Cookie Baking Process Optimization and Quality Analysis Based on Food 3D Printing

In order to obtain better quality cookies, food 3D printing technology was employed to prepare cookies. The texture, color, deformation, moisture content, and temperature of the cookie as evaluation indicators, the influences of baking process parameters, such as baking time, surface heating temperature and bottom heating temperature, on the quality of the cookie were studied to optimize the baking process parameters. The results showed that the baking process parameters had obvious effects on the texture, color, deformation, moisture content, and temperature of the cookie. All of the roasting surface heating temperature, bottom heating temperature and baking time had positive influences on the hardness, crunchiness, crispiness, and the total color difference(ΔE) of the cookie. When the heating temperatures of the surfac and bottom increased, the diameter and thickness deformation rate of the cookie increased. However,with the extension of baking time, the diameter and thickness deformation rate of the cookie first increased and then decreased. With the surface heating temperature of 180 ℃, the bottom heating temperature of 150 ℃, and baking time of 15 min, the cookie was crisp and moderate with moderate deformation and uniform color. There was no burnt phenomenon with the desired quality. Research results provided a theoretical basis for cookie manufactory based on food 3D printing technology.

Effect of baking processes on properties of TiB_2/C composite cathode material

Pitch and TiB2/C green composite cathode material were respectively analyzed with simultaneous DSC-TGA, and effects of three baking processes of TiB2/C composite cathode material, i.e. K25, K5 and M5, on properties of TiB2/C composite cathode material were investigated. The results show that thermogravimetrie behavior of pitch and TiB2/C green composite cathode is similar, and appears the largest mass loss rate in the temperature range from 200 to 600 ℃. The bulk density variation of sample K5 before and after baking is the largest （11.9%）, that of sample K25 is the second, and that of sample M5 is the smallest （6.7%）. The crushing strength of sample M5 is the biggest （51.2 MPa）, that of sample K2.5 is the next, and that of sample K5 is the smallest （32.8 MPa）. But, the orders of the electrical resistivity and electrolysis expansion of samples are just opposite with the order of crushing strength. The heating rate has a great impact on the microstructure of sample. The faster the heating rate is, the bigger the pore size and porosity of sample are. Compared with the heating rate between 200 and 600℃ of samples K25 and K5, that of sample M5 is slower and suitable for baking process of TiB2/C composite cathode material.

Effect of Baking Process on Microstructures and Mechanical Properties of Low Silicon TRIP Steel Sheet With Niobium

After 2% predeformation,the baking treatment with different schedule was carried out for low silicon TRIP steel sheet with niobium.The effects of baking temperature and time on microstructures and mechanical properties were investigated.The results showed that with increasing the baking temperature and time,the volume fraction of retained austenite decreases,and the volume fraction of tempered martensite increases; as baking temperature ranges from 80 ℃ to 170 ℃,the bake-hardening（BH）value increases obviously,while from 170 ℃ to 230 ℃,the variation of BH value is very slight; as baking time ranges from 2 min to 20 min,the BH value increases significantly,while the BH value decreases when baking time exceeds 20 min.So that when the baking temperature is 170 ℃ and the baking time is 20 min,the low silicon TRIP steel sheet exhibits good bake-hardening behavior,and the highest BH value is above 70 MPa.