Furfural Hydrogenation on Catalysts Prepared from Nickel-promoted Cu-containing Hydrotalcite-Like Precursors

The nickel-promoted Cu-containing catalysts （CuxNiy-MgAlO） for furfural （FFR） hydrogenation were prepared from the hydrotalcite-like precursors, and characterized by X-ray powder diffraction, inductively-coupled plasma atomic emission spectroscopy, N2 adsorption-desorption, UV-Vis diffuse reflectance spectra and temperatureprogrammed reduction with H2 in the present work. The obtained catalysts were observed to exhibit a better catalytic property than the corresponding Cu-MgAlO or Ni-MgAlO samples in FFR hydrogenation, and the CuNi-MgAIO catalyst with the actual Cu and Ni loadings of 12.5 wt% and 4.5 wt%, respectively, could give the highest FFR conversion （93.2%） and furfuryl alcohol selectivity （89.2%）. At the same time, Cu~ species from the reduction of Cu2＋ ions in spinel phases were deduced to be more active for FFR hydrogenation.

Optimization of annealing treatment and comprehensive properties of Cu-containing Ti6Al4V-xCu alloys

The Ti6Al4V-Cu alloy was reported to show good antibacterial properties, which was promising to reduce the hazard of the bacterial infection problem. For the purpose of preparing Ti6Al4V-Cu alloy with satisfied comprehensive properties, it’s important to study the heat treatment and the appropriate Cu content of the alloy. In this study, high Cu content Ti6Al4V-x Cu(x = 4.5, 6, 7.5 wt%) alloys were prepared, and firstly the annealing heat treatments were optimized in the α+β+Ti2Cu triple phase region to obtain satisfied tensile mechanical properties. Then the effect of Cu content on the tribological property, corrosion resistance, antibacterial activity and cytotoxicity of the Ti6Al4 V-x Cu alloys were systematically studied to obtain the appropriate Cu content. The results showed that the optimal annealing temperatures for Ti6Al4 V-x Cu(x = 4.5, 6, 7.5 wt%) alloys were 720, 740 and 760℃, respectively, which was resulted from the proper volume fractions of α,β and Ti2Cu phases in the microstructure. The additions of 4.5 wt% and 6 wt% Cu into the medical Ti6Al4 V alloy could enhance the wear resistance and corrosion resistance of the alloy, but the addition of 7.5 wt% Cu showed an opposite effect. With the increase of the Cu content, the antibacterial property was enhanced due to the increased volume fraction of Ti2Cu phase in the microstructure, but when the Cu content was increased to 7.5 wt%, cytotoxicity was presented. A medium Cu content of 6 wt%, with annealing temperature of 740℃ make the alloy possesses the best comprehensive properties of tensile properties, wear resistance, corrosion resistance, antibacterial property and biocompatibility, which is promising for future medical applications.

Effects of Al and Ni on copper-rich phases in the scale/steel interface after high-temperature oxidation of copper-containing steel

A study was conducted on the formation of a Cu-rich phase at the scale/steel interface of Cu-containing steel by high-temperature oxidation with varying amounts of A1 and Ni. Both A1 and Ni were found to help decrease the amount of the Cu-rich phase at the interface. Analysis of the effects by these elements was conducted in terms of the melting point of the Cu-rich phase, the solid solubility of Cu in austenite, the rate of oxidation, and the amount of Cu-rich phase occlusions in scales. Because of selective oxidation,in which A1 and Ni are oxidized more and less preferentially than Fe, respectively, A1 was weakly concentrated at the interface whereas Ni was more heavily concentrated in it. Thus, A1 exerted no effect on the melting point of the Cu-rich phase, whereas Ni raised its melting point. A1, which was applied at contents of less than 2.0%, decreased the solubility of Cu in austenite but this effect weakened at the interface during oxidation. By contrast,Ni increased the solubility of Cu, and this effect was strengthened with oxidation. Both A1 and Ni promoted internal oxidation and the formation of occlusions.

