The fabrication and characterization of strained-Si material grown on a relaxed Si0.79 Ge0.21/graded Si1-x- Gex/Si virtual substrate, using reduced pressure chemical vapor deposition, are presented. The Ge concentrati...The fabrication and characterization of strained-Si material grown on a relaxed Si0.79 Ge0.21/graded Si1-x- Gex/Si virtual substrate, using reduced pressure chemical vapor deposition, are presented. The Ge concentration of the constant composition SiGe layer and the grading rate of the graded SiGe layer are estimated with double-crystal X-ray diffraction and further confirmed by SIMS measurements. The surface root mean square roughness of the strained Si cap layer is 2.36nm,and the strain is about 0.83% as determined by atomic force microscopy and Raman spectra, respectively. The threading dislocation density is on the order of 4 × 10^4cm^-2. Furthermore, it is found that the stress in the strained Si cap layer is maintained even after the high thermal budget process, nMOSFET devices are fabricated and measured in strained-Si and unstrained bulk-Si channels. Compared to the co-processed bulk-Si MOSFETs at room temperature,a significant low vertical field mobility enhancement of about 85% is observed in the strained-Si devices.展开更多
We investigate the strain in various Ge-on-insulator (GeOI) micro-structures induced by three phase-change maferials (PCMs) (Ge2Sb2Te5, Sb2Te3, GeTe) deposited. The PCMs could change the phase from amorphous sta...We investigate the strain in various Ge-on-insulator (GeOI) micro-structures induced by three phase-change maferials (PCMs) (Ge2Sb2Te5, Sb2Te3, GeTe) deposited. The PCMs could change the phase from amorphous state to polycrystalline state with a low temperature thermal annealing, resulting in an intrinsic contraction in the PCM films. Raman spectroscopy analysis is performed to compare the strain induced in the GeOI micro- structures by various PCMs. By comparison, Sb2 Tea could induce the largest amount of tensile strain in the GeOI micro-structures after the low temperature annealing. Based on the strain calculated from the Raman peak shifts, finite element numerical simulation is performed to calculate the strain-induced electron mobility enhancement for Ge n-MOSFETs with PCM liner stressors. With the adoption of Sb2 Te3 liner stressor, 22% electron mobility enhancement at Xinv=1×10^13cm^-2 could be achieved, suggesting that PCM especially Sb2 Te3 liner stressor is a promising technique for the performance enhancement of Ge MOSFETs.展开更多
A novel A1GaN/GaN high electron mobility transistor (HEMT) with double buried p-type layers (DBPLs) in the GaN buffer layer and its mechanism are studied. The DBPL A1GaN/GaN HEMT is characterized by two equi-long ...A novel A1GaN/GaN high electron mobility transistor (HEMT) with double buried p-type layers (DBPLs) in the GaN buffer layer and its mechanism are studied. The DBPL A1GaN/GaN HEMT is characterized by two equi-long p-type GaN layers which are buried in the GaN buffer layer under the source side. Under the condition of high-voltage blocking state, two reverse p-n junctions introduced by the buried p-type layers will effectively modulate the surface and bulk electric fields. Meanwhile, the buffer leakage is well suppressed in this structure and both lead to a high breakdown voltage. The simulations show that the breakdown voltage of the DBPL structure can reach above 2000 V from 467 V of the conventional structure with the same gate-drain length of 8μm.展开更多
Puncturing has been recognized as a promising technology to cope with the coexistence problem of enhanced mobile broadband(eMBB) and ultra-reliable low latency communications(URLLC)traffic. However, the steady perform...Puncturing has been recognized as a promising technology to cope with the coexistence problem of enhanced mobile broadband(eMBB) and ultra-reliable low latency communications(URLLC)traffic. However, the steady performance of eMBB traffic while meeting the requirements of URLLC traffic with puncturing is a major challenge in some realistic scenarios. In this paper, we pay attention to the timely and energy-efficient processing for eMBB traffic in the industrial Internet of Things(IIoT), where mobile edge computing(MEC) is employed for data processing. Specifically, the performance of eMBB traffic and URLLC traffic in a MEC-based IIoT system is ensured by setting the threshold of tolerable delay and outage probability, respectively. Furthermore,considering the limited energy supply, an energy minimization problem of eMBB device is formulated under the above constraints, by jointly optimizing the resource blocks(RBs) punctured by URLLC traffic, data offloading and transmit power of eMBB device. With Markov's inequality, the problem is reformulated by transforming the probabilistic outage constraint into a deterministic constraint. Meanwhile, an iterative energy minimization algorithm(IEMA) is proposed.Simulation results demonstrate that our algorithm has a significant reduction in the energy consumption for eMBB device and achieves a better overall effect compared to several benchmarks.展开更多
