Electroless copper plating on microcellular polyurethane foam

In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.

Microstructure and electrical conductivity of electroless copper plating layer on magnesium alloy micro-arc oxidation coating

In order to impart electrical conductivity to the magnesium alloy micro-arc oxidation(MAO)coating,the electroless copper plating was performed.Effects of plating temperature and complexing agent concentration on the properties of the electroless copper plating layers were studied by measuring their microstructure,corrosion resistance and electrical conductivity.It was found that the optimized plating temperature was 60°C,and the most suitable value of the complexing agent concentration was 30 g/L.Under this condition,a complete and dense plating layer could be obtained.The formation mechanism of the plating layer on magnesium alloy MAO coating was analyzed.A three-stage model of the plating process was proposed.The square resistance of the plated specimen was finally reduced to 0.03Ω/□after the third stage.Through electroless copper plating,the MAO coated sample obtained excellent electrical conductivity without significantly reducing its corrosion resistance.

Anode oxidation of HCHO in THPED-containing electroless copper plating solution

The electrochemical mechanism of anode oxidation of HCHO in electroless copper plating solution with N, N, N′, N′-tetrakis(2-hydroxypropyl)ethylenediamine (THPED) was investigated by measuring cyclic voltammetry curves and anodic polarization curves. Three different oxidation peaks occur at the potentials of -0.62 V (Peak 1), -0.40 V (Peak 2) and -0.17 V (Peak 3) in the anode oxidation process of THPED-containing solution. The reaction at Peak 1, a main oxidation reaction, is the irreversible reaction of adsorbed HCHO with hydrogen evolution. The reaction at Peak 2, a secondary oxidation reaction, is the quasi-reversible reaction of adsorbed HCHO without hydrogen evolution. The reaction at Peak 3 is the irreversible oxidation of anode copper. The current density of Peak 1 increases gradually, that of Peak 2 remains constant and that of Peak 3 decreases with the increase of HCHO concentration. The current density of Peak 3 increases with the increase of THPED concentration and the complexation of THPED promotes the dissolution of anode copper.

Electroless copper-phosphorus coatings with the addition of silicon carbide (SiC) particles

Cu-P-silicon carbide （SiC） composite coatings were deposited by means of electroless plating.The effects of pH values,temperature,and different concentrations of sodium hypophosphite （NaH2PO2·H2O）,nickel sulfate （NiSO4·6H2O）,sodium citrate （C6H5Na3O7·2H2O） and SiC on the deposition rate and coating compositions were evaluated,and the bath formulation for Cu-P-SiC composite coatings was optimised.The coating compositions were determined using energy-dispersive X-ray analysis （EDX）.The corresponding optimal operating parameters for depositing Cu-P-SiC are as follows：pH 9;temperature,90oC;NaH2PO2·H2O concentration,125 g/L;NiSO4·6H2O concentration,3.125 g/L;SiC concentration,5 g/L;and C6H5Na3O7·2H2O concentration,50 g/L.The surface morphology of the coatings analysed by scanning electron microscopy （SEM） shows that Cu particles are uniformly distributed.The hardness and wear resistance of Cu-P composite coatings are improved with the addition of SiC particles and increase with the increase of SiC content.

The Chemical State of a Silver-Copper Complex Image Formed during the Electroless Copper Deposition

By means of electroless copper deposition method a complex image has been fabricated in a mixture of cupric sulphate and formaldehyde, the surface and subsurface properties of which has been studied in detail by X-ray photoelectron spectroscopy (XPS) combined with sputter depth profiling technique analyzing distribution and chemical state of copper and silver. Depth profiling by XPS in conjunction with Ar+ sputtering shows that the catalytic activity of silver persists, catalyzing reduction of copper. The integral areas of spectra Ag3d after electroless copper deposition for 5 min at different sputtering times demonstrate that the amount of silver at the surface is greater than that in the interior. And then, the quite likely reasonable explanations are provided for the result. Additionally, the chemical shift of Ag3d XPS and deconvolution of Ag3d XPS spectrum have been also analyzed respectively at length.

