Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results...Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of (CuxNi1-x)6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.展开更多
The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au fi...The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au finished metallization, respectively. After 1000 thermal cycles between -40℃ and 125℃, a very thin intermetallic compound （IMC） layer containing Au, Sn, Ni, and Cu formed at the interface between SAC solder joints and underneath metallization with 0.1 μm Au finish, and （Au, Ni, Cu）Sn4 and a very thin AuSn-Ni-Cu IMC layer formed between SAC solder joints and underneath metallization with 0.9 μm Au finish. For SnPb solder joints with 0.1 μm Au finish, a thin （Ni, Cu, Au）3Sn4 IMC layer and a Pb-rich layer formed below and above the （Au, Ni）Sn4 IMC, respectively. Cu diffused through Ni layer and was involved into the IMC formation process. Similar interfacial microstructure was also found for SnPb solder joints with 0.9μm Au finish. The results of shear test show that the shear strength of SAC solder joints is consistently higher than that of SnPb eutectic solder joints during thermal cycling.展开更多
Sandaowanzi gold deposit,Heilongjiang Province,is the only single telluride type gold deposit so far documented in the world,in which 90% of gold is hosted in gold-silver telluride minerals.Optical microscope observat...Sandaowanzi gold deposit,Heilongjiang Province,is the only single telluride type gold deposit so far documented in the world,in which 90% of gold is hosted in gold-silver telluride minerals.Optical microscope observation,scanning electron microscope,electron probe and X-ray diffraction analysis identified abundant intergrowth textures in the Au-Ag-Te minerals,typified by sylvanite-hosting hessite crystals and hessite-hosting petzite crystals.The intergrown minerals and their chemistry are consistent,and the hosted minerals are mostly worm-like or as oriented stripes,evenly distributed in the hosting minerals,with clear and smooth interfaces.These suggest an exsolution origin for the intergrowth texture.With reference to the phase-transformation temperature derived from synthesis experiments of tellurides,the exsolution texture of Au-Ag-Te minerals implies that the veined tellurides formed at 150-220℃.The early stage disseminated tellurides formed at log f(Te 2) from 13.6 to 7.8,log f(S 2) from 11.7 to 7.6,whereas the late stage veined tellurides formed at log f(Te 2) ranging from 11.2 to 9.7 and log f(S 2) from 16.8 to 12.2.展开更多
文摘Intermetallic compounds(IMC) formed at Sn-Ag-Cu solder droplet/pad interface during wetting reaction were investigated. Comparative studies of the IMC evolution during reflow and aging were also conducted. The results show that the wetting reaction between molten solder droplet and pad leads to the formation of Au-Sn compound at interface, but Au element is not fully consumed during wetting reaction. After reflow, all Au layer disappears from the interface, Au element is dissolved into solder and Au-Sn intermetallic compounds are precipitated in the bulk. Reaction between Ni layer and Sn-Ag-Cu solder leads to the formation of (CuxNi1-x)6Sn5 layer at interface during reflow. According to the thermodynamic-kinetic of interfacial reaction, the wetting reaction at solder droplet/pad interface influences the phase selectivity of IMC evolution during reflow and aging process.
文摘The influence of thermal cycling on the microstructure and joint strength of Sn3.5Ag0.75Cu （SAC） and Sn63Pb37 （SnPb） solder joints was investigated. SAC and SnPb solder balls were soldered on 0.1 and 0.9 μm Au finished metallization, respectively. After 1000 thermal cycles between -40℃ and 125℃, a very thin intermetallic compound （IMC） layer containing Au, Sn, Ni, and Cu formed at the interface between SAC solder joints and underneath metallization with 0.1 μm Au finish, and （Au, Ni, Cu）Sn4 and a very thin AuSn-Ni-Cu IMC layer formed between SAC solder joints and underneath metallization with 0.9 μm Au finish. For SnPb solder joints with 0.1 μm Au finish, a thin （Ni, Cu, Au）3Sn4 IMC layer and a Pb-rich layer formed below and above the （Au, Ni）Sn4 IMC, respectively. Cu diffused through Ni layer and was involved into the IMC formation process. Similar interfacial microstructure was also found for SnPb solder joints with 0.9μm Au finish. The results of shear test show that the shear strength of SAC solder joints is consistently higher than that of SnPb eutectic solder joints during thermal cycling.
基金supported by the Project of China Geological Survey(1212011121083)the Public Industry Research and Development Program of the Ministry of Land and Resources(200811011)
文摘Sandaowanzi gold deposit,Heilongjiang Province,is the only single telluride type gold deposit so far documented in the world,in which 90% of gold is hosted in gold-silver telluride minerals.Optical microscope observation,scanning electron microscope,electron probe and X-ray diffraction analysis identified abundant intergrowth textures in the Au-Ag-Te minerals,typified by sylvanite-hosting hessite crystals and hessite-hosting petzite crystals.The intergrown minerals and their chemistry are consistent,and the hosted minerals are mostly worm-like or as oriented stripes,evenly distributed in the hosting minerals,with clear and smooth interfaces.These suggest an exsolution origin for the intergrowth texture.With reference to the phase-transformation temperature derived from synthesis experiments of tellurides,the exsolution texture of Au-Ag-Te minerals implies that the veined tellurides formed at 150-220℃.The early stage disseminated tellurides formed at log f(Te 2) from 13.6 to 7.8,log f(S 2) from 11.7 to 7.6,whereas the late stage veined tellurides formed at log f(Te 2) ranging from 11.2 to 9.7 and log f(S 2) from 16.8 to 12.2.
