Mechanically activated W-Cu powders were sintered by a spark plasma sinteringsystem (SPS) in order to develop a new process and improve the properties of the alloy. Propertiessuch as density and hardness were measured...Mechanically activated W-Cu powders were sintered by a spark plasma sinteringsystem (SPS) in order to develop a new process and improve the properties of the alloy. Propertiessuch as density and hardness were measured. The microstructures of the sintered W-Cu alloy sampleswere observed by SEM (scanning electron microscope). The results show that spark plasma sinteringcan obviously lower the sintering temperature and increase the density of the alloy. This processcan also improve the hardness of the alloy. SPS is an effective method to obtain W-Cu powders withhigh density and superior physical properties.展开更多
Based on the thermodynamics and kinetics theory, a theoretical model was built to illuminate the formation of metal nanopowders by anodic arc discharging plasma method, and the mechanism of particle nucleation and gro...Based on the thermodynamics and kinetics theory, a theoretical model was built to illuminate the formation of metal nanopowders by anodic arc discharging plasma method, and the mechanism of particle nucleation and growth was investigated. In addition, the morphology, crystal structure, particle size and specific surface area of the nanopowders were characterized by X-ray diffraction(XRD), Brunauer-Emmett-Teller(BET) adsorption, transmission electron microscopy(TEM) and the corresponding selected area electron diffraction(SAED). The experimental results indicate that the nanopowders prepared by this process have uniform size, high purity, single phase and spherical shape. The crystal structure is FCC structure, the same as that of the bulk materials; the specific surface area is 12 m2/g, the particle size distribution ranges from 30 to 90 nm with an average particle size of 67 nm which is obtained from TEM and confirmed from XRD and BET results.展开更多
Copper nanoparticles were successfully prepared in large scale by means of anodic arc discharging plasma method in inert atmosphere. The particle size, specific surface area, crystal structure, and morphology of the s...Copper nanoparticles were successfully prepared in large scale by means of anodic arc discharging plasma method in inert atmosphere. The particle size, specific surface area, crystal structure, and morphology of the samples were characterized by X-ray diffraction （XRD）, BET equation, transmission electron microscopy （TEM）, and the corresponding selected area electron diffraction （SAED）. The experimental results indicate that the crystal structure of the samples is fcc structure the same as that of the bulk materials. The specific surface area is 11 m^2/g, the particle size distribution is 30 to 90 nm, and the average particle size is about 67 nm obtained from TEM and confirmed from XRD and BET results. The nanoparticles with uniform size, high purity, narrow size distribution and spherical shape can be prepared by this convenient and effective method.展开更多
Cu films of30nm and 15 nm thick were deposited on MgO(001) substrates at 185℃ by dc plasma-sputtering at 1.9kv and 8 mA in pure Ar gas. A dc bias voltage Vs, of 0 V or -80 V was applied to the substrate during depos...Cu films of30nm and 15 nm thick were deposited on MgO(001) substrates at 185℃ by dc plasma-sputtering at 1.9kv and 8 mA in pure Ar gas. A dc bias voltage Vs, of 0 V or -80 V was applied to the substrate during deposition. Structural and electrical proper-ties have been investigated by cross-sectional transmission electron microscopy (XTEM), high resolution XTEM (XHRTEM) and by measuring temperature coefficient of electrical resistance (TCR;η) in the temperature interval of-135℃ to 0 ℃. The Cu film is pol- ycrystalline at Vs= 0 V while it epitaxially grows with Cu(00 )|| MgO(00 1) and Cu[0 10] || MgO[010] at Vs,=-80 V. However, the latter has a very rough surface. The change of η with film thickness and Vs is interpreted in terms of the structure change. Misfit dislocations and lattice expansion are induced along the MgO surface to relax the strain energy due to the lattice mismatch between Cu and MgO.展开更多