Process optimization of electroless copper plating and its influence on electrochemical properties of AB_5-type hydrogen storage alloy

The amount of Cu coating by chemical plating was investigated based on quadratic regression orthogonal experimental design being adapted to the variation law of temperature, pH value and Ni2+ concentration, and the relevant regression equation was expressed as y=2.1609+0.5295×10-3T2-0.0342P2-0.0265N2+0.0023TP+0.0020TH+0.0199PN-0.0959T+0.3814P-0.2073N. The results showed that the deposition rate augmented with the increasing in temperature, pH value and Ni2+ concentration. The experimental parameters of the optimal coating were temperature 75 °C, pH value 8.5 and Ni2+ concentration 1.2 g/L. The electrochemical tests indicated that the cycle stability increased from 60.66% to 75.58%, indicating that the treated alloy exhibited better corrosion resistance.

Electroless copper plating using dimethylamine borane as reductant

Electroless copper plating was studied using dimethylamine borane （DMAB） as reductant and 1,5,8,12- tetraazadodecane as additive and triethanolamine （TEA） as buffer. The effects of pH, temperature and concentrations of reactants and additives on the anodic oxidation of DMAB and the cathodic reduction of copper ion were investigated. Experimental results indicate that high pH values （10-12.5） promote the oxidation of DMAB, and suppress the reduction of the copper ion, while high bath temperatures （55-70℃） accelerate both anodic oxidation and cathodic reduction. Increase of the Cu2＋and DMAB concentrations can improve the deposition rate of copper plating. Results for a dual-chelating-agent system indicate that 1,5,8,12-tetraazadodecane plays an important role in chelation, while the main effect of TEA is adsorption on copper surfaces to inhibit DMAB oxidation and to promote deposition.

A New Approach on the Active Treatment for Electroless Copper Plating on Glass

A new method is described for the electroless deposition of copper onto glass. Commercially available glass slide was modified with γ-aminopropyltrimethoxysilane to form self-assembled monolayer (SAM) on it. Then it was dipped directly into PdCl_2 solution instead of the conventional SnCl_2 sensitization followed by PdCl_2 activation. Experimental results showed that the Pd 2+ ions from PdCl_2 solution were coordinated to the amino groups on the glass surface resulting in the formation of N-Pd complex. In an electroless copper bath containing a formaldehyde reducing agent, the N-Pd complexes were reduced to Pd 0 atoms, which then acted as catalysts and initiated the deposition of copper metal. Although the copper deposition rate on SAM-modified glass was slow at the beginning, it reached to that of conventional method in about 5 min.

Preparation of copper-coated fine molybdenum powders with electroless technique

The molybdenum powders with average particle size of 3 μm were coated with copper by electroless plating. The influence of pretreatment, solution composition and plating conditions on electroless copper plating was studied. The copper-coated molybdenum powders were examined by SEM and XRD. Results indicate that a series of optimization methods is used to add activated sites before electroless copper plating. Taking TEA and EDTA as chief and assistant complex agents respectively, 2,2＇-bipyridyl and PEG as double stabilizers, the Mo powders are coated with copper successfully with little Cu20 contained, at the same time, Mo-Cu composite powders with copper content of 15 - 85 wt% can be obtained. The optimal values of pH, temperature and HCHO concentration are 12 -13, 60 -65 ℃ and 22 -26 mL/L, respectively.

Development of Electroless Copper and Gold Plating on Wood

The use of more and more electron products requires interior wood products to have the performance of electromagnetic shielding. One of the ways to realize it is to introduce the chemical plating which has already been developed in electron industry into wood processing. The paper clarifies the mechanism of electroless copper and gold plating and its application to wood. It emphasizes the development and technology of electroless copper and gold plating on wood. Meanwhile, it points out that it is highly feasible to take this technology into effect.

Preparation and characterization of molybdenum powders with copper coating by the electroless plating technique

Molybdenum powders with a diameter of approximately 3 μn were coated with copper using the electroless plating technique in the pH 12.5-13 and temperature range of 55-75℃. The optimization of the electroless copper bath was evaluated through the combination of process parameters like pH and temperature. The optimized values ofpH and temperature were found to be 12.5 and 60℃, respectively, which attributes to the bright maroon color of the coating with an increase in weight of 46%. The uncoated and coated powders were subjected to microstructural studies using scanning electron microscope （SEM） and the phases were analyzed using X-my diffrction （XRD）. An attempt was made to understand the growth mechanism of the coating. The diffusion-shrinkage autocatalytic model was suggested for copper growth on the molybdenum surface.

