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Effects of filler loading and surface modification on electrical and thermal properties of epoxy/montmorillonite composite 被引量:2
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作者 贾梓睿 高振国 +3 位作者 兰笛 成永红 吴广磊 吴宏景 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第11期332-339,共8页
Epoxy-based composites containing montmorillonite(MMT) modified by silylation reaction with γ-aminopropyltriethoxysilane(γ-APTES) and 3-(glycidyloxypropyl) trimethoxysilane(GPTMS) are successfully prepared.T... Epoxy-based composites containing montmorillonite(MMT) modified by silylation reaction with γ-aminopropyltriethoxysilane(γ-APTES) and 3-(glycidyloxypropyl) trimethoxysilane(GPTMS) are successfully prepared.The effects of filler loading and surface modification on the electrical and thermal properties of the epoxy/MMT composites are investigated. Compared with the pure epoxy resin, the epoxy/MMT composite, whether MMT is surface-treated or not, shows low dielectric permittivity, low dielectric loss, and enhanced dielectric strength. The MMT in the epoxy/MMT composite also influences the thermal properties of the composite by improving the thermal conductivity and stability.Surface functionalization of MMT not only conduces to the better dispersion of the nanoparticles, but also significantly affects the electric and thermal properties of the hybrid by influencing the interfaces between MMT and epoxy resin.Improved interfaces are good for enhancing the electric and thermal properties of nanocomposites. What is more, the MMT modified with GPTMS rather than γ-APTES is found to have greater influence on improving the interface between the MMT filler and polymer matrices, thus resulting in lower dielectric loss, lower electric conductivity, higher breakdown strength, lower thermal conductivity, and higher thermal stability. 展开更多
关键词 modified epoxy resin surface modification electric property thermal property
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A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package 被引量:6
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作者 Xiong-Fa Yang Jia Liu +3 位作者 Qiong Chen Yan-Ping Shen Hong-Zhi Liu Guo-Qiao Lai 《Chinese Journal of Polymer Science》 SCIE CAS CSCD 2018年第5期649-654,共6页
In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable so... In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-(2,3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature(40 °C/2 h then 60 °C/1 h) exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40-60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package. 展开更多
关键词 Silane modified epoxy resins LED filament bulb Package materials
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