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Spark plasma sintering on mechanically activated W-Cu powders 被引量:7
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作者 JIAChengchang LIZhigang HEYuntao QUXuanhui 《Rare Metals》 SCIE EI CAS CSCD 2004年第3期269-273,共5页
Mechanically activated W-Cu powders were sintered by a spark plasma sinteringsystem (SPS) in order to develop a new process and improve the properties of the alloy. Propertiessuch as density and hardness were measured... Mechanically activated W-Cu powders were sintered by a spark plasma sinteringsystem (SPS) in order to develop a new process and improve the properties of the alloy. Propertiessuch as density and hardness were measured. The microstructures of the sintered W-Cu alloy sampleswere observed by SEM (scanning electron microscope). The results show that spark plasma sinteringcan obviously lower the sintering temperature and increase the density of the alloy. This processcan also improve the hardness of the alloy. SPS is an effective method to obtain W-Cu powders withhigh density and superior physical properties. 展开更多
关键词 powder metallurgy W-cu alloy spark plasma sintering mechanical activation
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Effect of closed-couple gas atomization pressure on the performances of Al-20Sn-1Cu powders 被引量:1
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作者 ZHAO Xinming XU Jun ZHU Xuexin ZHANG Shaoming 《Rare Metals》 SCIE EI CAS CSCD 2008年第4期439-443,共5页
Al-20Sn-1Cu powders were prepared by gas atomization in an argon atmosphere with atomizing pressures of 1.1 and 1.6 MPa. The characteristics of the powders are determined by means of dry sieving, scanning electron mic... Al-20Sn-1Cu powders were prepared by gas atomization in an argon atmosphere with atomizing pressures of 1.1 and 1.6 MPa. The characteristics of the powders are determined by means of dry sieving, scanning electron microscopy (SEM), optical microscopy (OM), and X-ray diffractometry (XRD). The results show that the powders exhibit a bimodal size distribution and a higher gas pressure results in a broad size distribution. All particles in both cases are spherical or nearly spherical and satellites form on the surface of coarse particles. Dendritic and cellular structures coexist in the particle. With decreasing particle diameter, the secondary dendrite arm spacing (SDAS) decreases and the cooling rate increases. The particles processed under high gas atomization pressure (1.6 MPa) exhibit a lower SDAS value and a higher cooling rate than those of the same size under low gas atomization pressure (1.1 MPa). The XRD results show that the Sn content increases with decreasing particle size. 展开更多
关键词 powder production Al-Sn-cu alloy gas atomization rapid solidification particle size distribution
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Cu含量对多孔Ti-5Mn合金微观结构及力学性能的影响