Development of copper coatings on molybdenum powders by electroless plating technique

Mo powders with average particle size of 3 μm were attempted to coat with copper by electroless plating technique. The effect of the solution composition and plating conditions on the electroless copper plating was studied. The uncoated and coated powders were subjected to the microstructural studies by SEM and the phases were analyzed by XRD. The results indicate that the Mo powders are coated with copper,at the same time,Mo-Cu composite powders with Cu content ranging from 15% to 85%(mass fraction) can be obtained. The optimal values of pH,HCHO concentration and temperature are in the ranges of 12-13,22-26 ml/L and 60-65 ℃,respectively. The diffusion-shrinkage autocatalytic model is suggested for the growth mechanism of electroless coating over the surface.

Activator-assisted electroless deposition of copper nanostructured films

This paper showed simple and effective synthesis of copper nanoparticles within controlled diameter using direct electroless deposition on glass substrates, following the sensitization and activation steps. Electroless-deposited metals, such as Cu, Co, Ni, and Ag, and their alloys had many advantages in micro- and nanotechnologies. The structural, morphological, and optical properties of copper deposits were characterized using X-ray diffraction （XRD）, atomic force microscopy （AFM）, and UV-Vis spectroscopy. The structural data was further analyzed using the Rietveld refinement program. Structural studies reveal that the deposited copper prefers a （111） orientation. AFM studies suggest the deposited materials form compact, uniform, and nanocrystalline phases with a high tendency to self-organize. The data show that the particle size can be controlled by controlling the activator concentration. The absorption spectra of the as-deposited copper nanoparticles reveal that the plasmonic peak broadens and exhibits a blue shift with decreasing particle size.

Surface characterization and electrical resistivity of electroless plating nanocrystalline copper films on glass

Nanocrystalline copper films were prepared on the glass by electroless plating technique. The surface characterization of copper films with different deposition time was studied by field emission scanning electron microscopy(FESEM) and atomic force microscopy(AFM). The results indicate that the copper films have a(111) texture. A continuous and smooth film forms on the glass substrate at deposition times of 5 min. The surface roughness of as-deposited copper films becomes rougher with large nodules as the deposition time increases. According to Fuchs-Sondheimer(F-S),Mayadas-Shatzkes(M-S) theory and a combined model,the grain boundary reflection coefficient(R) is calculated in the range of 0.40-0.75. The theoretical analysis based on the experimental results show that the grain boundaries contribute mainly to the increase of electrical resistivity of nanocrystalline copper film compared with the film surfaces.

Experimental Investigations on Electroless Deposition of Copper on Basalt Fibers

In this work, an electroless method of coating copper on the basalt short fibers using copper sulphate solution is described. In order to avoid any interfacial reactions in the basalt fiber reinforced metal matrix composites, the basalt fibers were coated with copper. The effects of the time of sensitization, activation, metallization, PdCl2 concentration, pH and temperature bath on the extent of copper coating on basalt fiber are reported. The conditions used for electroless coating were optimized to obtain a uniform and continuous layer of copper. Using this method, it is possible to deposit up to about 25 wt% copper on the basalt fiber. The resultant composite fiber was characterized by scanning electron microscopy (SEM)/energy-dispersive X-ray (EDX) during and after the coating process. The effects of the thickness of copper coating on surface condition and also the tensile strength of the basalt fibers have been investigated. The study of surface condition of the coated basalt fibers by SEM showed that the copper coating at the thickness of about 0.2 μm had the best continuity on the basalt fibers. The results of tensile tests of basalt fibers coated with different thickness of copper showed that increasing the thickness of coating layer decreased the overall strength of fibers.

