Bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy

The bonding interface characteristic and shear strength of diffusion bonded Ti-17 titanium alloy at different bonding time were investigated. The results show that the average size of voids decreases while the amount of voids decreases after increasing to the maximum value with the increasing bonding time. The irregular void with a scraggly edge tends to an ellipse void with smooth surface and then changes to a tiny void with round shape. The grains across bonding interface occur at bonding time of 60 min. The shear strength of bond increases with increasing bonding time, and the highest shear strength of bond is 887.4 MPa at 60 min. The contribution of plastic deformation on the void closure and the increase of shear strength is significant even though the action time of plastic deformation is short.

Tungsten/steel diffusion bonding using Cu/W-Ni/Ni multi-interlayer

Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu-Ni sub-layer/W-Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W-Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W-10Ni powder mixtures. Sound bonding between tungsten base material and W-Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W-Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could withstood 60 thermal cycles quenching from 700 °C to room temperature.

Hybrid bonding of GaAs and Si wafers at low temperature by Ar plasma activation

High-quality bonding of 4-inch GaAs and Si is achieved using plasma-activated bonding technology.The influence of Ar plasma activation on surface morphology is discussed.When the annealing temperature is 300℃,the bonding strength reaches a maximum of 6.2 MPa.In addition,a thermal stress model for GaAs/Si wafers is established based on finite element analysis to obtain the distribution of equivalent stress and deformation variables at different temperatures.The shape varia-tion of the wafer is directly proportional to the annealing temperature.At an annealing temperature of 400℃,the maximum protrusion of 4 inches GaAs/Si wafers is 3.6 mm.The interface of GaAs/Si wafers is observed to be dense and defect-free using a transmission electron microscope.The characterization of interface elements by X-ray energy dispersion spectroscopy indi-cates that the elements at the interface undergo mutual diffusion,which is beneficial for improving the bonding strength of the interface.There is an amorphous transition layer with a thickness of about 5 nm at the bonding interface.The preparation of Si-based GaAs heterojunctions can enrich the types of materials required for the development of integrated circuits,improve the performance of materials and devices,and promote the development of microelectronics technology.

Time-dependent effects in transient liquid phase bonding of 304L and Cp-Ti using an Ag-Cu interlayer

One of the challenges for bimetal manufacturing is the joining process.Hence,transient liquid phase(TLP)bonding was performed between 304L stainless steel and Cp-Ti using an Ag-Cu interlayer with a thickness of 75μm for bonding time of 20,40,60,and 90 min.The bonding temperature of 860℃ was considered,which is under the β transus temperature of Cp-Ti.During TLP bonding,various intermetallic compounds(IMCs),including Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe),Ti_(2)(Cu,Ag),and Ti_(2)Cu from 304L toward Cp-Ti formed in the joint.Also,on the one side,with the increase in time,further diffusion of elements decreases the blocky IMCs such as Ti_(5)Cr_(7)Fe_(17),(Cr,Fe)_(2)Ti,Ti(Cu,Fe)in the 304L diffusion-affected zone(DAZ)and reaction zone,and on the other side,Ti_(2)(Cu,Ag)IMC transformed into fine morphology toward Cp-Ti DAZ.The microhardness test also demonstrated that the(Cr,Fe)_(2)Ti+Ti_(5)Cr_(7)Fe_(17) IMCs in the DAZ on the side of 304L have a hardness value of HV 564,making it the hardest phase.The maximum and minimum shear strength values are equal to 78.84 and 29.0 MPa,respectively.The cleavage pattern dominated fracture surfaces due to the formation of brittle phases in dissimilar joints.

Interfacial microstructure and chemical stability during diffusion bonding of single crystal Al_2O_3-fibres with Ni25.8Al9.6Ta8.3Cr matrix

BN coated A1203 fibre-reinforced NiAl-alloy composites were fabricated by hot pressing at 1 200-1 400 ℃, and the interracial microstructure and chemical stability of BN coated Al2O3 fibre-reinforced NiAl-alloy composites were investigated by scanning electron microscopy （SEM） and analytical transmission electron microscopy （TEM）. It was found that the complicated chemical reactions and diffusion processes happened in the interface area between BN-layer and Ni25.8A19.6Ta8.3 during the hot pressing at 1 200-1 400 ℃. A continuous AlN-layer was formed at the interface due to the reaction between NiAl and BN. At the same time, Cr diffused extensively into the BN-layer and reacted with boron to form Cr boride precipitates （CrsB3）. In addition, a few particles of Ta-rich phase were also precipitated in NiAl matrix near the interface.