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作者 赵朝勇 伍彩虹 麦萍 《稀有金属与硬质合金》 CAS CSCD 北大核心 2024年第1期57-62,共6页
以质量分数为50%的碳酸氢铵颗粒为造孔剂,使用粉末冶金工艺经真空烧结制备出多孔Ti-5Mn-xCu(x=0,3,5,10)合金,并研究了Cu含量对多孔Ti-5Mn合金微观结构及力学性能的影响。研究结果显示,制备得到的多孔Ti-Mn-Cu合金的孔隙率随着Cu含量的... 以质量分数为50%的碳酸氢铵颗粒为造孔剂,使用粉末冶金工艺经真空烧结制备出多孔Ti-5Mn-xCu(x=0,3,5,10)合金,并研究了Cu含量对多孔Ti-5Mn合金微观结构及力学性能的影响。研究结果显示,制备得到的多孔Ti-Mn-Cu合金的孔隙率随着Cu含量的增加而逐渐降低,其大孔孔径略为减小,大孔壁上微孔数量逐渐减少。多孔Ti-Mn-Cu合金中出现了Ti_(2)Cu相,并且其相对含量随着Cu含量的增加逐渐增多。多孔Ti-Mn-Cu合金的弹性模量和抗压强度均随Cu含量的增加而提高。含3%~10%Cu和5%Mn的多孔Ti-Mn-Cu合金具有合适的孔结构和与人体骨相近的力学性能,具有作为抗菌骨科植入材料的潜力。 展开更多
关键词 多孔钛合金 Ti-Mn-cu 碳酸氢铵 抗菌性 骨修复材料 粉末冶金
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同质异构Al-Cu-Mg系混晶粉末冶金制备新方法 被引量:1
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作者 于涛 李峰 +1 位作者 王野 李学问 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2023年第2期371-382,共12页
为突破传统同质粉末材料均以颗粒尺寸细化作为改性的单一途径禁锢,提出同质异构思想,即通过低能球磨将不同粒径的AA2024合金粉末按照一定比例混合,经热压烧结制备混晶坯料。研究结果表明,传统单一粒径粉末烧结后晶粒形貌趋向于不规则多... 为突破传统同质粉末材料均以颗粒尺寸细化作为改性的单一途径禁锢,提出同质异构思想,即通过低能球磨将不同粒径的AA2024合金粉末按照一定比例混合,经热压烧结制备混晶坯料。研究结果表明,传统单一粒径粉末烧结后晶粒形貌趋向于不规则多边形状,而不同粒径粉末混合烧结后晶粒形貌为小颗粒包覆大颗粒的结构形式;与前者相比,当粗粉占比为20%(质量分数)时,抗拉强度增加了38.8%;当粗粉占比为50%时,伸长率提高了14%。粉末混合后的烧结样品呈沿晶断裂和穿晶断裂的混合断裂机制,第二相对位错的钉扎效应更加明显,因此,合金性能得到显著提高。此研究工作为高性能同质异构混晶材料的制备提供了一种新思路。 展开更多
关键词 同质异构 AL-cu-MG合金 混晶 粉末冶金
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多孔Ni-Cu-Ti电极的制备及析氢性能
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作者 吴靓 周子坤 +2 位作者 姬丽 肖逸锋 张乾坤 《材料导报》 CSCD 北大核心 2023年第13期155-163,共9页
通过电解水生产氢气是一种理想的方法,而电极材料的催化活性决定了电解水的效率。该研究通过粉末冶金方法制备了多孔Ni-Cu-Ti电极,利用扫描电子显微镜(SEM)、X射线衍射(XRD)等技术对多孔Ni-Cu-Ti电极的微观结构和物相组成进行表征,并通... 通过电解水生产氢气是一种理想的方法,而电极材料的催化活性决定了电解水的效率。该研究通过粉末冶金方法制备了多孔Ni-Cu-Ti电极,利用扫描电子显微镜(SEM)、X射线衍射(XRD)等技术对多孔Ni-Cu-Ti电极的微观结构和物相组成进行表征,并通过阴极极化、交流阻抗谱和循环伏安测试技术对电极进行了电化学表征。结果表明,在烧结温度为1000℃、质量比为5.5∶3.5∶1时,多孔Ni-Cu-Ti电极表现出最佳的析氢性能,在1 mol/L的KOH中仅需要79 mV(vs.RHE)的过电位就能实现10 mA·cm^(-2)的电流密度,其Tafel斜率为117.07 mV·dec-1。 展开更多
关键词 多孔材料 Ni-cu-Ti合金电极 粉末冶金 析氢反应
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Cu含量对Zn-2.0Mg-xCu合金组织与性能的影响
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作者 于景媛 李强 +1 位作者 赵特 孙旭东 《热加工工艺》 北大核心 2023年第4期37-43,共7页
采用粉末冶金技术制备了Zn-2.0Mg-xCu合金,研究Cu元素对于Zn基合金显微组织、力学性能、耐腐蚀性能和抗菌性能的影响。结果表明:Zn-2.0Mg-xCu合金(x=0.5wt%~2.0wt%)均由η-Zn相和Mg_(2)Zn_(11)相组成,随着Cu含量的增加,Zn-2.0Mg-xCu合... 采用粉末冶金技术制备了Zn-2.0Mg-xCu合金,研究Cu元素对于Zn基合金显微组织、力学性能、耐腐蚀性能和抗菌性能的影响。结果表明:Zn-2.0Mg-xCu合金(x=0.5wt%~2.0wt%)均由η-Zn相和Mg_(2)Zn_(11)相组成,随着Cu含量的增加,Zn-2.0Mg-xCu合金中的孔隙增多,显微硬度和抗压强度均出现先增加而后降低的现象。380℃烧结2 h后Zn-2.0Mg-1.5Cu合金的显微硬度和抗压强度达到最大,为77.3 HV和126.7 MPa。随着合金中Cu含量的增加,Zn-2.0Mg-xCu合金的维钝电流密度、腐蚀速率和失重均增加,人工模拟体液腐蚀浸泡14 d后,Zn-2.0Mg-xCu合金表面逐渐出现明显的腐蚀坑。对Zn-2.0Mg-xCu合金进行的抗菌性研究结果表明:Zn-2.0Mg-xCu合金对金黄色葡萄球菌和大肠杆菌均表现出良好的杀灭和抑制增殖效果,随着Cu含量的增加,Zn-2.0Mg-xCu合金的抗菌效果越明显。 展开更多
关键词 粉末冶金 Zn-Mg-cu合金 力学性能 耐腐蚀性 抗菌性
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Microstructures of Sintered Mo-Cu Alloys with Mechanically Activated Powder 被引量:7
