Twin-roll thin strip casting process combines casting and hot rolling into a single process, in which thermal stress and thermal mechanical stress were involved. Considering the high temperature gradient, the existing...Twin-roll thin strip casting process combines casting and hot rolling into a single process, in which thermal stress and thermal mechanical stress were involved. Considering the high temperature gradient, the existing of liquid and solid regions and rolling deformation, suitable constitutive model is the key to describe the process. Anand's model is a temperature-dependent, rate-dependent and unified of creep and plasticity model and the Jaumann derivative was employed in Anand's model which makes the constitutive model frame-indifferent or objective, therefore the highly nonlinearities behavior in the twin-roll casting process can be simulated. The parameters of the Anand's model were regressed based on the compression tests of AZ31 magnesium alloy. The simulation results reveal that the Anand's model can well describe the deformation characteristics of twin-roll casting process. Based on the simulation results, the form of evolution equations in Anand's model was discussed.展开更多
A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to de...A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to describe the viscoplasticity of the CBGA solder.The average viscoplastic strain energy density increment △Wave of the CBGA packages is obtained using a finite element simulation,and the influence of different structural parameters on theWave is analyzed.A simplified analytical model of the △Wave is established using the simulation data.The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test.The Darveaux lifetime predictionmodel ismodified based on the thermal fatigue lifetime obtained fromthe experiment and the corresponding △Wave.A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages.This proposed model can be used in engineering to evaluate the lifetime of CBGA packages.展开更多
研究Sn Ag Cu Fe焊点的本构方程,采用拉伸测试拟合本构模型的9个参数。基于有限元模拟应用Anand模型分析WLCSP30器件Sn Ag Cu Fe焊点的应力-应变响应。结果表明,器件最大应力集中在拐角焊点上表面,Sn Ag Cu Fe焊点应力值明显小于Sn Ag C...研究Sn Ag Cu Fe焊点的本构方程,采用拉伸测试拟合本构模型的9个参数。基于有限元模拟应用Anand模型分析WLCSP30器件Sn Ag Cu Fe焊点的应力-应变响应。结果表明,器件最大应力集中在拐角焊点上表面,Sn Ag Cu Fe焊点应力值明显小于Sn Ag Cu焊点。基于疲劳寿命预测模型,证实微量的Fe可以显著提高Sn Ag Cu焊点疲劳寿命,因此Sn Ag Cu Fe可以替代传统的Sn Pb应用于电子封装。展开更多
文摘Twin-roll thin strip casting process combines casting and hot rolling into a single process, in which thermal stress and thermal mechanical stress were involved. Considering the high temperature gradient, the existing of liquid and solid regions and rolling deformation, suitable constitutive model is the key to describe the process. Anand's model is a temperature-dependent, rate-dependent and unified of creep and plasticity model and the Jaumann derivative was employed in Anand's model which makes the constitutive model frame-indifferent or objective, therefore the highly nonlinearities behavior in the twin-roll casting process can be simulated. The parameters of the Anand's model were regressed based on the compression tests of AZ31 magnesium alloy. The simulation results reveal that the Anand's model can well describe the deformation characteristics of twin-roll casting process. Based on the simulation results, the form of evolution equations in Anand's model was discussed.
文摘A thermal fatigue lifetime prediction model of ceramic ball grid array(CBGA)packages is proposed based on the Darveaux model.A finite element model of the CBGA packages is established,and the Anand model is used to describe the viscoplasticity of the CBGA solder.The average viscoplastic strain energy density increment △Wave of the CBGA packages is obtained using a finite element simulation,and the influence of different structural parameters on theWave is analyzed.A simplified analytical model of the △Wave is established using the simulation data.The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test.The Darveaux lifetime predictionmodel ismodified based on the thermal fatigue lifetime obtained fromthe experiment and the corresponding △Wave.A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages.This proposed model can be used in engineering to evaluate the lifetime of CBGA packages.
基金National Natural Science Foundation of China(51475220)Natural Science Foundation of Jiangsu(BK2012144)Natural Science Foundation of the Higher Educations of Jiangsu Province(12KJB460005)
文摘研究Sn Ag Cu Fe焊点的本构方程,采用拉伸测试拟合本构模型的9个参数。基于有限元模拟应用Anand模型分析WLCSP30器件Sn Ag Cu Fe焊点的应力-应变响应。结果表明,器件最大应力集中在拐角焊点上表面,Sn Ag Cu Fe焊点应力值明显小于Sn Ag Cu焊点。基于疲劳寿命预测模型,证实微量的Fe可以显著提高Sn Ag Cu焊点疲劳寿命,因此Sn Ag Cu Fe可以替代传统的Sn Pb应用于电子封装。