According to the international technology roadmap for semiconductors (ITRS),32nm technology node will be introduced around 2009. Scaling of CMOS logic devices from 45 to 32nm node has come across significant barrier...According to the international technology roadmap for semiconductors (ITRS),32nm technology node will be introduced around 2009. Scaling of CMOS logic devices from 45 to 32nm node has come across significant barriers. Overcoming these pitch-scaling induced barriers requires integrating the most advanced process technologies into product manufacturing. This paper reviews and discusses new technology applications that could be potentially integrated into 32nm node in the following areas:extension of immersion lithography,mobility enhancement substrate technology,metal/ high-k (MHK) gate stack, ultra-shallow junction (USJ) and other strain enhancement engineering methods, including stress proximity effect (SPT), dual stress liner (DSL), stress memorization technique (SMT), high aspect ratio process (HARP) for STI and PMD,embedded SiGe (for pFET) and SiC (for nFET) source/drain (S/D) using selective epitaxial growth (SEG) method,metallization for middle of line (MOL) and back-end of line (BEOL) ,and ultra low-k (ULK) integration.展开更多
In certain environments and under some conditions, the video images taken by the intelligent mobile video phones seem dark, and the colors are not bright or saturated enough.This paper presents an adaptive method to e...In certain environments and under some conditions, the video images taken by the intelligent mobile video phones seem dark, and the colors are not bright or saturated enough.This paper presents an adaptive method to enhance the video image brightness visualization and the color performance depending on the certain hardware property and function parameters. The experimental results prove that this method can enhance the colors and the contrast of the video images, based on the estimated quality feature values of each frame, without using the extra Digital Signal Processor (DSP).展开更多
Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while (100) channel direction appears as to be an effective booster of hole mobility in particular. In this work, the...Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while (100) channel direction appears as to be an effective booster of hole mobility in particular. In this work, the impact of biaxial strain together with (100) channel orientation on hole mobility is explored. The biaxial strain was incorporated by the growth of a relaxed SiGe buffer layer,serving as the template for depositing a Si layer in a state of biaxial tensile strain. The channel orientation was implemented with a 45^o rotated design in the device layout,which changed the channel direction from (110) to (100) on Si (001) surface. The maximum hole mobility is enhanced by 30% due to the change of channel direction from (110) to (100) on the same strained Si (s-Si) p-MOSFETs,in addition to the mobility enhancement of 130% when comparing s-Si pMOS to bulk Si pMOS both along (110) channels. Discussion and analysis are presented about the origin of the mobility enhancement by channel orientation along with biaxial strain in this work.展开更多
A fully standard CMOS integrated strained Si-channel NMOSFET has been demonstrated. By adjusting the thickness of graded SiGe, modifying the channel doping concentration, changing the Ge fraction of the relaxed SiGe l...A fully standard CMOS integrated strained Si-channel NMOSFET has been demonstrated. By adjusting the thickness of graded SiGe, modifying the channel doping concentration, changing the Ge fraction of the relaxed SiGe layer and forming a p-well by multiple implantation technology, a surface strained Si-channel NMOSFET was fabricated, of which the low field mobility was enhanced by 140%, compared with the bulk-Si control device. Strained NMOSFET and PMOSFET were used to fabricate a strained CMOS inverter based on a SiGe virtual substrate. Test results indicated that the strained CMOS converter had a drain leakage current much lower than the Si devices, and the device exhibited wonderful on/off-state voltage transmission characteristics.展开更多