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作者 Chengchang Jia, Zhong He, Xuekuan Su, Ziqin Yang, Jun Zhao, Zizhang Xie (School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China Beliing Polytechnic University, Beijing 100022, Beijing) 《Rare Metals》 SCIE EI CAS CSCD 2001年第2期112-116,共5页
Mechanical activation and liquid phase sintering were used to manufacture high performance Mo-Cu alloy and develop new processes. The microstructures and properties of the alloy were investigated. The experimental res... Mechanical activation and liquid phase sintering were used to manufacture high performance Mo-Cu alloy and develop new processes. The microstructures and properties of the alloy were investigated. The experimental results showed that: (1) the ball milled Mo/Cu powder has lamellar structure, (2) the microstructures of the sintered Mo-Cu alloy were homogenous compound structures of adhesive phase Cu linking Mo grains, (3) Mo grains frequently strung or gathered in Cu phase, and (4) the full densities of Mo-Cu alloy was achieved through sintering and special densification process. As a result, the properties of the alloy are good enough to satisfy various requirements. 展开更多
关键词 Mo-cu alloy powder metallurgy mechanical activation microstructure
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Microstructural evolution during direct laser sintering of multi-component Cu-based metal powder 被引量:1
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作者 沈以赴 顾冬冬 +2 位作者 吴鹏 杨家林 王洋 《中国有色金属学会会刊:英文版》 EI CSCD 2005年第6期1309-1314,共6页
A multi-component Cu-based metal powder was chosen for direct laser sintering. The powder consists of a mixture of high-purity Cu powder, pre-alloyed CuSn and CuP powder. Liquid phase sintering with complete melting o... A multi-component Cu-based metal powder was chosen for direct laser sintering. The powder consists of a mixture of high-purity Cu powder, pre-alloyed CuSn and CuP powder. Liquid phase sintering with complete melting of the binder (CuSn) but non-melting of the cores of structural metal (Cu) proves to be a feasible mechanism for laser sintering of this powder system. The microstructural evolution of the sintered powder with variation of laser processing parameters was presented. High sintering activities and sound densification response were obtained by optimizing the laser powers and scan speeds. Using a high laser power accompanied by a high scan speed gives rise to balling effect. At a high laser power with a slow scan speed the sintering mechanism may change into complete melting/solidification, which decreases the obtainable sintered density. The role of additive phosphorus in the laser sintering process is addressed. Phosphorus can act as a fluxing agent and has a preferential reaction with oxygen to form phosphatic slag, protecting the Cu particles from oxidation. The phosphatic slag shows a concentration along grain boundaries due to its light mass as well as the short thermal cycle of SLS. 展开更多