W/Cu Functionally Graded Materials (FGM) was designed not only for reducing the thermal stress caused by the mismatch of thermal expansion coefficients, but also for combining the features of W, Mo - high plasma-erosi...W/Cu Functionally Graded Materials (FGM) was designed not only for reducing the thermal stress caused by the mismatch of thermal expansion coefficients, but also for combining the features of W, Mo - high plasma-erosion resistance and the advantages of Cu - high heat conductivity and ductility. Four different fabrication processes for W/Cu or Mo/Cu, including hot-pressing, Cu infiltration of sintered porosity-graded W skeleton, spark plasma sintering and plasma spraying, were investigated and compared. It was foundthat the hot-pressing process is difficult to keep the designed composition gradient, while the other three processes are successful in making W/Cu or Mo/Cu FGM. Meanwhile, microstructures and composition gradients are analyzed with SEM and EDAX.展开更多
This paper describes the electroless Ni or Cu plating of some fiuoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon() FEP, Nafion(), ACLAR()...This paper describes the electroless Ni or Cu plating of some fiuoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon() FEP, Nafion(), ACLAR() and LaRCTM-CP1 thin films which have recently gained a large scientific and technological interest due to their excellent thermal, chemical, mechanical and dielectric properties. The original approach implemented in the present work involves: (i)the grafting of nitrogen-containing functionalities on the polymer surfaces through plasma treatments in ammonia, (ii) the direct catalysis of the so-modified surfaces via their immersion in a simple acidic PdCl2 solution (i.e. without using a prior surface sensitization in an acidic SnCl2 solution), and finally (iii) the electroless metallization itself. However, prior to the immersion in the industrial plating baths, the chemical reduction of the Pd+2 species (species covalently tethered on the nitrogen-containing groups) to metallic palladium (PdO) is shown to be a key factor in catalyzing the electroless deposition initiation. This is made by immersion in an hypophosphite (H2PO2-) solution. Wettability measurements and X-ray photoelectron spectroscopy (XPS) experiments are used to characterize every surface modification step of the developed process. A cross-hatch tape test was used to asses the adhesion strength of the electroless films that is shown qualitatively good. In addition, a fragmentation test was developed in combination with electrical measurements. Its use allows to distinguish different adhesion levels at the metal/polymer interface and to evidence the influence of some processing parameters.展开更多
A novel chemical technique combined with unique plasma activated sintering（PAS） was utilized to prepare consolidated copper matrix composites（CMCs） by adding Cu-SnO2-rGO layered micro powders as reinforced fillers...A novel chemical technique combined with unique plasma activated sintering（PAS） was utilized to prepare consolidated copper matrix composites（CMCs） by adding Cu-SnO2-rGO layered micro powders as reinforced fillers into Cu matrix. The repeating Cu-SnO2-rGO structure was composed of inner dispersed reduced graphene oxide（r GO）, SnO2 as intermedia and outer Cu coating. SnO2 was introduced to the surface of rGO sheets in order to prevent the graphene aggregation with SnO2 serving as spacer and to provide enough active sites for subsequent Cu deposition. This process can guarantee rGO sheets to suffi ciently disperse and Cu nanoparticles to tightly and uniformly anchor on each layer of rGO by means of the SnO2 active sites as well as strictly control the reduction speed of Cu^2＋. The complete cover of Cu nanoparticles on rGO sheets thoroughly avoids direct contact among rGO layers. Hence, the repeating structure can simultaneously solve the wettability problem between rGO and Cu matrix as well as improve the bonding strength between rGO and Cu matrix at the well-bonded Cu-SnO2-rGO interface. The isolated rGO can effectively hinder the glide of dislocation at Cu-rGO interface and support the applied loads. Finally, the compressive strength of CMCs was enhanced when the strengthening effi ciency reached up to 41.展开更多
Copper nanopowders were successfully prepared by anodic arc discharging plasma method with home-made experimental apparatus.The effects of various processing parameters on the particle size of Cu nanopowders were inve...Copper nanopowders were successfully prepared by anodic arc discharging plasma method with home-made experimental apparatus.The effects of various processing parameters on the particle size of Cu nanopowders were investigated in the process,and the optimum processing parameters were obtained.In addition,the morphology,crystal structure,particle size distribution of the nanopowders were characterized via X-ray diffraction(XRD),transmission electron microscopy(TEM)and the corresponding selected area electron diffraction(SAED).The experimental results show that the crystal structure of the samples is the same fcc structure as that of the bulk materials.The processing parameters play a major role in controlling the particle size.The particle size increases with the increase of the arc current or gas pressure.展开更多