SUPERPLASTICITY AND DIFFUSION BONDING OF IN718 SUPERALLOY

The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial strain rates using the tensile speed mutation method; m reached its maximum value 0.53 at an initial strain rate of 1×10^-4s^-1 at 1253K. The diffusion bonding parameters, including the bonding temperature T, pressure p, and time t, affected the mechanism of joints. When the bonded specimen with 25μm thick nickel foil interlayer was tensile at room temperature, the shear fracture of the joints with nickel foil interlayer took place at the IN718 part. Microstructure study was carried out with the bonded samples. The microstructure shows an excellent bonding at the interfaces. The optimum parameters for the diffusion bonding are： T = 1273-1323K, p = 20-30MPa, t = 45-60min.

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.

A novel diffusion model considering curvature radius at the bonding interface in a titanium/steel explosive clad plate

This article introduces an element diffusion behavior model for a titanium/steel explosive clad plate characterized by a typical curved interface during the heat-treatment process. A series of heat-treatment experiments were conducted in the temperature range from 750℃ to 950℃, and the effects of heat-treatment parameters on the microstructural evolution and diffusion behavior were investigated by optical microscopy, scanning electron microscopy, X-ray diffraction analysis, and electron-probe microanalysis. Carbon atoms within the steel matrix were observed to diffuse toward the titanium matrix and to aggregate at the bonding interface at 850℃ or lower; in contrast, when the temperature exceeded 850℃, the mutual diffusion of Ti and Fe occurred, along with the diffusion of C atoms, resulting in the for- marion of Ti-Fe intermetallics （Fe2Ti/FeTi）. The diffusion distances of C, Ti, and Fe atoms increased with increasing heating temperature and/or holding time. On the basis of this diffusion behavior, a novel diffusion model was proposed. This model considers the effects of various factors, including the curvature radius of the curved interface, the diffusion coefficient, the heating temperature, and the holding rime. The experimental results show good agreement with the calculated values. The proposed model could clearly provide a general prediction of the elements＇ diffusion at both straight and curved interfaces.

Transient liquid phase diffusion bonding of copper alloy to stainless steel using CuMn alloys as interlayer

With CuMn alloy as interlayer, the transient liquid phase (TLP) diffusion bonding of Cu alloys (CuAlBe) to stainless steel (1Cr18Ni9Ti) was studied. The results show that the bonding pressure, time and temperature and the content of Mn in CuMn alloy have great effects on the strength of bonding interface; when they are 1 MPa, 40 min, 1 223 K and 30% respectively, the maximum joint strength of 487 MPa is attained. The fracture occurring at the bonding interface is a plastic one and the effect of Mn has been analyzed.

The effect of thermal cycle on joint of Ti/stainless steel phase transformation diffusion bonding

The effects of thermal cycle parameters on the tensile strength and fracture characteristics of phase transformation diffusion bonding(PTDB) joint of titanium and stainless steel (Ti/SS) were studied in this paper. With the maximum cyclic temperature of 1 173～1 223 K , the minimum cyclic temperature of 1 073～1 093 K , the heating velocity of 30～50 K/s , the cooling velocity of 15～20 K/s , the cycle numbers of 15～20 and bonding pressure is 13 MPa , the tensile strength of joint is more than 380 MPa , exceeding 80% of that of Ti.