热致液晶高分子膜的表面处理及化学镀铜

论文采用氢氧化钠(NaOH)溶液对Vecstar型热致液晶高分子(TLCP)膜表面进行刻蚀粗化,然后通过3-氨丙基三乙氧基硅烷(KH550)在膜表面引入氨基,利用氨基络合银离子使膜表面活化,再进行无钯化学镀铜,提升了TLCP膜与金属铜之间的黏附力。借助扫描电子显微镜(SEM)、接触角测量仪、X射线衍射仪(XRD)和剥离测试等对经表面处理及化学镀铜后的TLCP膜进行表征,探讨了NaOH溶液浓度、表面粗化温度和时间、活化溶液组成等对TLCP表面化学镀铜的影响。结果表明,经表面处理后TLCP膜表面产生均匀的孔洞,接触角下降至29.30°,亲水性大幅提高;所镀铜层呈光亮的粉色,带有金属光泽,致密平滑,纯度高,镀层厚度可达2.78μm,与TLCP膜间的附着力等级达到了5B。

PCB化学镀铜新型稳定剂配方与工艺研究

考察了在以EDTA为主络合剂、三聚甲醛为还原剂、酒石酸钾钠为辅助络合剂的化学镀铜基础液里甲醇含量和添加剂盐酸胍、亚铁氰化钾、1,1-联吡啶对镀液性能的影响,同时研究了其中任何一种化合物含量的变化对印刷电路板镀性的影响,得到了适宜的配方和试验条件,实验结果表明:配方中各种添加剂对镀液性能的影响程度不同,少量甲醇的添加能显著抑制甲醛的分解,聚甲醛的使用较甲醛方便,改善了操作环境。添加稳定剂明显改善了镀液的性能,镀液温度可以提高到50℃,生产效率提高。

Electroless Plating Lead and Lead-Tin on Copper Using an Eco-Friendly Plating Bath

Copper serpentines used in gas heaters are currently coated with lead-tin alloy using hot-dip technology where copper is immersed in molten lead (98%)-Tin at about 400°C. The major drawback of this technique is the pollution resulted from lead vapors which cause much harm to the labors in the unit. The present work investigates an eco-friendly plating technique to replace the currently used technology. Electroless plating of copper samples with lead or Lead (98%)-Tin alloy is carried out from a plating bath contained lead salt, tin salt, reducing agent and stabilizing agent. The parameters affecting the coating quality such as the plating time, temperature and bath composition were optimized. The chemical analysis and coating morphology of the formed coatings are examined by XRD, SEM and EDS to reach the best bath composition as well as the best conditions to coat copper with lead or lead-tin electrolessly. The electrochemical properties of copper and copper coated samples are also examined using electrochemical impedance spectroscopy.

Parameters optimization of electroless deposition of Cu on Cr-coated diamond

Electroless copper plating on diamond particles precoated with 1%Cr was carried out to evaluate the effects of various experimental parameters on coating quality and deposition rate to obtain the optimized reaction parameters. The formulated samples under optimized parameters were characterized by X-ray diffraction, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectron spectra and optical microscopy. The best parameters, where uniform and maximum coating thickness was achieved, are etching with 20%NaOH for 30 min, sensitization and activation with SnCl2 and PdCl2 for 5 and 20 min, respectively. The composition of the copper solution bath was 16 g/L CuSO4＆#183;5H2O, 35 mL/L formaldehyde （HCHO）, 23 g/L KNaC4H4O6 at 60 ℃, pH=13 and stirring at （350±15） r/min under ultrasonication.

低浓度硫酸铜对化学镀Ni-P镀层微观结构及性能的影响

为改善镍磷(Ni-P)镀层的表面质量、提高Ni-P镀层的性能,在化学镀Ni-P镀液中加入少量的硫酸铜(CuSO_(4)·5H_(2)O)制备Ni-P镀层。利用扫描电镜、能谱仪、X射线衍射仪分析了镀层的表面形貌、成分和结构,研究了CuSO_(4)·5H_(2)O浓度对镀层的微观结构、表面粗糙度、光泽度、硬度、耐磨性和耐蚀性的影响。研究表明:当CuSO_(4)·5H_(2)O浓度为0.1 g/L时,镀层为致密的非晶态节瘤状组织,具有最佳的耐蚀性;当CuSO_(4)·5H_(2)O浓度为0.2 g/L时,镀层表面质量最好,硬度高、耐磨性优异,但镀层中出现少量微晶态Ni-Cu固溶体,耐蚀性下降;当CuSO_(4)·5H_(2)O浓度超过0.2 g/L后,镀层为混晶态菜花状组织,镀层表面的质量和耐蚀性随CuSO_(4)·5H_(2)O浓度的增加不断恶化。