The deposition of a Cu seed layer film is investigated by supercritical fluid deposition （SCFD） using H2 as a reducing agent for Bis（2,2,6,6-tetramethyl-3,5- heptanedionato） copper in supercritical CO2 （scCO2）. ...The deposition of a Cu seed layer film is investigated by supercritical fluid deposition （SCFD） using H2 as a reducing agent for Bis（2,2,6,6-tetramethyl-3,5- heptanedionato） copper in supercritical CO2 （scCO2）. The effects of deposition temperature, precursor, and H2 concentration are investigated to optimize Cu deposition. Continuous metallic Cu films are deposited on Ru substrates at 190 ℃ when a 0.002 mol/L Cu precursor is introduced with 0.75 mol/L H2. A Cu precursor concentration higher than 0.002 mol/L is found to have negative effects on the surface qualities of Cu films. For a H2 concentration above 0.56 mol/L, the root-mean-square （RMS） roughness of a Cu film decreases as the H2 concentration increases. Finally, a 20-nm thick Cu film with a smooth surface, which is required as a seed layer in advanced interconnects, is successfully deposited at a high H2 concentration （0.75 tool/L）.展开更多
Fine metal particles with uniform shape, narrow size distribution and high purity are increasingly needed for specific uses in high tech industrial application. We report the direct chemical synthesis of FeCo alloy pa...Fine metal particles with uniform shape, narrow size distribution and high purity are increasingly needed for specific uses in high tech industrial application. We report the direct chemical synthesis of FeCo alloy particles using the mixture of FeCl2·4H2O, Co (Ac)2·4H2O (Ac: acetate) and NaOH in ethylene glycol, and then obtained FeCo alloy particles better dispersed by adding the polyvinylpyrrolidone (PVP) and also the size could be controlled by adding copper. The prepared nano-particles were characterized using FESEM, XRD and VSM. The mean diameter of these particles was varied in the range of sub- mi- crometer to nanometer with metal-ion concentration. FeCo particles showed the typical soft magnetic properties.展开更多
A laboratory incubation experiment (20℃) was conducted to find if the detrimental effects of seed-soaked Cu on wheat seedlings can be minimized by reducing time duration of seed in contact with Cu EDTA fertilizer sol...A laboratory incubation experiment (20℃) was conducted to find if the detrimental effects of seed-soaked Cu on wheat seedlings can be minimized by reducing time duration of seed in contact with Cu EDTA fertilizer solution. The 24 treatments in a 6 x 4 factorial arrangement included 6 rates/amounts of Cu (0, 15, 30, 60, 120 and 240 g Cu 100 kg-1 seed) and 4 seed-soaking time durations (0, 4, 8 and 16 h). The germination of wheat seed was 100% in the zero-Cu control treatments, irrespective of the duration of seed soaking time. However, seed germination decreased with increasing amount of fertilizer Cu in the seed-soaking solution, and the magnitude of reduction in seed germination due to Cu toxicity increased with increasing duration of seed-soaking time in the Cu fertilizer solution. For the seed-soaked treatments, the detrimental effect of Cu on germination was greatest with 16 h soaking, where only 13% - 18% of the seeds germinated with Cu applied at 15 to 30 g Cu 100 kg-1 seed. For the 4 and 8 h seed soaking treatments, germination of wheat seed ranged from 73% to 83% with 15 g Cu 100 kg-1 seed treatment and 42% to 62% with 30 g Cu 100 kg-1 seed. The findings suggest that the detrimental effect of Cu on germination of wheat seed soaked in Cu EDTA solution can be decreased by reducing duration of soaking time from 16 h to 4 or 8 h, but this needs further investigation using soil under growth chamber and/or field conditions in order to make valid recommendations for use of this new technology on a commercial scale.展开更多
为探究辣木籽壳生物炭对Cu^(2+)的吸附性能,以辣木籽壳为原料,1000℃热解、KOH改性制备生物炭,采用平衡吸附法研究改性前后生物炭对Cu^(2+)的吸附机理。结果表明:当p H 7.0时,加入同样量的辣木籽壳生物炭,改性后辣木籽壳生物炭对Cu^(2+...为探究辣木籽壳生物炭对Cu^(2+)的吸附性能,以辣木籽壳为原料,1000℃热解、KOH改性制备生物炭,采用平衡吸附法研究改性前后生物炭对Cu^(2+)的吸附机理。结果表明:当p H 7.0时,加入同样量的辣木籽壳生物炭,改性后辣木籽壳生物炭对Cu^(2+)的吸附效果优于改性前。吸附过程符合Langmuir等温吸附模型和准二级动力学模型。造成这种吸附差异的原因与生物炭的比表面积、孔隙结构和芳香结构以及SiO_(2)含量有关。综上所述,所制备的辣木籽壳生物质活性炭在一定范围内对Cu^(2+)有良好的去除作用。展开更多
