Investigation on the Novel High-performance Copper/Graphene Composite Conductor for High Power Density Motor

High-performance Cu/Graphene composite wire synergistically strengthened by nano Cr_(3)C_(2) phase was directly synthesized via hot press sintering followed by severe cold plastic deformation, using liquid paraffin and CuCr alloy powder as the raw materials. Since graphene is in situ formed under the catalysis of copper powder during the sintering process, the problem that graphene is easy to agglomerate and difficult to disperse uniformly in the copper matrix has been solved. The nano Cr_(3)C_(2)-particles nailed at the interface favor to improve the interface bonding. The Cu/Graphene composite possesses high electrical conductivity, hardness, and plasticity. The composite wire exhibits high electrical conductivity of 96.93% IACS, great tensile strength of 488MPa, and excellent resistance to softening. Even after annealing at 400℃ for 1 h, the tensile strength can still reach 268 MPa with a conductivity of about 99.14% IACS.The wire's temperature coefficient of resistance(TCR) is largely reduced to 0.0035/℃ due to the complex structure,which leads the wire to present low resistivity at higher temperatures. Such Cu/Graphene composite wire with excellent comprehensive performance has a good application prospect in high-power density motors.

三维互穿结构Cu-W触头抗熔焊机理

触头闭合回跳电弧引起的开关电器动熔焊问题,直接影响大功率接触器的电寿命和可靠性。为此设计了2种三维互穿有序结构的四边形和菱形十二面体的Cu-W复合材料触头,围绕触头动熔焊过程中的电弧、熔池、液滴溅射及凝固相变降温等问题,建立触头熔池流体动力学模型和冷凝降温数学模型,研究了2种有序结构和商用无序结构的触头阳极在闭合回跳电弧作用下熔化温度分布、熔池喷溅形貌和接触区域金属凝固过程,通过模拟熔焊实验平台进行了熔焊力验证。结果表明,通过调节三维互穿有序W骨架结构,能够有效抑制熔池扩散和液态金属喷溅,并降低熔焊力,从而提高Cu-W复合材料的抗熔焊性能。

晶粒尺寸对界面含Cr-O-C防黏层Cu/Ni复合体拉伸性能的影响

通过分子动力学方法研究含Cr-O-C防黏层的具有不同晶粒尺寸的Cu/Ni复合体的拉伸变形。结果表明:当Cu/Ni复合体的晶粒尺寸大于12 nm时,不论界面不含Cr、O和C原子或含有定量Cr、O和C原子,复合体的屈服强度随着晶粒尺寸的减小呈现增大趋势,符合细晶强化规律,晶粒塑性变形主要受晶体内部的位错滑移控制,最大应力增加9.52%;当晶粒尺寸小于12 nm时,由于晶界所占比例的增加,拉伸过程的塑性变形更多受晶界变形控制,屈服强度下降。Cr-O-C界面弱化了Cu/Ni复合体的强度,随着界面上Cr、O和C原子数量的增加,Cu/Ni复合体的抗拉强度随之降低,最大应力下降56.40%,Cu/Ni复合体内部的位错数量也随之降低,转移到Ni表面的Cu原子数量随之减少。

Preparation of nanosized W/Cu composite powder by sol-gel technique

Cu(NO3)(2) and (NH4)(6)H(2)W(12)O(40)center dot 4H(2)O were used to prepare W/Cu nanosized composite powder by sol-gel technique. The influences of heat treatment process, pH value of the solution and the amount of an addition agent on particle size were investigated by DSC, XRD and TEM. The results show that, at a certain heat treatment temperature, the W/Cu nanoparticle size increases with the pH value or the amount of the addition agent increasing.

Microstructure and mechanical properties of Al/Cu/Mg laminated composite sheets produced by the ARB proces

In the present study, an Al/Cu/Mg multi-layered composite was produced by accumulative roll bonding(ARB) through seven passes, and its microstructure and mechanical properties were evaluated. The microstructure investigations show that plastic instability occurred in both the copper and magnesium reinforcements in the primary sandwich. In addition, a composite with a perfectly uniform distribution of copper and magnesium reinforcing layers was produced during the last pass. By increasing the number of ARB cycles, the microhardness of the layers including aluminum, copper, and magnesium was significantly increased. The ultimate tensile strength of the sandwich was enhanced continually and reached a maximum value of 355.5 MPa. This strength value was about 3.2, 2, and 2.1 times higher than the initial strength values for the aluminum, copper, and magnesium sheets, respectively. Investigation of tensile fracture surfaces during the ARB process indicated that the fracture mechanism changed to shear ductile at the seventh pass.