Hole mobility changes under uniaxial and combinational stress in different directions are characterized and analyzed by applying additive mechanical uniaxial stress to bulk Si and SiGe-virtual-substrate-induced strain...Hole mobility changes under uniaxial and combinational stress in different directions are characterized and analyzed by applying additive mechanical uniaxial stress to bulk Si and SiGe-virtual-substrate-induced strained- Si(s-Si)p-MOSFETs(metal-oxide-semiconductor field-effect transistors)along 110 and 100 channel directions. In bulk Si,a mobility enhancement peak is found under uniaxial compressive strain in the low vertical field.The combination of 100 direction uniaxial tensile strain and substrate-induced biaxial tensile strain provides a higher mobility relative to the 110 direction,opposite to the situation in bulk Si.But the combinational strain experiences a gain loss at high field,which means that uniaxial compressive strain may still be a better choice.The mobility enhancement of SiGe-induced strained p-MOSFETs along the 110 direction under additive uniaxial tension is explained by the competition between biaxial and shear stress.展开更多
The integration of network slicing into a Device-to-Device(D2D)network is a promising technological approach for efficiently accommodating Enhanced Mobile Broadband(eMBB)and Ultra Reliable Low Latency Communication(UR...The integration of network slicing into a Device-to-Device(D2D)network is a promising technological approach for efficiently accommodating Enhanced Mobile Broadband(eMBB)and Ultra Reliable Low Latency Communication(URLLC)services.In this work,we aim to optimize energy efficiency and resource allocation in a D2D underlay cellular network by jointly optimizing beamforming and Resource Sharing Unit(RSU)selection.The problem of our investigation involves a Mixed-Integer Nonlinear Program(MINLP).To solve the problem effectively,we utilize the concept of the Dinkelbach method,the iterative weightedℓ1-norm technique,and the principles of Difference of Convex(DC)programming.To simplify the solution,we merge these methods into a two-step process using Semi-Definite Relaxation(SDR)and Successive Convex Approximation(SCA).The integration of network slicing and the optimization of short packet transmission are the proposed strategies to enhance spectral efficiency and satisfy the demand for low-latency and high-data-rate requirement applications.The Simulation results validate that the proposed method outperforms the benchmark schemes,demonstrating higher throughput ranging from 11.79%to 28.67%for URLLC users,and 13.67%to 35.89%for eMBB users,respectively.展开更多
Predicting user states in future and rendering visual feedbacks accordingly can effectively reduce the visual experienced delay in the tactile Internet(TI). However, most works omit the fact that different parts in an...Predicting user states in future and rendering visual feedbacks accordingly can effectively reduce the visual experienced delay in the tactile Internet(TI). However, most works omit the fact that different parts in an image may have distinct prediction requirements, based on which different prediction models can be used in the predicting process, and then it can further improve predicting quality especially under resources-limited environment. In this paper, a hybrid prediction scheme is proposed for the visual feedbacks in a typical TI scenario with mixed visuo-haptic interactions, in which haptic traffic needs sufficient wireless resources to meet its stringent communication requirement, leaving less radio resources for the visual feedback. First, the minimum required number of radio resources for haptic traffic is derived based on the haptic communication requirements, and wireless resources are allocated to the haptic and visual traffics afterwards. Then, a grouping strategy is designed based on the deep neural network(DNN) to allocate different parts from an image feedback into two groups to use different prediction models, which jointly considers the prediction deviation thresholds, latency and reliability requirements, and the bit sizes of different image parts. Simulations show that, the hybrid prediction scheme can further reduce the visual experienced delay under haptic traffic requirements compared with existing strategies.展开更多