EFFECTS OF COPPER ION IMPLANTATION ON ANTIBACTERIAL ACTIVITY OF AISI420 STAINLESS STEEL

Antibacterial activity of AISI420 stainless steel (SS) implanted by copper was investigated. Ions extracted from a metal vapor vacuum arc (MEVVA) are sourced with 100keV energy and a dose range from 0.2×1017 to 2.0×1017ions·cm-2. The saturation dose of Cu implantation in AISI420 SS and Cu surface concentration were calculated at the energy of 100keV. The effect of dose on the antibacterial activity was analyzed. Results of antibacterial test show that the saturation dose is the optimum implantation dose for best antibacterial activity, which is above 99% against both Escherichia coli and Staphylococcus aureus. Novel phases such as Fe4Cu3 and Cu9.9Fe0.1 were found in the implanted layer by glancing angle X-ray diffraction (GXRD). The antibacterial activity of AISI420 SS attributes to Cu-contained phase.

Enhanced conductivity and stability of Co_(0.98)Cu_(x)Mn_(2.02−x)O_(4)ceramics with dual phases and twin structures

Semiconductor materials with heterogeneous interfaces and twin structures generally demonstrate a higher concentration of carriers and better electrical stability.A variety of Cu-doped Co_(0.98)Cu_(x)Mn_(2.02−x)O_(4)(0≤x≤0.5)negative temperature coefficient(NTC)ceramics with dual phases and twin structures were successfully prepared in this study.Rietveld refinement indicates that the content of a cubic spinel phase increases with increasing Cu content.The addition of Cu can promote grain growth and densification.Atomic-level structural characterization reveals the evolution of twin morphology from large lamellae with internal fine lamellae(LIT lamellae)to large lamellae without internal fine lamellae(L lamellae)and the distribution of twin boundary defects.First-principles calculations reveal that the dual phases and twin structures have lower oxygen-vacancy formation energy than those in the case of the pure tetragonal and cubic spinel,thereby enhancing the transmission of carriers.Additionally,the three-dimensional charge-density difference shows that metal ions at the interface lose electrons and dwell in high valence states,thereby enhancing electrical stability of the NTC ceramics.Furthermore,the additional Cu ions engage in electron-exchange interactions with Mn and Co ions,thereby reducing resistivity.In comparison to previous Cu-containing systems,the Co_(0.98)Cu_(x)Mn_(2.02−x)O_(4)series exhibit superior stability(aging value≤2.84%),tunable room-temperature resistivity(ρ),and material constant(B)value(17.5Ω·cm≤ρ≤7325Ω·cm,2836 K≤B≤4315 K).These discoveries lay a foundation for designing and developing new NTC ceramics with ultra-high performance.

Addressing the strength-ductility trade-off in a cast Al-Li-Cu alloy—Synergistic effect of Sc-alloying and optimized artificial ageing scheme

A dramatic improvement of strength and ductility of cast Al-2.5Li-1.5Cu-1Zn-0.5Mg-0.15 Zr alloy was obtained by the collaboration of Sc-alloying and optimized ageing scheme.Joint and independent influence of Sc-alloying and different ageing temperatures were investigated.The results revealed that a substantial increase was realized in the hardness of Sc-containing alloy,and the ageing response time was only influenced by ageing temperature.Coarse and heterogeneousδ'(Al_(3)Li),wideδ'-precipitation free zones(δ'-PFZs),and a large amount of T_(1)(Al_(2)CuLi)precipitates were observed in Sc-containing alloy aged at 175℃,which resulted in superior yield strength and poor elongation.The Sc-containing alloy obtained an excellent combination of ductility(elongation=8.2%)and tensile strength(ultimate strength=565 MPa)suffered to 150℃ ageing for 64 h.The increase in the elongation was mainly due to the combined effect of grain refining,much finerδ',and extremely narrowδ'-PFZs(<10 nm),while the higher strength was mainly attributed to the formation of Al_(3)(Sc,Zr,Li)composite particles and a large amount of S'(Al_(2)CuMg)phase.However,the enhancement of the different ageing temperature(150℃ and 175℃)on the mechanical properties of the alloys without Sc addition was not obvious.