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 50901086 and 51072118)the Shanghai Shuguang Project,China (Grant No. 09SG46)+2 种基金the Science Foundation for the Excellent Youth Scholars of Shanghai Municipal Education Commission,China (Grant No. slg10032)the Qianjiang Project of Zhejiang Province,China (Grant No. 2010R10047)the Scientific Research Foundation for the Returned Overseas Chinese Scholars,State Education Ministry
文摘The deposition of a Cu seed layer film is investigated by supercritical fluid deposition （SCFD） using H2 as a reducing agent for Bis（2,2,6,6-tetramethyl-3,5- heptanedionato） copper in supercritical CO2 （scCO2）. The effects of deposition temperature, precursor, and H2 concentration are investigated to optimize Cu deposition. Continuous metallic Cu films are deposited on Ru substrates at 190 ℃ when a 0.002 mol/L Cu precursor is introduced with 0.75 mol/L H2. A Cu precursor concentration higher than 0.002 mol/L is found to have negative effects on the surface qualities of Cu films. For a H2 concentration above 0.56 mol/L, the root-mean-square （RMS） roughness of a Cu film decreases as the H2 concentration increases. Finally, a 20-nm thick Cu film with a smooth surface, which is required as a seed layer in advanced interconnects, is successfully deposited at a high H2 concentration （0.75 tool/L）.
基金Supported by the Korea Research Foundation (Grant No. KRF-2006-005-J02703)
文摘Fine metal particles with uniform shape, narrow size distribution and high purity are increasingly needed for specific uses in high tech industrial application. We report the direct chemical synthesis of FeCo alloy particles using the mixture of FeCl2·4H2O, Co (Ac)2·4H2O (Ac: acetate) and NaOH in ethylene glycol, and then obtained FeCo alloy particles better dispersed by adding the polyvinylpyrrolidone (PVP) and also the size could be controlled by adding copper. The prepared nano-particles were characterized using FESEM, XRD and VSM. The mean diameter of these particles was varied in the range of sub- mi- crometer to nanometer with metal-ion concentration. FeCo particles showed the typical soft magnetic properties.
文摘A laboratory incubation experiment (20℃) was conducted to find if the detrimental effects of seed-soaked Cu on wheat seedlings can be minimized by reducing time duration of seed in contact with Cu EDTA fertilizer solution. The 24 treatments in a 6 x 4 factorial arrangement included 6 rates/amounts of Cu (0, 15, 30, 60, 120 and 240 g Cu 100 kg-1 seed) and 4 seed-soaking time durations (0, 4, 8 and 16 h). The germination of wheat seed was 100% in the zero-Cu control treatments, irrespective of the duration of seed soaking time. However, seed germination decreased with increasing amount of fertilizer Cu in the seed-soaking solution, and the magnitude of reduction in seed germination due to Cu toxicity increased with increasing duration of seed-soaking time in the Cu fertilizer solution. For the seed-soaked treatments, the detrimental effect of Cu on germination was greatest with 16 h soaking, where only 13% - 18% of the seeds germinated with Cu applied at 15 to 30 g Cu 100 kg-1 seed. For the 4 and 8 h seed soaking treatments, germination of wheat seed ranged from 73% to 83% with 15 g Cu 100 kg-1 seed treatment and 42% to 62% with 30 g Cu 100 kg-1 seed. The findings suggest that the detrimental effect of Cu on germination of wheat seed soaked in Cu EDTA solution can be decreased by reducing duration of soaking time from 16 h to 4 or 8 h, but this needs further investigation using soil under growth chamber and/or field conditions in order to make valid recommendations for use of this new technology on a commercial scale.
文摘为探究辣木籽壳生物炭对Cu^(2+)的吸附性能,以辣木籽壳为原料,1000℃热解、KOH改性制备生物炭,采用平衡吸附法研究改性前后生物炭对Cu^(2+)的吸附机理。结果表明:当p H 7.0时,加入同样量的辣木籽壳生物炭,改性后辣木籽壳生物炭对Cu^(2+)的吸附效果优于改性前。吸附过程符合Langmuir等温吸附模型和准二级动力学模型。造成这种吸附差异的原因与生物炭的比表面积、孔隙结构和芳香结构以及SiO_(2)含量有关。综上所述,所制备的辣木籽壳生物质活性炭在一定范围内对Cu^(2+)有良好的去除作用。