Mechanical properties of Cu based composites reinforced by carbon nanotubes

Cu based composites reinforced by 0%～25% (volume fraction) carbon nanotubes were prepared.The fracture behaviors and the rolling properties of the composites and the effects of the volume fraction of the carbon nanotubes were studied.The experimental results show that the fracture toughness of the composites is related to the pulling out and bridging of the carbon nanotubes in the fracture process.With the volume fraction of the carbon nanotubes increasing, the Vicker’s hardness and the compactness of the composites increase first and then decrease. The peaks of the hardness and the compactness occur at 12%～15% of volume fraction of carbon nanotubes.Some proper ratio of rolling reduction benefits to the comprehensive mechanical properties of the composites.

Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process

The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.

Effects of intermediate Ni layer on mechanical properties of Al–Cu layered composites fabricated through cold roll bonding

Layered composites have attracted considerable interest in the recent literature on metal composites. Their mechanical properties depend on the quality of the bonding provided by the intermediate layers. In this study, we analyzed the mechanical properties and bond strengths provided by the nickel layer with respect to its thickness and nature(either powder or coating). The results suggest that bond strength decreases with an increase in the content of nickel powder. At 0.3 vol% of nickel coating, we found the nature of nickel to be less efficient in terms of bond strength. A different picture arose when the content of nickel was increased and the bond strength increased in nickel coated samples. In addition, the results demonstrate that mechanical properties such as bend strength are strongly dependent on bond strength.

Fabrication of an in-situ nanoAl_2O_3/Cu composite with high strength and high electric conductivity

A heat-resistant dispersion-strengthening nano-Al_2O_3/Cu composite with highstrength and high electric conductivity was fabricated in a multiplex medium. The internaloxidation product, microstructures and properties of the composite, and the process flow weresystematically studied. It is confirmed that this new technique simplifies the process and improvesthe properties of the composite. X-ray analysis indicates that the alumina particles formed duringinternal oxidation consist of a large mount of gamma-Al_2O_3 and a certain amount of theta-Al_2O_3and alpha-Al_2O_3. TEM observation shows that the obtained gamma-Al_2O_3 nano-particles areuniformly distributed in the copper grains; their mean size and space between particles are 7 runand 30 nm, respectively. The main properties of the composite with 50 percent cold deformation areas follows: the electric conductivity is 51 MS/m (87 percent IACS), sigma_b = 628 MPa, and thehardness is HRB86. After annealing at 1273 K, all or most of the above properties remain, and themicrostructures are still dependent on elongated fiber-form grains.

Self-propagating High-temperature Synthesis, Microstructure and Mechanical Properties of TiC-TiB_2-Cu Composites

TiC-TiB2-Cu composites were produced by self-propagating high-temperature synthesis combined with pseudo hot isostatic pressing using Ti, B4C and Cu powders. The microstructure and mechanical properties of the composites were investigated. The X-ray diffraction （XRD） and scanning electron microscopy （SEM） results showed that the final products were only TiC, TiB2 and Cu phases. The clubbed TiB2 grains and spheroidal or irregular TiC grains were found in the microstructure of synthesized products. The reaction temperature and grain size of TiB2 and TiC particles decreased with increasing Cu content. The introduction of Cu into the composites resulted in a drastic increase in the relative density and flexual strength, and the maximum values were obtained with the addition of 20 wt pct, while the fracture toughness was the best when Cu content was 40 wt pct.

Microstructure and mechanical properties of SiC-particle-strengthening tri-metal Al/Cu/Ni composite produced by accumulative roll bonding process

In this study, a multilayer Al/Ni/Cu composite reinforced with Si C particles was produced using an accumulative roll bonding(ARB) process with different cycles. The microstructure and mechanical properties of this composite were investigated using optical and scanning microscopy and hardness and tensile testing. The results show that by increasing the applied strain, the Al/Ni/Cu multilayer composite converted from layer features to near a particle-strengthening characteristic. After the fifth ARB cycle, a composite with a uniform distribution of reinforcements(Cu, Ni, and SiC) was fabricated. The tensile strength of the composite increased from the initial sandwich structure to the first ARB cycle and then decreased from the first to the third ARB cycle. Upon reaching five ARB cycles, the tensile strength of the composite increased again. The variation in the elongation of the composite exhibited a tendency similar to that of its tensile strength. It is observed that with increasing strain, the microhardness values of the Al, Cu, and Ni layers increased, and that the dominant fracture mechanisms of Al and Cu were dimple formation and ductile fracture. In contrast, brittle fracture in specific plains was the main characteristic of Ni fractures.