The fifth generation(5G)of wireless networks features three core use cases,namely ultra-reliable and low latency communications(URLLC),massive machine type communications(mMTC),and enhanced mobile broadband(eMBB).Thes...The fifth generation(5G)of wireless networks features three core use cases,namely ultra-reliable and low latency communications(URLLC),massive machine type communications(mMTC),and enhanced mobile broadband(eMBB).These use cases co-exist in many practical scenarios and compete for the same set of time and frequency resources,resulting in a natural trade-off in their performance.In this paper,a network supporting both URLLC and eMBB modes of operation is studied.To guarantee the ultra low latency requirement of URLLC,a dynamic resource allocation scheme indicated by a two-dimensional bitmap is proposed.This approach is capable to achieve finer granularity as well as lower false cancellation rate compared to the state-of-the-art methods.A novel power control and indication method is also proposed to dynamically provide different power control parameters to the user equipment(UE),while guaranteeing the reliability requirement of URLLC and minimizing the impact to eMBB.In addition,we devise a dynamic selection mechanism(DSM)to accommodate diverse scenarios,which is empowered with load prediction to become more intelligent.Our extensive system-level simulation results for eMBB-URLLC co-existence scenarios showcase that the perceived throughput of eMBB UEs is increased by 45.3%,while about 13.3% more UEs are enjoying URLLC services with at most 84% transmit power savings compared to the state-of-the-art methods.展开更多
文摘The fabrication and characterization of strained-Si material grown on a relaxed Si0.79 Ge0.21/graded Si1-x- Gex/Si virtual substrate, using reduced pressure chemical vapor deposition, are presented. The Ge concentration of the constant composition SiGe layer and the grading rate of the graded SiGe layer are estimated with double-crystal X-ray diffraction and further confirmed by SIMS measurements. The surface root mean square roughness of the strained Si cap layer is 2.36nm,and the strain is about 0.83% as determined by atomic force microscopy and Raman spectra, respectively. The threading dislocation density is on the order of 4 × 10^4cm^-2. Furthermore, it is found that the stress in the strained Si cap layer is maintained even after the high thermal budget process, nMOSFET devices are fabricated and measured in strained-Si and unstrained bulk-Si channels. Compared to the co-processed bulk-Si MOSFETs at room temperature,a significant low vertical field mobility enhancement of about 85% is observed in the strained-Si devices.
基金Supported by the National Natural Science Foundation of China under Grant Nos 61376097,61504120U1609213,the Zhejiang Provincial Natural Science Foundation of China under Grant No LR14F040001the Specialized Research Fund for the Doctoral Program of Higher Education of China under Grant No 20130091110025
文摘We investigate the strain in various Ge-on-insulator (GeOI) micro-structures induced by three phase-change maferials (PCMs) (Ge2Sb2Te5, Sb2Te3, GeTe) deposited. The PCMs could change the phase from amorphous state to polycrystalline state with a low temperature thermal annealing, resulting in an intrinsic contraction in the PCM films. Raman spectroscopy analysis is performed to compare the strain induced in the GeOI micro- structures by various PCMs. By comparison, Sb2 Tea could induce the largest amount of tensile strain in the GeOI micro-structures after the low temperature annealing. Based on the strain calculated from the Raman peak shifts, finite element numerical simulation is performed to calculate the strain-induced electron mobility enhancement for Ge n-MOSFETs with PCM liner stressors. With the adoption of Sb2 Te3 liner stressor, 22% electron mobility enhancement at Xinv=1×10^13cm^-2 could be achieved, suggesting that PCM especially Sb2 Te3 liner stressor is a promising technique for the performance enhancement of Ge MOSFETs.
基金Supported by the National Natural Science Foundation of China under Grant Nos 61334002,61106106,and 61204085the China Postdoctoral Science Foundation Funded Project under Grant No 2015M582610
文摘A novel A1GaN/GaN high electron mobility transistor (HEMT) with double buried p-type layers (DBPLs) in the GaN buffer layer and its mechanism are studied. The DBPL A1GaN/GaN HEMT is characterized by two equi-long p-type GaN layers which are buried in the GaN buffer layer under the source side. Under the condition of high-voltage blocking state, two reverse p-n junctions introduced by the buried p-type layers will effectively modulate the surface and bulk electric fields. Meanwhile, the buffer leakage is well suppressed in this structure and both lead to a high breakdown voltage. The simulations show that the breakdown voltage of the DBPL structure can reach above 2000 V from 467 V of the conventional structure with the same gate-drain length of 8μm.