关键词 显微结构 铜基金属粉末 激光烧结 液相烧结
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Preparation and characterization of Mo-Cu nanocomposite powders by chemical liquid reduction process
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作者 李翼 王德志 孙翱魁 《Journal of Central South University》 SCIE EI CAS 2013年第3期587-591,共5页
A novel chemical liquid reduction process was employed to prepare nanosized Mo-Cu powders.The precipitates were first obtained by adding ammonium heptamolybdate((NH4)6Mo7O24·4H2O) solution into excess hydrazine h... A novel chemical liquid reduction process was employed to prepare nanosized Mo-Cu powders.The precipitates were first obtained by adding ammonium heptamolybdate((NH4)6Mo7O24·4H2O) solution into excess hydrazine hydrate solution,and then mixed the copper chloride solution.The precipitates were subsequently washed,dried,followed by reducing in H2 atmosphere to convert into Mo-Cu composite powders.The composition,morphology and particle size of the Mo-Cu composite powders were characterized by the XRD,SEM and TEM.The effects of the chemical reaction temperature and the magnetic stirring on the morphology of the Mo-Cu powders were also studied.The results show that Mo-Cu powders produced by the chemical liquid reduction process are nearly spherical shape and dispersive distribution state,with particle size ranging from 50 to 100 nm.The chemical reaction temperature and magnetic stirring will change the particle feature of the powders.Because of the Cu3Mo2O9,the reduction process in H2 is the one-stage reduction from the precipitates to the Mo-Cu composite powders. 展开更多
关键词 化学反应 还原过程 复合粉体 表征 制备 液相 氯化铜溶液 复合粉末
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Microstructure and Properties of W-Cu Alloys Prepared with Mechanically Activated Powder 被引量:5
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作者 Chengchang Jia, Xiuhu Guan, Xuekuan Su, Changheng Hou, Shimin Fan, Jun Zhao, Zizhang Xie (Material Science and Engineering School, University of Science and Technology Beijing, Beijing 100083, China) (Beijing Research Institute of Powder Metallurgy, Beiji 《Journal of University of Science and Technology Beijing》 CSCD 2001年第2期129-132,共4页
W-15% Cu (mass fraction) alloys were sintered with mechanically activated powder in order to develop new preparing processes and improve properties of alloys. The microstructures of the activated powder and the sinter... W-15% Cu (mass fraction) alloys were sintered with mechanically activated powder in order to develop new preparing processes and improve properties of alloys. The microstructures of the activated powder and the sintered alloy were observed. Properties such as density were measured. The results show that through mechanical activation, the particle size of the powder becomes finer to sub-micron or nanometer level, some copper was soluble in tungsten, and high density W-Cu alloys can be obtained by mechanically activated powder for its action to the activation sintering. 展开更多
