To improve the low thermal conductivities and poor wear resistances of TC4(Ti-6Al-4V)alloy,the most widely used titanium alloy,the surface of TC4 alloys is modified by electroplating deposition of Ni and Cu layers,and...To improve the low thermal conductivities and poor wear resistances of TC4(Ti-6Al-4V)alloy,the most widely used titanium alloy,the surface of TC4 alloys is modified by electroplating deposition of Ni and Cu layers,and then heat-treated to increase the diffusivity at the interface.In this paper,the corrosion behavior of Cu/Ni coatings on TC4 alloy at different heat treatment processes was investigated in 3.5 wt%Na Cl by the electrochemical analysis,and the microstructure and composition of corrosion products was carried out to reveal the corrosion resistance mechanism of Cu/Ni coatings.It was found that the corrosion resistance was significantly influenced by heat treatment temperature.With the increasing diffusion treatment temperature from 500 to 700℃,the corrosion potential positively shifted from-330.87 to-201.14 m V,and the corrosion current density decreased from 4.02×10^-3 to 0.514×10^-3 m A/cm^2.However,when heat treatment temperature increased to 800℃,the corrosion potential negatively shifted to-207.21 m V,and the current density increased to 1.62×10^-3 m A/cm^2.The diffusion behavior of Ti,Ni and Cu elements occurred and small amounts of Ni and Ti elements appeared on the specimen surface under different heat treatment temperature.Especially heattreated at 700℃,the smaller pore size,dense Cu2O film,and highly stable Ti O and Ni O oxide layer were formed,which dramatically enhanced the corrosion resistance of Cu/Ni coatings.Finally,a novel model of corrosion resistance was proposed based on the analysis mentioned above.展开更多
Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), sc...Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.展开更多
Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joi...Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.展开更多
Twisted bilayer graphene(TBG) has been extensively studied because of its novel physical properties and potential application in electronic devices.Here we report the synthesis and characterization of 300 TBG naturall...Twisted bilayer graphene(TBG) has been extensively studied because of its novel physical properties and potential application in electronic devices.Here we report the synthesis and characterization of 300 TBG naturally grown on Cu_(0.75)Ni_(0.25)(111) film and investigate the electronic structure by angle-resolved photoemission spectroscopy.Compared with other substrates,our TBG with a wafer scale is acquired with a shorter growth time.The Fermi velocity and energy gap of Dirac cones of TBG are comparable with those of a monolayer on Cu_(0.85)Ni_(0.15)(111).The signature of moré lattices has not been observed in either the low-energy electron diffraction patterns or the Fermi surface map within experimental resolution,possibly due to different Cu and Ni contents in the substrates enhancing the different couplings between the substrate and the first/second layers and hindering the formation of a quasiperiodic structure.展开更多
纳米材料因其自身独特性能而备受关注,从而引发了人们对其进行一系列的研究。采用机械合金化法(MA)和粉末冶金法(PM)制备了纳米尺寸和常规尺寸粉末,通过控制温度和压力等因素,利用真空热压烧结炉将两种不同尺寸的Cu-20Co-20Cr-20Ni粉末...纳米材料因其自身独特性能而备受关注,从而引发了人们对其进行一系列的研究。采用机械合金化法(MA)和粉末冶金法(PM)制备了纳米尺寸和常规尺寸粉末,通过控制温度和压力等因素,利用真空热压烧结炉将两种不同尺寸的Cu-20Co-20Cr-20Ni粉末热压成块体合金,并利用电化学测试技术研究了它们在0.5mol·L^(-1)中性Na Cl溶液中的腐蚀行为以及纳米化对其腐蚀行为的影响。结果表明:当Cu-20Co-20Cr-20Ni合金处于0.5mol·L^(-1) Na Cl腐蚀溶液中时,纳米尺寸Cu-20Co-20Cr-20Ni合金较相应的常规尺寸合金自腐蚀电位发生正移,电荷传递电阻变大,腐蚀电流密度减小。可见,晶粒细化导致Cu-20Co-20Cr-20Ni合金的耐腐蚀性能增强。展开更多
基金Funded by Key Projects of Shaanxi Natural Science Foundation(No.2019JZ-27)Shaanxi Natural Science Basic Research Program-Shaanxi Coal(No.2019JLM-47)Fundamental Research Funds for the Central Universities CHD(No.300102319304).
文摘To improve the low thermal conductivities and poor wear resistances of TC4(Ti-6Al-4V)alloy,the most widely used titanium alloy,the surface of TC4 alloys is modified by electroplating deposition of Ni and Cu layers,and then heat-treated to increase the diffusivity at the interface.In this paper,the corrosion behavior of Cu/Ni coatings on TC4 alloy at different heat treatment processes was investigated in 3.5 wt%Na Cl by the electrochemical analysis,and the microstructure and composition of corrosion products was carried out to reveal the corrosion resistance mechanism of Cu/Ni coatings.It was found that the corrosion resistance was significantly influenced by heat treatment temperature.With the increasing diffusion treatment temperature from 500 to 700℃,the corrosion potential positively shifted from-330.87 to-201.14 m V,and the corrosion current density decreased from 4.02×10^-3 to 0.514×10^-3 m A/cm^2.However,when heat treatment temperature increased to 800℃,the corrosion potential negatively shifted to-207.21 m V,and the current density increased to 1.62×10^-3 m A/cm^2.The diffusion behavior of Ti,Ni and Cu elements occurred and small amounts of Ni and Ti elements appeared on the specimen surface under different heat treatment temperature.Especially heattreated at 700℃,the smaller pore size,dense Cu2O film,and highly stable Ti O and Ni O oxide layer were formed,which dramatically enhanced the corrosion resistance of Cu/Ni coatings.Finally,a novel model of corrosion resistance was proposed based on the analysis mentioned above.