Nanocrystallized Al-10.0%Zn-3.0%Mg-1.8%Cu(mass fraction)alloy powder was prepared by cryomilling,and then the nanostructured powder was consolidated into bulk material by spark plasma sintering(SPS).The microstructura...Nanocrystallized Al-10.0%Zn-3.0%Mg-1.8%Cu(mass fraction)alloy powder was prepared by cryomilling,and then the nanostructured powder was consolidated into bulk material by spark plasma sintering(SPS).The microstructural evolution and phase transformation were studied.A supersaturated face-centered cubic solid solution is formed after cryomilling for 10 h,and the average grain size is 28 nm.Two typical nanostructures of the bulk nanostructured alloy are observed:primarily equiaxed grains with size of 150 nm,and occasionally occurring sub-micron grains up to 500 nm.Two types of MgZn2 particles precipitate during consolidation. One is the sub-micron particles distributed along the boundaries of the powders,and the other is fine particles with size of several nanometers in the matrix,especially at the boundaries of sub-micron grains.These second phase particles can be completely dissolved into matrix by proper solid solution treatment.展开更多
An atmospheric-pressure dielectric barrier discharge （DBD） gas-liquid cold plasma was employed to synthesize Cu-doped TiO~ nanoparticles in an aqueous solution with the assistance of [C2MIM]BF4 ionic liquid （IL） a...An atmospheric-pressure dielectric barrier discharge （DBD） gas-liquid cold plasma was employed to synthesize Cu-doped TiO~ nanoparticles in an aqueous solution with the assistance of [C2MIM]BF4 ionic liquid （IL） and using air as the working gas. The influences of the discharge voltage, IL and the amount of copper nitrite were investigated. X-ray diffraction, N2 adsorption-desorption measurements and UV-Vis spectroscopy were adopted to characterize the samples. The results showed that the specific surface area of TiO2 was promoted with Cu-doping （from 57.6 m^2.g^-1 to 106.2 m^2.g^-1 with 3% Cu-doping）, and the content of anatase was increased. Besides, the band gap energy of TiO~ with Cu-doping decreased according to the UV-Vis spec- troscopy test. The 3%Cu-IL-TiO2 samples showed the highest eificiency in degrading methylene blue （MB） dye solutions under simulated sunlight with an apparent rate constant of 0.0223 min-1, which was 1.2 times higher than that of non-doped samples. According to the characterization results, the reasons for the high photocatalytic activity were discussed.展开更多
基金This work was financially supported by the National Natural Science Foundation of China (No. 50174007)
文摘Mechanically activated W-Cu powders were sintered by a spark plasma sinteringsystem (SPS) in order to develop a new process and improve the properties of the alloy. Propertiessuch as density and hardness were measured. The microstructures of the sintered W-Cu alloy sampleswere observed by SEM (scanning electron microscope). The results show that spark plasma sinteringcan obviously lower the sintering temperature and increase the density of the alloy. This processcan also improve the hardness of the alloy. SPS is an effective method to obtain W-Cu powders withhigh density and superior physical properties.
基金Project (3ZS042-B25-017) supported by the Natural Science Foundation of Gansu Province, China
文摘Based on the thermodynamics and kinetics theory, a theoretical model was built to illuminate the formation of metal nanopowders by anodic arc discharging plasma method, and the mechanism of particle nucleation and growth was investigated. In addition, the morphology, crystal structure, particle size and specific surface area of the nanopowders were characterized by X-ray diffraction(XRD), Brunauer-Emmett-Teller(BET) adsorption, transmission electron microscopy(TEM) and the corresponding selected area electron diffraction(SAED). The experimental results indicate that the nanopowders prepared by this process have uniform size, high purity, single phase and spherical shape. The crystal structure is FCC structure, the same as that of the bulk materials; the specific surface area is 12 m2/g, the particle size distribution ranges from 30 to 90 nm with an average particle size of 67 nm which is obtained from TEM and confirmed from XRD and BET results.
