相组成和表面形貌;利用划痕仪、表面粗糙轮廓仪测量薄膜和基片之间的结合力和薄膜厚度;利用阻抗仪和材料表面性能测试仪研究薄膜的介电性能和耐磨性能并简述该制备方法。 展开更多
关键词 有机无机 氧化铝薄膜 制备方法 耐腐蚀性
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Plasma-Assisted ALD of an Al_2O_3 Permeation Barrier Layer on Plastic 被引量:5
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作者 雷雯雯 李兴存 +1 位作者 陈强 王正铎 《Plasma Science and Technology》 SCIE EI CAS CSCD 2012年第2期129-133,共5页
Atomic layer deposition (ALD) technique is used in the preparation of organic/inorganic layers, which requires uniform surfaces with their thickness down to several nanometers. For film with such thickness, the grow... Atomic layer deposition (ALD) technique is used in the preparation of organic/inorganic layers, which requires uniform surfaces with their thickness down to several nanometers. For film with such thickness, the growth mode defined as the arrangement of clusters on the surface during the growth is of significance. In this work, Al2O3 thin film was deposited on various interfacial species of pre-treated polyethylene terephthalate (PET, 12 μm) by plasma assisted atomic layer deposition (PA-ALD), where trimethyl aluminium was used as the Al precursor and O2 as the oxygen source. The interracial species, -NH3, -OH, and -COOH as well as SiCHO (derived from monomer of HMDSO plasma), were grafted previously by plasma and chemical treatments. The growth mode of PA-ALD Al2O3 was then investigated in detail by combining results from in-situ diagnosis of spectroscopic ellipsometry (SE) and ex-situ characterization of as-deposited layers from the morphologies scanned by atomic force microscopy (AFM). In addition, the oxygen transmission rates (OTR) of the original and treated plastic films were measured. The possible reasons for the dependence of the OTR values on the surface species were explored. 展开更多
关键词 ALD Al2O3 thin film different interfacial species permeation barrier layer OTR
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Low voltage organic devices and circuits with aluminum oxide thin film dielectric layer 被引量:2
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作者 SHANG LiWei JI ZhuoYu +4 位作者 CHEN YingPin WANG Hong LIU Xin HAN MaiXin LIU Ming 《Science China(Technological Sciences)》 SCIE EI CAS 2011年第1期95-98,共4页
Low voltage operating organic devices and circuits have been realized using atomic layer deposition deposited aluminum oxide thin film as dielectric layer. The dielectric film has per unit area capacitance of 165 nF/c... Low voltage operating organic devices and circuits have been realized using atomic layer deposition deposited aluminum oxide thin film as dielectric layer. The dielectric film has per unit area capacitance of 165 nF/cm2 and leakage current of 1 nA/cm2 at 1 MV/cm. The devices and circuits use the small-molecule hydrocarbon pentacene as the active semiconductor material. Transistors,inverters,and ring oscillators with operating voltage lower than 5 V were obtained. The mobility of organic field-effect transistors was extracted to be 0.16 cm2/Vs in saturation range,the threshold voltage is 0.3 V,and the on/off current ratio is larger than 105. The gain of inverters is estimated to be 12 at -5 V supply voltage,and the propagation delay is 0.25 ms per stage in 5-stage ring oscillators. 展开更多
关键词 OFET low voltage atomic layer deposition Al2O3 thin film high-k dielectric
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