基金Funded by Shenzhen-Hong Kong Innovative Collaborative Research and Development Program (Nos.SGLH20181109 110802117, CityU 9240014)Innovation Project of Southwestern Institute of Physics (Nos.202001XWCXYD002, 202301XWCX003)CNNC Young Talent Program (No.2023JZYF-01)。
文摘Surface metallization of glass fiber(GF)/polyetheretherketone(PEEK)[GF/PEEK] is conducted by coating copper using electroplating and magnetron sputtering and the properties are determined by X-ray diffraction(XRD), scanning electron microscopy(SEM), and electron backscatter diffraction(EBSD).The coating bonding strength is assessed by pull-out tests and scribing in accordance with GB/T 9286-1998.The results show that the Cu coating with a thickness of 30 μm deposited on GF/PEEK by magnetron sputtering has lower roughness, finer grain size, higher crystallinity, as well as better macroscopic compressive stress,bonding strength, and electrical conductivity than the Cu coating deposited by electroplating.
基金financial support from the National Natural Science Foundation of China(grant numbers 52275385 and U2167216)the Sichuan Province Science and Technology Support Program(grant number 2022YFG0086)。
文摘Magnesium and aluminum alloys are widely used in various industries because of their excellent properties,and their reliable connection may increase application of materials.Intermetallic compounds(IMCs)affect the joint performance of Mg/Al.In this study,AZ31 Mg alloy with/without a nickel(Ni)coating layer and 6061 Al alloy were joined by ultrasonic-assisted soldering with Sn-3.0Ag-0.5Cu(SAC)filler.The effects of the Ni coating layer on the microstructure and mechanical properties of Mg/Al joints were systematically investigated.The Ni coating layer had a significant effect on formation of the Mg_(2)Sn IMC and the mechanical properties of Mg/Al joints.The blocky Mg_(2)Sn IMC formed in the Mg/SAC/Al joints without a Ni coating layer.The content of the Mg_(2)Sn IMC increased with increasing soldering temperature,but the joint strength decreased.The joint without a Ni coating layer fractured at the blocky Mg_(2)Sn IMC in the solder,and the maximum shear strength was 32.2 MPa.By pre-plating Ni on the Mg substrate,formation of the blocky Mg_(2)Sn IMC was inhibited in the soldering temperature range 240–280℃and the joint strength increased.However,when the soldering temperature increased to 310℃,the blocky Mg_(2)Sn IMC precipitated again in the solder.Transmission electron microscopy showed that some nano-sized Mg_(2)Sn IMC and the(Cu,Ni)_(6)Sn_(5)phase formed in the Mg(Ni)/SAC/Al joint soldered at 280℃,indicating that the Ni coating layer could no longer prevent diffusion of Mg into the solder when the soldering temperature was higher than 280℃.The maximum shear strength of the Mg(Ni)/SAC/Al joint was 58.2 MPa for a soldering temperature of 280℃,which was 80.7%higher than that of the Mg/SAC/Al joint,and the joint was broken at the Mg(Ni)/SAC interface.Pre-plating Ni is a feasible way to inhibit formation of IMCs when joining dissimilar metals.
基金Project supported by the National Key R&D Program of China (Grant Nos. 2022YFB3608000 and 2022YFA1204900)the National Natural Science Foundation of China (Grant Nos. 12222413 and 12074205)+2 种基金the Natural Science Foundation of Shanghai (Grant Nos. 23ZR1482200 and 22ZR1473300)the Natural Science Foundation of Zhejiang Province (Grant No. LQ21A040004)the funding of Ningbo University (Grant No. LJ2024003)。
文摘Twisted bilayer graphene(TBG) has been extensively studied because of its novel physical properties and potential application in electronic devices.Here we report the synthesis and characterization of 300 TBG naturally grown on Cu_(0.75)Ni_(0.25)(111) film and investigate the electronic structure by angle-resolved photoemission spectroscopy.Compared with other substrates,our TBG with a wafer scale is acquired with a shorter growth time.The Fermi velocity and energy gap of Dirac cones of TBG are comparable with those of a monolayer on Cu_(0.85)Ni_(0.15)(111).The signature of moré lattices has not been observed in either the low-energy electron diffraction patterns or the Fermi surface map within experimental resolution,possibly due to different Cu and Ni contents in the substrates enhancing the different couplings between the substrate and the first/second layers and hindering the formation of a quasiperiodic structure.
文摘纳米材料因其自身独特性能而备受关注,从而引发了人们对其进行一系列的研究。采用机械合金化法(MA)和粉末冶金法(PM)制备了纳米尺寸和常规尺寸粉末,通过控制温度和压力等因素,利用真空热压烧结炉将两种不同尺寸的Cu-20Co-20Cr-20Ni粉末热压成块体合金,并利用电化学测试技术研究了它们在0.5mol·L^(-1)中性Na Cl溶液中的腐蚀行为以及纳米化对其腐蚀行为的影响。结果表明:当Cu-20Co-20Cr-20Ni合金处于0.5mol·L^(-1) Na Cl腐蚀溶液中时,纳米尺寸Cu-20Co-20Cr-20Ni合金较相应的常规尺寸合金自腐蚀电位发生正移,电荷传递电阻变大,腐蚀电流密度减小。可见,晶粒细化导致Cu-20Co-20Cr-20Ni合金的耐腐蚀性能增强。