Diffusion bonding between nickel－base superalloy K24 and heat－resisting steel 1Cr11Ni2W2MoV

The Vacuum diffusion bonding between nickel-base superalloy K24 and heatresisting steel 1Cr11Ni2W2MoV was studied and the effects of welding parameters,including bonding temperature T,pressure P,time t,vacuum V and interlayer thickness h ,on the microstructure and properties of the joint were investigated.The optimum parameters for the diffusion bonding were found to be:T=1100￣1200℃,t=5￣30 MPa,V≥1×10-2 Pa.When the welded specimens are tensioned at room temperature,ductile fracture takes place at the nickel-base superalloy part or at the joint and the tensile strength reaches 850 MPa,When the tensile tests are carried out at 500℃ ,all the bonded specimens fractured at heat-resisting steel part,and tensile strength is 750 MPa.The interlayer thickness greatly affects the joint properties,and the interlayer thickness depends on the size of the bonded specimen.The impeller of nickel-base superalloy K24 and shaft of heat-resisting steel 1Cr11Ni2MoV,which are used in aerospace engine,has been successfully jointed jointed by means of high frequency induction diffusion bonding.

Diffusion Bonding of Al6061 and Cu by Hot Isostatic Pressing

Diffusion bonding between Al and Cu was successfully performed by hot isostatic pressing(HIP). To improve the strength of diffusion bonding joint, pure nickel foils with different thickness were used as intermediate layer. Microstructure of the interface between Al and Cu was investigated by X-ray diffraction(XRD) technique, secondary electron microscopy(SEM), and nano-indentation tests. When the temperature was 500 ℃ and held for 3 h with a processing pressure of 50 MPa, Al and Cu could be bonded with its interface formed by several diffusion layers. With the addition of Ni interlayer, the diffusion of aluminum atoms was effectively hindered, and the interface became smoother. The tensile strength of bonded joints increases with increasing the thickness of Ni interlayer, which contributes to a reduction in the thickness of intermetallic compounds(IMCs) and well bonding quality of Al-Cu joints.

Diffusion bonding of Ti-6Al-4V to ZQSn10-10 in vacuum

The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy （SEM）, energy dispersive spectroscopy （ EDS ） and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s.

Development of processing windows for diffusion bonding of Ti-6Al-4V titanium alloy and 304 stainless steel with silver as intermediate layer

As titanium alloy is chemically reactive,it is very difficult to join by conventional welding techniques.Titanium alloys can easily pick up nitrogen and oxygen from the atmosphere.In the fusion welding method,brittle intermetallic compounds are formed when joining titanium alloy and stainless steel,which decrease the mechanical behavior of the couples.Hence,for joining of titanium alloy,diffusion bonding is recommended.This work dealt with the measurement of feasible process parameters for diffusion bonding of Ti-6Al-4V and AISI 304 stainless steel with silver as an intermediate layer.The quality of the bonds was confirmed by the lap shear test and microstructural analysis.With the experimental results obtained,diffusion bonding windows were constructed and this will act as reference maps to identify the process parameters for obtaining defect free bond.Bonding was successful in the temperature range of 750-800 °C.Maximum lap shear strength was achieved under a bonding pressure of 5 MPa and holding time of 90 min.

Theoretical Model of Transformation Superlastic Diffusion Bonding for Eutectoid Steel

Based on current theories of diffusion and creep cavity closure at high temperature, a theoretical analysis of phase transformation diffusion bonding for T8/T8 eutectoid steel is carried out. The diffusion bonding is mainly described as two-stage process: Ⅰ The interfacial cavity with shape change from diamond to cylinder.Ⅱ The radius of the cylindrical cavity are reduced and eliminated gradually. A new theoretical model is established for the process of transformation superplastic diffusion bonding (TSDB) on the basis of a theoretical model for isothermal superplastic diffusion. The model can predict the bonding quality which is affected by technological parameters, such as limit cycling temperature, the compressive stress, the numbers of thermal cycles and temperature cycling through the phase transformation in the thermal cycling and so on. Results show that the maximum temperature, the compressive stress, the numbers of thermal cycles and the rate of temperature changing speed in the thermal cycling have an important influence on TSDB process. Meanwhile, reasonable technological parameters chosen from theoretical analysis is in good agreement with those obtained from experimental results.