基金supported by the Natural Science Foundation of China (No.62171051)。
文摘Puncturing has been recognized as a promising technology to cope with the coexistence problem of enhanced mobile broadband(eMBB) and ultra-reliable low latency communications(URLLC)traffic. However, the steady performance of eMBB traffic while meeting the requirements of URLLC traffic with puncturing is a major challenge in some realistic scenarios. In this paper, we pay attention to the timely and energy-efficient processing for eMBB traffic in the industrial Internet of Things(IIoT), where mobile edge computing(MEC) is employed for data processing. Specifically, the performance of eMBB traffic and URLLC traffic in a MEC-based IIoT system is ensured by setting the threshold of tolerable delay and outage probability, respectively. Furthermore,considering the limited energy supply, an energy minimization problem of eMBB device is formulated under the above constraints, by jointly optimizing the resource blocks(RBs) punctured by URLLC traffic, data offloading and transmit power of eMBB device. With Markov's inequality, the problem is reformulated by transforming the probabilistic outage constraint into a deterministic constraint. Meanwhile, an iterative energy minimization algorithm(IEMA) is proposed.Simulation results demonstrate that our algorithm has a significant reduction in the energy consumption for eMBB device and achieves a better overall effect compared to several benchmarks.
文摘According to the international technology roadmap for semiconductors (ITRS),32nm technology node will be introduced around 2009. Scaling of CMOS logic devices from 45 to 32nm node has come across significant barriers. Overcoming these pitch-scaling induced barriers requires integrating the most advanced process technologies into product manufacturing. This paper reviews and discusses new technology applications that could be potentially integrated into 32nm node in the following areas:extension of immersion lithography,mobility enhancement substrate technology,metal/ high-k (MHK) gate stack, ultra-shallow junction (USJ) and other strain enhancement engineering methods, including stress proximity effect (SPT), dual stress liner (DSL), stress memorization technique (SMT), high aspect ratio process (HARP) for STI and PMD,embedded SiGe (for pFET) and SiC (for nFET) source/drain (S/D) using selective epitaxial growth (SEG) method,metallization for middle of line (MOL) and back-end of line (BEOL) ,and ultra low-k (ULK) integration.
文摘In certain environments and under some conditions, the video images taken by the intelligent mobile video phones seem dark, and the colors are not bright or saturated enough.This paper presents an adaptive method to enhance the video image brightness visualization and the color performance depending on the certain hardware property and function parameters. The experimental results prove that this method can enhance the colors and the contrast of the video images, based on the estimated quality feature values of each frame, without using the extra Digital Signal Processor (DSP).
文摘Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while (100) channel direction appears as to be an effective booster of hole mobility in particular. In this work, the impact of biaxial strain together with (100) channel orientation on hole mobility is explored. The biaxial strain was incorporated by the growth of a relaxed SiGe buffer layer,serving as the template for depositing a Si layer in a state of biaxial tensile strain. The channel orientation was implemented with a 45^o rotated design in the device layout,which changed the channel direction from (110) to (100) on Si (001) surface. The maximum hole mobility is enhanced by 30% due to the change of channel direction from (110) to (100) on the same strained Si (s-Si) p-MOSFETs,in addition to the mobility enhancement of 130% when comparing s-Si pMOS to bulk Si pMOS both along (110) channels. Discussion and analysis are presented about the origin of the mobility enhancement by channel orientation along with biaxial strain in this work.
基金supposed by the National Basic Research Program of Chinasupposed by the State Key Laboratory of Electronic Thin Films and Integrated Devices,UESTCthe Science and Technology on Analog Integrated Circuit Laboratory,CETC
文摘A fully standard CMOS integrated strained Si-channel NMOSFET has been demonstrated. By adjusting the thickness of graded SiGe, modifying the channel doping concentration, changing the Ge fraction of the relaxed SiGe layer and forming a p-well by multiple implantation technology, a surface strained Si-channel NMOSFET was fabricated, of which the low field mobility was enhanced by 140%, compared with the bulk-Si control device. Strained NMOSFET and PMOSFET were used to fabricate a strained CMOS inverter based on a SiGe virtual substrate. Test results indicated that the strained CMOS converter had a drain leakage current much lower than the Si devices, and the device exhibited wonderful on/off-state voltage transmission characteristics.
