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Electrochemical behavior of tungsten in(NaCl–KCl–NaF–WO_3)molten salt 被引量:3
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作者 Jie Li Xin-Yu Zhang +2 位作者 Ya-Bin Liu Yun-Gang Li Ri-Ping Liu 《Rare Metals》 SCIE EI CAS CSCD 2013年第5期512-517,共6页
Abstract The electrochemical reaction mechanism and electrocrystaUization process of tungsten in the NaCl- KCl-NaF-WO3 molten salt were investigated at 973 K (700℃) by means of cyclic voltammetry, chronopotentiomet... Abstract The electrochemical reaction mechanism and electrocrystaUization process of tungsten in the NaCl- KCl-NaF-WO3 molten salt were investigated at 973 K (700℃) by means of cyclic voltammetry, chronopotentiometry, and chronoamperometry techniques. The results show that the electrochemical reaction process of tungsten in the NaCl-KCl-NaF-WO3 molten salt system is a quasireversible process mix-controlled by ion diffusion rate and electron transport rate. Tungsten ion in this system is reduced to W(0) in two steps. The electrocrystallization process of tungsten is found to be an instantaneous, hemispheroid three-dimensional nucleation process and the tungsten ion diffusion coefficient of 2.361 × 10^-4 cm2.s^-1 is obtained at experimental conditions. 展开更多
关键词 NaCl-KClNaF-WO3 TUNGSTEN Electrochemical reduction mechanism electrocrystallization process
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Electrochemical behavior of Cu in the (NaCl-KCl-CuCl) molten salt 被引量:1
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作者 Yungang LI Jie LI +1 位作者 Kuai ZHANG Limin LIU 《Acta Metallurgica Sinica(English Letters)》 SCIE EI CAS CSCD 2011年第6期466-472,共7页
The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrode in the eutectic NaC1-KC1-CuC1 molten salt were investigated by means of cyclic voltammetry, chronopotentiometry and c... The electrochemical reaction mechanism and electrocrystallization process of Cu on copper electrode in the eutectic NaC1-KC1-CuC1 molten salt were investigated by means of cyclic voltammetry, chronopotentiometry and chronoamperometry tech-nique at 710℃. The results show that the electrochemical reaction process of Cu is a quasi-reversible process mix-controlled by Cu+ diffusion rate and electron transport rate;the electrochemical reduction mechanism is Cu+e→Cu;the electrocrystallization process of copper is an instantaneous hemispheroid three-dimensional nucleation process; the Cu diffusino coefficient is 4.3×10^-4cm^2·s^-1 under the experimental conditions. 展开更多
关键词 NaC1-KC1-CuC1 COPPER Electrochemical reduction mecha-nism electrocrystallization process
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