研究了固溶时效和快速凝固时效对Cu Cr Sn Zn合金的微观组织、硬度和导电率性能的影响。结果表明,快速凝固态下合金的晶粒比固溶态时的晶粒要细小得多,细晶强化作用显著;合金快速凝固时效后的析出相较固溶时效的析出相更加弥散、稠密,...研究了固溶时效和快速凝固时效对Cu Cr Sn Zn合金的微观组织、硬度和导电率性能的影响。结果表明,快速凝固态下合金的晶粒比固溶态时的晶粒要细小得多,细晶强化作用显著;合金快速凝固时效后的析出相较固溶时效的析出相更加弥散、稠密,使合金强度得以提高。合金经920℃×1h固溶和500℃×15min时效后,硬度为102HV,导电率达50%IACS;而快速凝固的合金在同样的时效条件下,硬度为179HV,导电率达60%IACS。展开更多
u(Ⅰ), Zn(Ⅱ), Fe(Ⅱ), Sn(Ⅱ), Pb(Ⅱ) complexes of 1,5 bis(3 nitroacetophenone) thiocarbohydrazone were synthesized by the electrochemical oxidation of anodic metal in non aqueous solvents. The complexes were characte...u(Ⅰ), Zn(Ⅱ), Fe(Ⅱ), Sn(Ⅱ), Pb(Ⅱ) complexes of 1,5 bis(3 nitroacetophenone) thiocarbohydrazone were synthesized by the electrochemical oxidation of anodic metal in non aqueous solvents. The complexes were characterized by elemental analysis, IR UV, magnetic measurement, and molar conductivity etc.展开更多
The strength and fatigue fracture behavior of A1-Zn-Mg-Cu-Zr（-Sn） alloys were studied by performing tensile tests and fatigue crack propagation （FCP） tests. The microstructures of the experimental alloys were furt...The strength and fatigue fracture behavior of A1-Zn-Mg-Cu-Zr（-Sn） alloys were studied by performing tensile tests and fatigue crack propagation （FCP） tests. The microstructures of the experimental alloys were further analyzed using optical microscopy （OM）, scanning electron microscopy （SEM）, and transmission electron microscopy （TEM）; phase analysis of these alloys was conducted with an X-ray diffraction （XRD）. The results show that when Sn is included, growth of the recrystallization grains in the solution-treated A1-Zn-Mg-Cu-Zr alloy is obstructed, the precipitation-free zone （PFZ） of the overaged A1-Zn-Mg-Cu-Zr-Sn alloy becomes narrow, and the grain boundary precipitates are smaller. Consequently, the FCP resistance is higher. In addition, the overaged Sn-containing alloy has considerably higher tensile strength than the alloy without Sn.展开更多
文摘研究了固溶时效和快速凝固时效对Cu Cr Sn Zn合金的微观组织、硬度和导电率性能的影响。结果表明,快速凝固态下合金的晶粒比固溶态时的晶粒要细小得多,细晶强化作用显著;合金快速凝固时效后的析出相较固溶时效的析出相更加弥散、稠密,使合金强度得以提高。合金经920℃×1h固溶和500℃×15min时效后,硬度为102HV,导电率达50%IACS;而快速凝固的合金在同样的时效条件下,硬度为179HV,导电率达60%IACS。
文摘u(Ⅰ), Zn(Ⅱ), Fe(Ⅱ), Sn(Ⅱ), Pb(Ⅱ) complexes of 1,5 bis(3 nitroacetophenone) thiocarbohydrazone were synthesized by the electrochemical oxidation of anodic metal in non aqueous solvents. The complexes were characterized by elemental analysis, IR UV, magnetic measurement, and molar conductivity etc.
基金Project(2010CB731706) supported by the National Basic Research Program of China
文摘The strength and fatigue fracture behavior of A1-Zn-Mg-Cu-Zr（-Sn） alloys were studied by performing tensile tests and fatigue crack propagation （FCP） tests. The microstructures of the experimental alloys were further analyzed using optical microscopy （OM）, scanning electron microscopy （SEM）, and transmission electron microscopy （TEM）; phase analysis of these alloys was conducted with an X-ray diffraction （XRD）. The results show that when Sn is included, growth of the recrystallization grains in the solution-treated A1-Zn-Mg-Cu-Zr alloy is obstructed, the precipitation-free zone （PFZ） of the overaged A1-Zn-Mg-Cu-Zr-Sn alloy becomes narrow, and the grain boundary precipitates are smaller. Consequently, the FCP resistance is higher. In addition, the overaged Sn-containing alloy has considerably higher tensile strength than the alloy without Sn.