Thermal expansion and mechanical properties of high reinforcement content SiC_(p)/Cu composites fabricated by squeeze casting technology

High reinforcement content SiCp/Cu composites (φp=50%, 55% and 60%) for electronic packaging applications were fabricated by patent cost-effective squeeze-casting technology. The composites appear to be free of pores, and the SiC particles are distribute uniformly in the composites. The mean linear coefficients of thermal expansion (CTEs, 20-100 ℃ ) of as-cast SiCp/Cu composites range from 8.8×10-6 ℃-1 to 9.9×10-6 ℃-1 and decrease with the increase of SiC content. The experimental CTEs of as-cast SiCp/Cu composites agree well with the predicted values based on Kerner model. The CTEs of composites reduce after annealing treatment due to the fact that the internal stress of the composite is released. The Brinell hardness increases from 272.3 to 313.2, and the modulus increases from 186 GPa to 210 GPa for the corresponding composites. The bending strength is larger than 374 MPa, but no obvious trend between bending strength and SiCp content is observed.

Reaction thermodynamics and kinetics on in situ Al_2O_3/Cu composites

The preferred internal oxidation of aluminum in Cu Al alloy was used to obtain in situ Al 2O 3/Cu composites. The reinforcement particles were mainly γ Al 2O 3, some θ Al 2O 3 and a little α Al 2O 3. Thermodynamics analyses show that the chemical reactions are 3Cu 2O+2Al=6Cu+Al 2O 3 or 3CuO+2Al=3Cu+Al 2O 3. A related equilibrium diagram was drawn. The experiments and investigation show that the formation rate of Al 2O 3 was controlled by the diffusion of oxygen in matrix.

A Novel Technique for Preparation of Electrically Conductive ABS/Cu Polymeric Gradient Composites

A novel technique for preparing functionally gradient electrically conductive polymeric composites was developed by using of solution casting technique on the principle of Stokes＇ law. Acrylonitrile- butadiene-styrene/Cu （ABS/Cu） gradient polymeric composites were prepared successfully using this technique. The gradient structures, electrically conductive performance and mechanical properties of the ABS/Cu composites were investigated. Optical microscope observation shows that the gradient distribution of Cu particles in ABS matrix was formed along their thickness-direction. The electrically conductive testing results indicate that the order of magnitude of surface resistivity was kept in 10^15 Ω at ABS rich side, while that declined to 10^5 Ω at Cu particles rich side, and the percolation threshold was in the range of 2.82 vo1%- 4.74 vol% Cu content at Cu particles rich side. Mechanical test shows that the tensile strength reduced insignificantly as the content of Cu increases owing to the gradient distribution.

Preparation and Arc Erosion Resistance of C_f/Cu Composite by Vacuum Melting Infiltration

Cf/Cu composite was prepared by vacuum melting infiltration. Ti and Cr were doped to the Cu alloy to improve the wettability between Cu and carbon. The microstrueture was investigated by XRD, SEM and EDS. The arc erosion rate of Cf/Cu composite was investigated in vacuum. The results showed that the Ti and Cr could improve the wettability between Cu and C/C preform and the infiltration ability of Cu into C/ C preform greatly. A TiC interface formed between the fibers and matrix. The good bonding between the fiber and matrix guaranteed that part of the Cu matrix can still be bonded on the fibers even when the material was exposed to the plasma. Consequently, the carbon fibers were protected from the erosion. In comparison, Cu was completely consumed by the arc erosion. Hence, the graphite was eroded and presented a cauliflower-like morphology. Therefore, the prepared C/Cu bad better ability to resist the arc erosion, compared with common Cu-C material.

Low-temperature heat conduction characteristics of diamond/Cu composite by pressure infiltration method

In this paper,diamond/CuCr and diamond/CuB composites were prepared using the pressure infiltration method.The physical property measurement system(PPMS)was adopted to evaluate the thermal conductivity of diamond/Cu and MoCu composites within the range of100–350 K,and a scanning electron microscope(SEM)was utilized to analyze the microstructure and fracture appearance of the materials.The research indicates that the thermal conductivity of diamond/Cu composite within the range of100–350 K is 2.5–3.0 times that of the existing MoCu material,and the low-temperature thermal conductivity of diamond/Cu composite presents an exponential relationship with the temperature.If B element was added to a Cu matrix and a low-temperature binder was used for prefabricated elements,favorable interfacial adhesion,relatively high interfacial thermal conductivity,and favorable low-temperature heat conduction characteristics would be apparent.

