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Verification of SEU resistance in 65 nm high-performance SRAM with dual DICE interleaving and EDAC mitigation strategies 被引量:2
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作者 Ze He Shi-Wei Zhao +5 位作者 Tian-Qi Liu Chang Cai Xiao-Yu Yan Shuai Gao Yu-Zhu Liu Jie Liu 《Nuclear Science and Techniques》 SCIE EI CAS CSCD 2021年第12期64-76,共13页
A dual double interlocked storage cell(DICE)interleaving layout static random-access memory(SRAM)is designed and manufactured based on 65 nm bulk complementary metal oxide semiconductor technology.The single event ups... A dual double interlocked storage cell(DICE)interleaving layout static random-access memory(SRAM)is designed and manufactured based on 65 nm bulk complementary metal oxide semiconductor technology.The single event upset(SEU)cross sections of this memory are obtained via heavy ion irradiation with a linear energy transfer(LET)value ranging from 1.7 to 83.4 MeV/(mg/cm^(2)).Experimental results show that the upset threshold(LETth)of a 4 KB block is approximately 6 MeV/(mg/cm^(2)),which is much better than that of a standard unhardened SRAM with an identical technology node.A 1 KB block has a higher LETth of 25 MeV/(mg/cm^(2))owing to the use of the error detection and correction(EDAC)code.For a Ta ion irradiation test with the highest LET value(83.4 MeV/(mg/cm^(2))),the benefit of the EDAC code is reduced significantly because the multi-bit upset proportion in the SEU is increased remarkably.Compared with normal incident ions,the memory exhibits a higher SEU sensitivity in the tilt angle irradiation test.Moreover,the SEU cross section indicates a significant dependence on the data pattern.When comprehensively considering HSPICE simulation results and the sensitive area distributions of the DICE cell,it is shown that the data pattern dependence is primarily associated with the arrangement of sensitive transistor pairs in the layout.Finally,some suggestions are provided to further improve the radiation resistance of the memory.By implementing a particular design at the layout level,the SEU tolerance of the memory is improved significantly at a low area cost.Therefore,the designed 65 nm SRAM is suitable for electronic systems operating in serious radiation environments. 展开更多
关键词 Double interlocked storage cell(DICE) Error detection and correction(EDAC)code Heavy ion Radiation hardening technology Single event upset(SEU) Static random-access memory(SRAM)
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Removing Random-Valued Impulse Noises by a Two-Staged Nonlinear Filtering Method
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作者 Ahmad Ashfaq Lu Yanting 《Transactions of Nanjing University of Aeronautics and Astronautics》 EI CSCD 2016年第3期329-338,共10页
Digital images are frequently contaminated by impulse noise(IN)during acquisition and transmission.The removal of this noise from images is essential for their further processing.In this paper,a two-staged nonlinear f... Digital images are frequently contaminated by impulse noise(IN)during acquisition and transmission.The removal of this noise from images is essential for their further processing.In this paper,a two-staged nonlinear filtering algorithm is proposed for removing random-valued impulse noise(RVIN)from digital images.Noisy pixels are identified and corrected in two cascaded stages.The statistics of two subsets of nearest neighbors are employed as the criterion for detecting noisy pixels in the first stage,while directional differences are adopted as the detector criterion in the second stage.The respective adaptive median values are taken as the replacement values for noisy pixels in each stage.The performance of the proposed method was compared with that of several existing methods.The experimental results show that the performance of the suggested algorithm is superior to those of the compared methods in terms of noise removal,edge preservation,and processing time. 展开更多
关键词 image de-noising random-valued impulse noise nonlinear filter noisy pixel detection two-stage detection and correction method cascaded stages directional differences
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Low cost design of microprocessor EDAC circuit
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作者 郝丽 于立新 +1 位作者 彭和平 庄伟 《Journal of Semiconductors》 EI CAS CSCD 2015年第11期88-92,共5页
An optimization method of error detection and correction(EDAC) circuit design is proposed. The method involves selecting or constructing EDAC codes of low cost hardware, associated with operation scheduling implemen... An optimization method of error detection and correction(EDAC) circuit design is proposed. The method involves selecting or constructing EDAC codes of low cost hardware, associated with operation scheduling implementation based on 2-input XOR gates structure, and two actions for reducing hardware cells, which can reduce the delay penalties and area costs of the EDAC circuit effectively. The 32-bit EDAC circuit hardware implementation is selected to make a prototype, based on the 180 nm process. The delay penalties and area costs of the EDAC circuit are evaluated. Results show that the time penalty and area cost of the EDAC circuitries are affected with different parity-check matrices and different hardware implementation for the EDAC codes with the same capability of correction and detection code. This method can be used as a guide for low-cost radiation-hardened microprocessor EDAC circuit design and for more advanced technologies. 展开更多
关键词 error detection and correction hardware implementation MICROPROCESSOR single-event upsets
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