关键词 powder metallurgy mechanical activation W-cu alloys SINTERING
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Preparation of nanosized W/Cu composite powder by sol-gel technique 被引量:9
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作者 LIBinghu KANGZhanying +1 位作者 CHENWenge DINGBingjun 《Rare Metals》 SCIE EI CAS CSCD 2005年第2期170-173,共4页
Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an... Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing. 展开更多
关键词 COMPOSITE nanosized composite powder SOL-GEL particle size W/cu
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Fabrication of W@Cu Composite Powders by Direct Electroless Plating Using a Dripping Method
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作者 刘树龙 YU Kan +4 位作者 沈强 LI Meijuan CHEN Wenshu LUO Guoqiang ZHANG Lianmeng 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2013年第4期829-833,共5页
A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C2H203) as a reducing agent was reported. The effects of copper sul... A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C2H203) as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions (flow rate of C2H203 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35℃) by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu~. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed. 展开更多
关键词 dripping method electroless plating W@cu composite powders characterization
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Synthesis and characterization of carbon nanotubes reinforced AI-Si-Cu brazing powder
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作者 亓钧雷 张大磊 +3 位作者 张夫 曹健 张丽霞 冯吉才 《China Welding》 EI CAS 2014年第1期46-50,共5页
In this paper, an approach to synthesizing carbon nanotubes ( CNTs ) reinforced A1-Si-Cu brazing powder was studied, which was accomplished by in-situ growth of the CNTs on the Al-Si-Cu powder at a relatively low te... In this paper, an approach to synthesizing carbon nanotubes ( CNTs ) reinforced A1-Si-Cu brazing powder was studied, which was accomplished by in-situ growth of the CNTs on the Al-Si-Cu powder at a relatively low temperature by plasma enhanced chemical vapor deposition ( PECVD ). The synthesis parameters were optimized. The component of brazing powder was analyzed by X-ray diffraction ( XRD ). The microstracture and dispersity of as-grown CNTs were investigated by scanning electron microscopy (SEM). The graphitization and defects were characterized by Raman spectroscopy. The asgrown CNTs on Al-Si-Cu powder disperse uniformly and have moderate length and density, meanwhile its sp2 structure dominates minor quantity of amorphous carbons and defected carbon structures. 展开更多
