By means of adding low content of rare earth element La into Sn60 Pb40 solder alloy, the growth of Cu 6Sn 5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solde...By means of adding low content of rare earth element La into Sn60 Pb40 solder alloy, the growth of Cu 6Sn 5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu 6Sn 5 growth is lowered by adding small content of La in Sn60 Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0 18% is the limited value and 0 08% is the best value.展开更多
文摘By means of adding low content of rare earth element La into Sn60 Pb40 solder alloy, the growth of Cu 6Sn 5 intermetallic compound at the interface of solder joint is hindered, and the thermal fatigue life of solder joint is increased by 2 times. The results of thermodynamic calculation based on diffusion kinetics show that, the driving force for Cu 6Sn 5 growth is lowered by adding small content of La in Sn60 Pb40 solder alloy. Meanwhile, there is an effective local mole fraction range of La, in which, 0 18% is the limited value and 0 08% is the best value.