基金This work was financially supported by the Natural Science Foundation of Gansu Province, China (No. 3ZS042-B25-017)
文摘Copper nanoparticles were successfully prepared in large scale by means of anodic arc discharging plasma method in inert atmosphere. The particle size, specific surface area, crystal structure, and morphology of the samples were characterized by X-ray diffraction （XRD）, BET equation, transmission electron microscopy （TEM）, and the corresponding selected area electron diffraction （SAED）. The experimental results indicate that the crystal structure of the samples is fcc structure the same as that of the bulk materials. The specific surface area is 11 m^2/g, the particle size distribution is 30 to 90 nm, and the average particle size is about 67 nm obtained from TEM and confirmed from XRD and BET results. The nanoparticles with uniform size, high purity, narrow size distribution and spherical shape can be prepared by this convenient and effective method.
文摘Cu films of30nm and 15 nm thick were deposited on MgO(001) substrates at 185℃ by dc plasma-sputtering at 1.9kv and 8 mA in pure Ar gas. A dc bias voltage Vs, of 0 V or -80 V was applied to the substrate during deposition. Structural and electrical proper-ties have been investigated by cross-sectional transmission electron microscopy (XTEM), high resolution XTEM (XHRTEM) and by measuring temperature coefficient of electrical resistance (TCR;η) in the temperature interval of-135℃ to 0 ℃. The Cu film is pol- ycrystalline at Vs= 0 V while it epitaxially grows with Cu(00 )|| MgO(00 1) and Cu[0 10] || MgO[010] at Vs,=-80 V. However, the latter has a very rough surface. The change of η with film thickness and Vs is interpreted in terms of the structure change. Misfit dislocations and lattice expansion are induced along the MgO surface to relax the strain energy due to the lattice mismatch between Cu and MgO.
文摘W/Cu Functionally Graded Materials (FGM) was designed not only for reducing the thermal stress caused by the mismatch of thermal expansion coefficients, but also for combining the features of W, Mo - high plasma-erosion resistance and the advantages of Cu - high heat conductivity and ductility. Four different fabrication processes for W/Cu or Mo/Cu, including hot-pressing, Cu infiltration of sintered porosity-graded W skeleton, spark plasma sintering and plasma spraying, were investigated and compared. It was foundthat the hot-pressing process is difficult to keep the designed composition gradient, while the other three processes are successful in making W/Cu or Mo/Cu FGM. Meanwhile, microstructures and composition gradients are analyzed with SEM and EDAX.
文摘This paper describes the electroless Ni or Cu plating of some fiuoropolymer substrates through a tin-free activation process. Materials subjected to surface metallization are commercial Teflon() FEP, Nafion(), ACLAR() and LaRCTM-CP1 thin films which have recently gained a large scientific and technological interest due to their excellent thermal, chemical, mechanical and dielectric properties. The original approach implemented in the present work involves: (i)the grafting of nitrogen-containing functionalities on the polymer surfaces through plasma treatments in ammonia, (ii) the direct catalysis of the so-modified surfaces via their immersion in a simple acidic PdCl2 solution (i.e. without using a prior surface sensitization in an acidic SnCl2 solution), and finally (iii) the electroless metallization itself. However, prior to the immersion in the industrial plating baths, the chemical reduction of the Pd+2 species (species covalently tethered on the nitrogen-containing groups) to metallic palladium (PdO) is shown to be a key factor in catalyzing the electroless deposition initiation. This is made by immersion in an hypophosphite (H2PO2-) solution. Wettability measurements and X-ray photoelectron spectroscopy (XPS) experiments are used to characterize every surface modification step of the developed process. A cross-hatch tape test was used to asses the adhesion strength of the electroless films that is shown qualitatively good. In addition, a fragmentation test was developed in combination with electrical measurements. Its use allows to distinguish different adhesion levels at the metal/polymer interface and to evidence the influence of some processing parameters.
