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Improvement of AlN Thermal Conductivity Based on Reductive Compound Additives
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作者 LI Meijuan WANG Chuanyi +2 位作者 WANG Gaoqiang WANG Chuanbin SHEN Qiang 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS CSCD 2023年第5期1025-1033,共9页
AlN ceramics were prepared by plasma activation sintering(PAS)with compound additives yttrium acetylacetonate(Y(acac)_(3))and melamine(C_(3)H_(6)N_(6)).The effects of compound additives on the microstructure,density,a... AlN ceramics were prepared by plasma activation sintering(PAS)with compound additives yttrium acetylacetonate(Y(acac)_(3))and melamine(C_(3)H_(6)N_(6)).The effects of compound additives on the microstructure,density,and thermal properties of Al N ceramic were studied.Y(acac)3and C_(3)H_(6)N_(6)can form Y_(2)O_(3),residual organic carbon and reducing gas during the heating process,which improves the Al N sintering performance at a temperature of 1700℃and the bulk thermal conductivity.When the content of Y(acac)_(3)is 10 wt%and C_(3)H_(6)N_(6)is 3 wt%,the thermal conductivity of Al N ceramics is 105.6 W/(m·K),which is much higher than that of Al N ceramics with Y_(2)O_(3)under the same sintering conditions.This work provides theoretical reference for the preparation of high-performance Al N ceramic. 展开更多
关键词 reductive compound additives aln ceramic thermal conductivity:plasma activated sintering
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