The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical pro...The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.展开更多
The kinetics of SnS evaporation from SnS-Cu2S melts was investigated by a unique experimental method. It is shown that the process is controlled by the mass transport of SnS in gas phase. The evaporation rate of SnS i...The kinetics of SnS evaporation from SnS-Cu2S melts was investigated by a unique experimental method. It is shown that the process is controlled by the mass transport of SnS in gas phase. The evaporation rate of SnS is significantly enhanced by increasing tempeature and carrier gas flow rate. The apparent activation energy for the process is found to be 204.67 kJ. The evaporation rate for the present system is much smaller than that for SnS-FeS system.展开更多
The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique. The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different inter...The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique. The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different intervals. Two kinds of binary intermetallics were obtained. For 12 h,Cu6Sn5 was prepared by milling Sn melt at 573 K while Cu3Sn by milling Sn melt at 773 K. And a mixture of Cu6Sn5 and Cu3Sn was fabricated at 673 K. All these intermetallic powders had mean grain sizes of less than 100 nm. A finer microstructure was obtained by milling Sn melt blended with 20%(mass fraction) Ni powders at 573 K for 12 h. The reaction mechanism and advantages were discussed in comparison with that of high-energy ball milling. The results show the solutionizing of Ni powders in the Cu6Sn5 intermetallic.展开更多
基金King Mongkut’s Institute of Technology Ladkrabang and the National Research Council of Thailand for the financial sponsorship of this project
文摘The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu（SAC） solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6 Cu-0.05 Ni-Ge（SCNG） lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG-x（x=Ag, Bi, In, Sb） solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG-x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.
文摘The kinetics of SnS evaporation from SnS-Cu2S melts was investigated by a unique experimental method. It is shown that the process is controlled by the mass transport of SnS in gas phase. The evaporation rate of SnS is significantly enhanced by increasing tempeature and carrier gas flow rate. The apparent activation energy for the process is found to be 204.67 kJ. The evaporation rate for the present system is much smaller than that for SnS-FeS system.
基金Project(50574039) supported by the National Natural Science Foundation of China
文摘The Cu-Sn binary intermetallic powders were obtained via a patented reaction ball milling technique. The Sn melt reacted with the solid-state Cu during the milling process at different temperatures for different intervals. Two kinds of binary intermetallics were obtained. For 12 h,Cu6Sn5 was prepared by milling Sn melt at 573 K while Cu3Sn by milling Sn melt at 773 K. And a mixture of Cu6Sn5 and Cu3Sn was fabricated at 673 K. All these intermetallic powders had mean grain sizes of less than 100 nm. A finer microstructure was obtained by milling Sn melt blended with 20%(mass fraction) Ni powders at 573 K for 12 h. The reaction mechanism and advantages were discussed in comparison with that of high-energy ball milling. The results show the solutionizing of Ni powders in the Cu6Sn5 intermetallic.