基金supported by the National Natural Science Foundation of China(Nos.60636010,60820106001)
文摘Hole mobility changes under uniaxial and combinational stress in different directions are characterized and analyzed by applying additive mechanical uniaxial stress to bulk Si and SiGe-virtual-substrate-induced strained- Si(s-Si)p-MOSFETs(metal-oxide-semiconductor field-effect transistors)along 110 and 100 channel directions. In bulk Si,a mobility enhancement peak is found under uniaxial compressive strain in the low vertical field.The combination of 100 direction uniaxial tensile strain and substrate-induced biaxial tensile strain provides a higher mobility relative to the 110 direction,opposite to the situation in bulk Si.But the combinational strain experiences a gain loss at high field,which means that uniaxial compressive strain may still be a better choice.The mobility enhancement of SiGe-induced strained p-MOSFETs along the 110 direction under additive uniaxial tension is explained by the competition between biaxial and shear stress.
文摘The integration of network slicing into a Device-to-Device(D2D)network is a promising technological approach for efficiently accommodating Enhanced Mobile Broadband(eMBB)and Ultra Reliable Low Latency Communication(URLLC)services.In this work,we aim to optimize energy efficiency and resource allocation in a D2D underlay cellular network by jointly optimizing beamforming and Resource Sharing Unit(RSU)selection.The problem of our investigation involves a Mixed-Integer Nonlinear Program(MINLP).To solve the problem effectively,we utilize the concept of the Dinkelbach method,the iterative weightedℓ1-norm technique,and the principles of Difference of Convex(DC)programming.To simplify the solution,we merge these methods into a two-step process using Semi-Definite Relaxation(SDR)and Successive Convex Approximation(SCA).The integration of network slicing and the optimization of short packet transmission are the proposed strategies to enhance spectral efficiency and satisfy the demand for low-latency and high-data-rate requirement applications.The Simulation results validate that the proposed method outperforms the benchmark schemes,demonstrating higher throughput ranging from 11.79%to 28.67%for URLLC users,and 13.67%to 35.89%for eMBB users,respectively.
基金supported by the National Natural Science Foundation of China (61771070)。
文摘Predicting user states in future and rendering visual feedbacks accordingly can effectively reduce the visual experienced delay in the tactile Internet(TI). However, most works omit the fact that different parts in an image may have distinct prediction requirements, based on which different prediction models can be used in the predicting process, and then it can further improve predicting quality especially under resources-limited environment. In this paper, a hybrid prediction scheme is proposed for the visual feedbacks in a typical TI scenario with mixed visuo-haptic interactions, in which haptic traffic needs sufficient wireless resources to meet its stringent communication requirement, leaving less radio resources for the visual feedback. First, the minimum required number of radio resources for haptic traffic is derived based on the haptic communication requirements, and wireless resources are allocated to the haptic and visual traffics afterwards. Then, a grouping strategy is designed based on the deep neural network(DNN) to allocate different parts from an image feedback into two groups to use different prediction models, which jointly considers the prediction deviation thresholds, latency and reliability requirements, and the bit sizes of different image parts. Simulations show that, the hybrid prediction scheme can further reduce the visual experienced delay under haptic traffic requirements compared with existing strategies.
文摘The fifth generation(5G)of wireless networks features three core use cases,namely ultra-reliable and low latency communications(URLLC),massive machine type communications(mMTC),and enhanced mobile broadband(eMBB).These use cases co-exist in many practical scenarios and compete for the same set of time and frequency resources,resulting in a natural trade-off in their performance.In this paper,a network supporting both URLLC and eMBB modes of operation is studied.To guarantee the ultra low latency requirement of URLLC,a dynamic resource allocation scheme indicated by a two-dimensional bitmap is proposed.This approach is capable to achieve finer granularity as well as lower false cancellation rate compared to the state-of-the-art methods.A novel power control and indication method is also proposed to dynamically provide different power control parameters to the user equipment(UE),while guaranteeing the reliability requirement of URLLC and minimizing the impact to eMBB.In addition,we devise a dynamic selection mechanism(DSM)to accommodate diverse scenarios,which is empowered with load prediction to become more intelligent.Our extensive system-level simulation results for eMBB-URLLC co-existence scenarios showcase that the perceived throughput of eMBB UEs is increased by 45.3%,while about 13.3% more UEs are enjoying URLLC services with at most 84% transmit power savings compared to the state-of-the-art methods.