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Temperature stress analysis for bi-modulus beam placed on Winkler foundation
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作者 Jinling GAO Wenjuan YAO Jiankang LIU 《Applied Mathematics and Mechanics(English Edition)》 SCIE EI CSCD 2017年第7期921-934,共14页
The materials with different moduli in tension and compression are called bi-modulus materials. Graphene is such a kind of materials with the highest strength and the thinnest thickness. In this paper, the mechanical ... The materials with different moduli in tension and compression are called bi-modulus materials. Graphene is such a kind of materials with the highest strength and the thinnest thickness. In this paper, the mechanical response of the bi-modulus beam subjected to the temperature effect and placed on the Winkler foundation is studied. The differential equations about the neutral axis position and undetermined parameters of the normal strain of the bi-modulus foundation beam are established. Then, the analytical expressions of the normal stress, bending moment, and displacement of the foundation beam are derived. Simultaneously, a calculation procedure based on the finite element method (FEM) is developed to obtain the temperature stress of the bi-modulus struc- tures. It is shown that the obtained bi-modulus solutions can recover the classical modulus solution, and the results obtained by the analytical expressions, the present FEM proce- dure, and the traditional FEM software are consistent, which verifies the accuracy and reliability of the present analytical model and procedure. Finally, the difference between the bi-modulus results and the classical same modulus results is discussed, and several reasonable suggestions for calculating and optimizing the certain bi-modulus member in practical engineering are presented. 展开更多
关键词 bi-modulus beam Winkler foundation temperature stress analytical so-lution secondary development of program
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