关键词 carbon nanotubes AL-SI-cu brazing powder CHARACTERIZATION
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Cu基粉末冶金闸片高速制动性能 被引量:1
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作者 刘思涵 耿雪骞 +6 位作者 王晔 马运章 陈德峰 张波 曹宏发 齐冀 吕宝佳 《粉末冶金技术》 CAS CSCD 北大核心 2023年第3期210-217,共8页
Cu基粉末冶金闸片在高速制动时受温度的影响易发生摩擦系数的衰退,直接影响列车制动的有效性。利用1:1制动试验台进行不同速度下Cu基粉末冶金闸片的高速制动试验,分析试验后的摩擦材料和磨屑组织。结果表明:制动速度为350 km·h^(-1... Cu基粉末冶金闸片在高速制动时受温度的影响易发生摩擦系数的衰退,直接影响列车制动的有效性。利用1:1制动试验台进行不同速度下Cu基粉末冶金闸片的高速制动试验,分析试验后的摩擦材料和磨屑组织。结果表明:制动速度为350 km·h^(-1)和380 km·h^(-1)产生的高温使摩擦材料表层的金属基体发生软化熔融,降低了摩擦副表面微凸点的剪切阻力,导致摩擦系数下降。摩擦表面形成的金属氧化膜具有减磨作用,造成摩擦系数的进一步衰退。在380 km·h^(-1)制动时,石墨在高温下被氧化,摩擦表面失去稳定的润滑膜,出现粘着磨损和材料转移,磨耗量大幅增加。 展开更多
关键词 cu基粉末冶金闸片 摩擦材料 磨耗量 高速制动 衰退
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基于机器学习的间歇式电沉积制备W@Cu核-壳粉体模型的构建与应用 被引量:1
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作者 邓楠 梁淑华 李建强 《粉末冶金材料科学与工程》 2023年第1期20-27,共8页
W和Cu两相的均匀分布对获得高性能W-Cu复合材料至关重要。本文主要研究基于机器学习的间歇式电沉积制备W、Cu均匀分布的W@Cu粉体模型的构建与应用。首先,建立间歇式电沉积制备W@Cu核-壳粉体的机器学习模型,确定核-壳粉体理论镀层厚度与... W和Cu两相的均匀分布对获得高性能W-Cu复合材料至关重要。本文主要研究基于机器学习的间歇式电沉积制备W、Cu均匀分布的W@Cu粉体模型的构建与应用。首先,建立间歇式电沉积制备W@Cu核-壳粉体的机器学习模型,确定核-壳粉体理论镀层厚度与电流、电沉积时间、待镀粉体粒径和承载量之间的关联,然后在承载量为1000 g的装置中进行实验验证。将W@Cu核-壳粉体在1375℃下进行无压烧结,研究成形压力对W-Cu复合材料致密度、烧结收缩率和电导率的影响。结果表明,在电流密度为7 A/dm^(2)、电沉积时间为6 h时,实际镀层厚度为3.93μm,与理论镀层厚度3.15μm相符。提高成形压力有利于获得高致密度、低烧结收缩率的W-Cu复合材料。同时,核-壳粉体在显微组织中形成Cu的导电通道,有利于复合材料电导率的提升。 展开更多
关键词 W-cu复合材料 电沉积 核-壳粉体 机器学习 微观结构
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不同功率超声辅助电火花放电制备Cu-Ni合金粉体的微观结构和粒径分布
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作者 魏亚洲 刘一凡 李翔龙 《机械工程材料》 CAS CSCD 北大核心 2023年第1期76-80,共5页
以铜、镍金属为正负电极,采用超声辅助电火花放电(EDM)法合成Cu-Ni合金粉体,研究了超声功率(0,500,1000,1500 W)对合金粉体晶体结构、微观形貌和粒径分布的影响。结果表明:不同功率超声辅助EDM合成的Cu-Ni合金粉体的物相均主要由Cu_(0.8... 以铜、镍金属为正负电极,采用超声辅助电火花放电(EDM)法合成Cu-Ni合金粉体,研究了超声功率(0,500,1000,1500 W)对合金粉体晶体结构、微观形貌和粒径分布的影响。结果表明:不同功率超声辅助EDM合成的Cu-Ni合金粉体的物相均主要由Cu_(0.81)Ni_(0.19)、Ni、CuO、NiO和Fe_(2)O_(3)组成,主晶相Cu_(0.81)Ni_(0.19)为面心立方结构;随着超声功率的增加,Cu_(0.81)Ni_(0.19)相的衍射峰强度增大,半高宽变窄,粉体结晶性变好。引入超声辅助合成的Cu-Ni合金粉体中出现较大尺寸不规则颗粒,但球形颗粒的尺寸减小,粉体粒径分布范围变宽;随着超声功率的增大,平均粒径D50减小。 展开更多
关键词 电火花放电加工 cu-Ni合金粉体 超声功率 晶体结构 粒径
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添加铁元素对Cu-10Al-4Ni粉末冶金合金组织和性能的影响
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作者 寿德荣 邓正华(指导) 张朝阳 《机械工程材料》 CAS CSCD 北大核心 2023年第8期18-22,共5页
以铜粉、铝粉、镍粉和铜包铁粉为原料,采用粉末冶金工艺制备含不同质量分数(0,1.6%,3.2%,4.8%,6.4%)铁元素的Cu-10Al-4Ni合金,研究了铁含量对合金显微组织和性能的影响。结果表明:未添加铁元素的合金组织由κ_(Ⅲ)相、α相和Al_(4)Cu_(9... 以铜粉、铝粉、镍粉和铜包铁粉为原料,采用粉末冶金工艺制备含不同质量分数(0,1.6%,3.2%,4.8%,6.4%)铁元素的Cu-10Al-4Ni合金,研究了铁含量对合金显微组织和性能的影响。结果表明:未添加铁元素的合金组织由κ_(Ⅲ)相、α相和Al_(4)Cu_(9)相组成;当添加质量分数1.6%的铁元素后,合金中的κⅢ相增多,Al_(4)Cu_(9)相减少;当铁元素质量分数达到3.2%时,Al_(4)Cu_(9)相进一步减少,合金中析出κ_(Ⅰ)相和κ_(Ⅱ)相;随着铁含量继续增加,Al_(4)Cu_(9)相消失,κ_(Ⅰ)相增多,而κ_(Ⅲ)相开始减少。随着铁含量的增加,合金的烧结密度减小,硬度先降低后增加再降低,当铁质量分数达到3.2%时硬度最大;合金的屈服强度随铁含量增加呈波动变化,当铁质量分数达到4.8%时屈服强度最大。 展开更多