Si/Cu3_Si@C Composite Encapsulated in CNTs Network as High Performance Anode for Lithium Ion Batteries

Si/Cu3Si@C composites encapsulated in CNTs network(SCC-CNTs) were synthesized via the combination of ball-milling and CVD methods. SCC-CNTs consist of conductive Cu3Si, amorphous carbon layer, cross-linked CNTs, and the etched pores, which can play the synergistic effects on the improvement of electronic conductivity and Li^+ diffusion. The volume expansion of Si anode is also suppressed during the electrochemical process. The SCC-CNTs composites demonstrate a remarkably improved electrochemical performance compared with pure Si, which can deliver a discharge capacity of 2 171 mAh·g^-1 at 0.4 A·g^-1 with ICE of 85.2%, and retain 1197 mAh· g^-1 after 150 cycles. This work provides a facile approach to massively produce the high-performance Si-based anode materials for next-generation LIBs.

Anisotropic and asymmetric deformation mechanisms of nanolaminated graphene/Cu composites

We conducted molecular dynamics (MD) simulations of tension and compression along the <112> direction and MD simulations of compression along the <110> and <111> directions on nanolaminated graphene/Cu (NGCu) composites to investigate the effects of the incorporated graphene and the deformation mechanisms related to the loading direction. The deformation behavior and the defect structures were found to be strongly dependent on the loading conditions. An asymmetric tension-compression deformation behavior was thus found in graphene/Cu nanolaminates under the <112> loading, which was dominated by stacking faults and deformation twins formed by dislocation slide under tension and compression, respectively. High density and ordered nanotwins were formed at the graphene/Cu interfaces. Two different formation mechanisms of the twins were found under the <112> compression, and the nucleated twins were easy to be thickened with the assistance of the graphene wrinkles. Multiple twins were formed under the <110> compression by the dislocation cross-slip. This study provides a way to introduce graphene reinforcement and twin boundary to Cu matrix composites and design nanotwinned graphene/Cu composites with excellent mechanical performance.

La_(2)O_(3)掺杂Ti_(3)SiC_(2)/Cu复合材料的制备与性能

铜合金作为热管理材料长期服役时,会出现冷-热循环条件下的结构性失效问题,因此考虑将具有低膨胀系数的MAX相材料引入到铜合金中,来降低复合材料的热膨胀性。Ti_(3)SiC_(2)是一种兼具陶瓷和金属的优良特性的三元层状陶瓷材料,具有自润滑、高韧性、高导电性等特点。作为增强相,Ti_(3)SiC_(2)能够提高Cu基复合材料的摩擦性能,降低复合材料的热膨胀系数,因此被应广泛用于电子封装材料、热管理材料等领域。本文将稀土氧化物La_(2)O_(3)引入到Ti_(3)SiC_(2)/Cu复合材料中,研究了La_(2)O_(3)掺杂含量对Ti_(3)SiC_(2)/Cu复合材料物相组成、表面形貌、显微硬度和摩擦因数等的影响。研究发现,利用热压烧结技术能够获得致密度较高的Ti_(3)SiC_(2)/Cu复合材料,相对密度在98.5%以上。适量掺杂La_(2)O_(3)后,Ti_(3)SiC_(2)/Cu复合材料的显微硬度有所增加,能够实现Ti_(3)SiC_(2)/Cu复合材料的弥散强化。随着La_(2)O_(3)掺杂量增加,Ti_(3)SiC_(2)/Cu复合材料的摩擦因数呈现出先降低后增加的趋势。在Cu基复合材料中添加Ti_(3)SiC_(2),能够起到润滑的作用,有利于降低摩擦因数。本研究可为Ti_(3)SiC_(2)/Cu复合材料的工程应用提供试验依据。

High Temperature Flow Stress Prediction of Nano-Al_2O_3/Cu Composite Using an Artificial Neural Network

Alumina dispersion strengthened copper composite （nano-Al2O3/Cu composite） was recently emerged as a kind of potentially viable and attractive engineering material for applications requiring high strength, high thermal and electrical conductivities and resistance to softening at elevated temperatures. The nano-Al2O3/Cu composite was produced by internal oxidation. The microstructures of the composite were analyzed by the TEM and its hot deformation behavior was investigated by means of continuous compression tests performed on a Gleeble 1500 thermo-simulator. Making use of the modified algorithm-Levenberg-Marquardt （L-M） algorithm BP neural network, a model for predicting the flow stresses during hot deformation was set up on the base of the experimental data. Results show that the microstructures of the composite are characterized by uniform distribution of nano-Al2O3 particles in Cu-matrix. The sliding of dislocations is the main deformation mechanism. The dynamic recovery is the main softening mode with the flow stress decreasing gently from 500℃ to 850 ~C. The recrystallization of Cu-matrix can be retarded late into as high as 850 ℃, when it happens only partially. The well-trained BP neural network model can accurately describe the influence of the temperature, strain rate, and true strain on the flow stresses, therefore, it can precisely predict the flow stresses of the composite under given deforming conditions and provide a new way to optimize hot deforming process parameters.