基金Funded by the National Natural Science Foundation of China(51572208)the 111 Project(B13035)+1 种基金the National Natural Science Foundation of Hubei Province(2014CFB257 and 2014CFB258)the Fundamental Research Funds for the Central Universities(WUT:2015-III-059)
文摘A novel chemical technique combined with unique plasma activated sintering（PAS） was utilized to prepare consolidated copper matrix composites（CMCs） by adding Cu-SnO2-rGO layered micro powders as reinforced fillers into Cu matrix. The repeating Cu-SnO2-rGO structure was composed of inner dispersed reduced graphene oxide（r GO）, SnO2 as intermedia and outer Cu coating. SnO2 was introduced to the surface of rGO sheets in order to prevent the graphene aggregation with SnO2 serving as spacer and to provide enough active sites for subsequent Cu deposition. This process can guarantee rGO sheets to suffi ciently disperse and Cu nanoparticles to tightly and uniformly anchor on each layer of rGO by means of the SnO2 active sites as well as strictly control the reduction speed of Cu^2＋. The complete cover of Cu nanoparticles on rGO sheets thoroughly avoids direct contact among rGO layers. Hence, the repeating structure can simultaneously solve the wettability problem between rGO and Cu matrix as well as improve the bonding strength between rGO and Cu matrix at the well-bonded Cu-SnO2-rGO interface. The isolated rGO can effectively hinder the glide of dislocation at Cu-rGO interface and support the applied loads. Finally, the compressive strength of CMCs was enhanced when the strengthening effi ciency reached up to 41.
基金Project(3ZS042-B25-017)supported by the Natural Science Foundation of Gansu Province,China
文摘Copper nanopowders were successfully prepared by anodic arc discharging plasma method with home-made experimental apparatus.The effects of various processing parameters on the particle size of Cu nanopowders were investigated in the process,and the optimum processing parameters were obtained.In addition,the morphology,crystal structure,particle size distribution of the nanopowders were characterized via X-ray diffraction(XRD),transmission electron microscopy(TEM)and the corresponding selected area electron diffraction(SAED).The experimental results show that the crystal structure of the samples is the same fcc structure as that of the bulk materials.The processing parameters play a major role in controlling the particle size.The particle size increases with the increase of the arc current or gas pressure.
基金Project(2002AA302502)supported by the Hi-tech Research and Development Program of ChinaProject(20050008016)supported by the Research Fund for the Doctoral Program of Higher Education,China
文摘Nanocrystallized Al-10.0%Zn-3.0%Mg-1.8%Cu(mass fraction)alloy powder was prepared by cryomilling,and then the nanostructured powder was consolidated into bulk material by spark plasma sintering(SPS).The microstructural evolution and phase transformation were studied.A supersaturated face-centered cubic solid solution is formed after cryomilling for 10 h,and the average grain size is 28 nm.Two typical nanostructures of the bulk nanostructured alloy are observed:primarily equiaxed grains with size of 150 nm,and occasionally occurring sub-micron grains up to 500 nm.Two types of MgZn2 particles precipitate during consolidation. One is the sub-micron particles distributed along the boundaries of the powders,and the other is fine particles with size of several nanometers in the matrix,especially at the boundaries of sub-micron grains.These second phase particles can be completely dissolved into matrix by proper solid solution treatment.
基金supported by National Natural Science Foundation of China(Nos.21173028,11505019)the Science and Technology Research Project of Liaoning Provincial Education Department(No.L2013464)+2 种基金the Scientific Research Foundation for the Doctor of Liaoning Province(No.20131004)the Program for Liaoning Excellent Talents in University(No.LR2012042)Dalian Jinzhou New District Science and Technology Plan Project(No.KJCX-ZTPY-2014-0001)
文摘An atmospheric-pressure dielectric barrier discharge （DBD） gas-liquid cold plasma was employed to synthesize Cu-doped TiO~ nanoparticles in an aqueous solution with the assistance of [C2MIM]BF4 ionic liquid （IL） and using air as the working gas. The influences of the discharge voltage, IL and the amount of copper nitrite were investigated. X-ray diffraction, N2 adsorption-desorption measurements and UV-Vis spectroscopy were adopted to characterize the samples. The results showed that the specific surface area of TiO2 was promoted with Cu-doping （from 57.6 m^2.g^-1 to 106.2 m^2.g^-1 with 3% Cu-doping）, and the content of anatase was increased. Besides, the band gap energy of TiO~ with Cu-doping decreased according to the UV-Vis spec- troscopy test. The 3%Cu-IL-TiO2 samples showed the highest eificiency in degrading methylene blue （MB） dye solutions under simulated sunlight with an apparent rate constant of 0.0223 min-1, which was 1.2 times higher than that of non-doped samples. According to the characterization results, the reasons for the high photocatalytic activity were discussed.