A two-step transient liquid phase diffusion bonding process of T91 steels

In this study, a two-step heating process is introduced for transient liquid phase （ TLP） diffusion bonding fo r sound joints with T91 heat resistant steels. At first, a short-time higher temperature heating step is addressed to melt the interlayer, followed by the second step to complete isothermal solidification at a low temperature. The most critical feature of our new method is producing a non-planar interface at the T9／ heat resistant steels joint. We propose a transitional liquid phase bonding of T91 heat resistant steels by this approach. Since joint microstructures have been studied, we tested the tensile strength to assess joint mechanical property. The result indicates that the solidified bond may contain a primary solid-solution, similar composition to the parent metal and free from precipitates. Joint tensile strength of the joint is not lower than parent materials. Joint bend＇s strengths are enhanced due to the higher metal-to-metal junction producing a non-planar bond lines. Nevertheless, the traditional transient liquid phase diffusion bonding produces planar ones. Bonding parameters of new process are 1 260 °C for 0. 5 min and 1 230 °C fo r 4 min.

DIFFUSION BONDING OF TiAl TO Ti AND TC4 ALLOY

TiAl was diffusion bonded to Ti and TC4 alloy in vacuum furnace. Results showed,at the TiAl-Ti interface,the reaction layer of stratification Ti3Al was formed closest to TiAl base,and the a phase and the α + βphase arised closest to Ti base at 1173K and 1573K respectively. The phase structure of TiAl/ and the phase structure of TiAlwere observed be- tween AiAl and TC4 under respetive bonding temperature.The fiacture at tensile testing occurred in the bond - line, producing very flat fracture surfaces with some pull-out of the TiAl materials.The ultimate tensile strengths of the joint were approximate to γ-TiAl base marterial.

XRD and TEM Analysis in the Interface of Diffusion Bonding for Fe_3Al/Q235 Dissimilar Materials

Phase structure characteristics near the interface of Fe3Al/Q235 diffusion bonding are investigated by means of X raydiffraction (XRD), transmission electronic microscope (TEM) and electron diffraction, etc. The test results indicatedthat obviously a diffusion transition zone forms near the interface of Fe3Al/Q235 under the condition of heatingtemperature 1050~1100℃, holding time 60 min and pressure 9.8 MPa, which indicated that the diffusion interfaceof Fe3Al/Q235 was combined well. The diffusion transition zone consisted of Fe3Al and a-Fe(Al) solid solution.Microhardness near the diffusion transition zone was HM 480~540. There was not brittle phase of high hardness inthe interface transition zone. This is favorable to enhance toughness of Fe3Al/Q235 diffusion joint.

Diffusion bonding of Al 7075 and Mg AZ31 alloys:Process parameters, microstructural analysis and mechanical properties

Al 7075 and Mg AZ31 alloys were joined by diffusion bonding method. Joining process was performed in pressure range of 10-35 MPa at temperatures of 430-450 ℃ for 60 min under a vacuum of 13.3 MPa. The microstructure evaluation, phase analysis and distribution of elements at the interface were done using scanning electron microscopy （SEM）, energy-dispersive X-ray spectroscopy （EDS） and X-ray diffraction （XRD）. The pressure of 25 MPa was determined as the optimum pressure in which the minimum amount of plastic deformation takes place at the joint. Different reaction layers containing intermetallic compounds, such as Al12Mg17, Al3Mg2 andα（Al） solid solution, were observed, in interfacial transition zone （ITZ）. Thickness of layers was increased with increasing the operating temperature. According to the results, diffusion of aluminum atoms into magnesium alloy was more and the interface movement towards the Al alloy was observed. The maximum bond strength of 38 MPa was achieved at the temperature of 440 ℃ and pressure of 25 MPa. Fractography studies indicated that the brittle fracture originated from Al3Mg2 phase.

Diffusion Bonding of Ti_3Al Base Alloy

: The effects of diffusion bonding temperature and holding time on the joint strength of Ti3Al base alloy has been investigated in this paper. The shear strength of Ti-14Al-21Nb-3Mo-V alloy diffusion bonding joint under pressure of 12 MPa at 990℃ for 70 min was obtained to 797.6 MPa which approaches the base material strength. In addition, a short-time diffosion bonding process was studied in order to decrease the bonding cost. With the deformation of the specimens of 2.5% and the bonding temperature of 990℃ for 15 min, the bonding strength could reach 801 MPa.