关键词 粉末冶金 cu-Al-Ni合金 铜包铁 显微组织 屈服强度
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Ti_(2)AlC粉末粒径分布对TiC_(0.5)-Al_(2)O_(3)/Cu复合材料组织及性能的影响
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作者 聂智超 严仰先 +4 位作者 洪嘉婷 廖航宇 宋文龙 邹金明 张雪辉(导师) 《机械工程材料》 CAS CSCD 北大核心 2023年第3期66-71,共6页
通过不同时间的湿法球磨得到不同粒径分布的Ti_(2)AlC粉末,再与Cu_(2)O粉末和铜粉末混合,利用放电等离子烧结技术制备TiC_(0.5)-Al_(2)O_(3)/Cu复合材料,研究了Ti_(2)AlC粉末粒径分布对其组织和性能的影响。结果表明:随着Ti_(2)AlC粉末... 通过不同时间的湿法球磨得到不同粒径分布的Ti_(2)AlC粉末,再与Cu_(2)O粉末和铜粉末混合,利用放电等离子烧结技术制备TiC_(0.5)-Al_(2)O_(3)/Cu复合材料,研究了Ti_(2)AlC粉末粒径分布对其组织和性能的影响。结果表明:随着Ti_(2)AlC粉末中亚微米级颗粒体积分数由0增加到70.27%,复合材料中增强相颗粒TiC_(0.5)和Al_(2)O_(3)在基体中分散更均匀,但是当亚微米级颗粒体积分数为98.07%时,增强相颗粒出现聚集现象;随着亚微米级颗粒体积分数的增加,复合材料的导电率与相对密度先减小后增大,硬度与屈服强度则先升后降,当亚微米级颗粒体积分数为70.27%时,复合材料综合性能最优异。 展开更多
关键词 TiC_(0.5)-Al_(2)O_(3)/cu复合材料 Ti_(2)AlC粉末粒径 力学性能
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Preparation for intermetallic powders of Cu-Sn and Cu-Ni-Sn systems via solid-liquid reaction milling technique
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作者 陈鼎 吴薇 +2 位作者 陈振华 傅定发 陈刚 《中国有色金属学会会刊:英文版》 CSCD 2007年第A02期594-598,共5页
The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique. The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different inter... The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique. The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different intervals. Two kinds of binary intermetallics were obtained. For 12 h,Cu6Sn5 was prepared by milling Sn melt at 573 K while Cu3Sn by milling Sn melt at 773 K. And a mixture of Cu6Sn5 and Cu3Sn was fabricated at 673 K. All these intermetallic powders had mean grain sizes of less than 100 nm. A finer microstructure was obtained by milling Sn melt blended with 20%(mass fraction) Ni powders at 573 K for 12 h. The reaction mechanism and advantages were discussed in comparison with that of high-energy ball milling. The results show the solutionizing of Ni powders in the Cu6Sn5 intermetallic. 展开更多
关键词 粉末冶金 铜-锡合金 金属粉末 固-液反应技术
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AlN覆钨对AlN/W-Cu复合材料组织和性能的影响
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作者 喻新喜 周锐 +3 位作者 杨光 魏邦争 陈鹏起 程继贵 《中国有色金属学报》 EI CAS CSCD 北大核心 2023年第4期1120-1128,共9页
采用溶胶凝胶法对AlN粉体进行表面覆W后,将其与适量W粉混合,经压制、预烧结,制得多孔AlN/W骨架,再熔渗Cu后制备出不同AlN含量(0~8%)的AlN/W-Cu复合材料。考察了AlN含量对于烧结体微观组织、力学性能和热学性能的影响,并与由未覆钨AlN粉... 采用溶胶凝胶法对AlN粉体进行表面覆W后,将其与适量W粉混合,经压制、预烧结,制得多孔AlN/W骨架,再熔渗Cu后制备出不同AlN含量(0~8%)的AlN/W-Cu复合材料。考察了AlN含量对于烧结体微观组织、力学性能和热学性能的影响,并与由未覆钨AlN粉体制备的AlN/W-Cu复合材料进行对比。结果表明,采用溶胶凝胶法可在AlN颗粒表面均匀制备覆W层,其界面结合良好。覆钨AlN/W-Cu复合材料的相对密度、硬度、抗拉强度以及热导率均优于未覆钨AlN/W-Cu复合材料的。AlN/W-Cu复合材料的相对密度、抗拉强度及热导率随AlN含量的增加而降低,而硬度随AlN含量的增加而上升。当AlN含量为2%时,覆钨AlN/W-Cu复合材料的综合性能最佳,相对密度达到97.69%,显微硬度达到277HV,热导率达到205.54 W/(m·K)。 展开更多
关键词 AlN/W-cu复合材料 覆钨AlN粉体 溶胶凝胶法 熔渗法 热导率
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