The effect of urea pretreatment on the formaldehyde emission and properties of straw particleboard

For manufacturing low-formaldehyde emission particleboard from wheat straw and urea-formaldehyde （UF） resins using urea treatment for indoor environments, we investigated the influence of urea treatment on the formaldehyde emission, physical and mechanical properties of the manufactured particleboard. Wheat straws were treated at three levels of urea concentration （5%, 10%, 15%） and 95℃ as holding temperature. Wheat straw particleboards were manufactured using hot press at 180℃ and 3 MPa with two types of UF adhesive （UF-45, UF-91）. Then the formaldehyde emission values, physical properties and mechanical properties were considered. The results show that the for- maldehyde emission value was decreased by increasing urea concentration. Furthermore, the results indicate that the specimens under urea treatment have better mechanical and physical properties compared with control specimens. Also specimens under urea treatment at 10% concentration and UF-91 type adhesive have the most optimum physical and mechanical strength.

Evaluation of formaldehyde emission from particleboard using the large chamber and desiccator method at various loading ratios

We studied formaldehyde emission from uncoated particleboard with 16-mm thickness using the large chamber and the desiccator method. A chamber of 28.4 m3 was installed to simulate a mobile home. The formaldehyde off-gassing properties of particleboard were evaluated using the chamber. The relationship between the concentration obtained by the chamber and the values by the desiccator test was discussed in this study under different conditions of conditioning day, air exchange, and loading ratio. These two methods were compared and discussed regarding the formaldehyde emission level. Three loading ratios, 0.429 m2/m3, 0.264 m2/m3, and 0.132 m2/m3, were chosen to represent different applications of particleboard products. There was strong correlation between emissions and air exchange rates at equal product-loading ratios in the large chamber, the related coefficient R 2 exceeded 0.90. There was also an indication of a generic correlation between the large chamber and the two-hour desiccator test with a single product designated loading ratio, air exchange rate, and climatic conditions.

Adhesion of Technical Lignin-Based Non-Isocyanate Polyurethane Adhesives for Wood Bonding

Lignin is the most abundant aromatic natural polymer,and receiving great attention in replacing various petro-leum-based polymers.The aim of this study is to investigate the feasibility of technical lignin as a polyol for the synthesis of non-isocyanate polyurethane(NIPU)adhesives to substitute current polyurethane(PU)adhesives that have been synthesized with toxic isocyanate and polyols.Crude hardwood kraft lignin(C-HKL)was extracted from black liquor from a pulp mill followed by acetone fractionation to obtain acetone soluble-HKL(AS-HKL).Then,C-HKL,AS-HKL,and softwood sodium lignosulfonate(LS)were used for the synthesis of technical lignin-based NIPU adhesives through carbonation and polyamination and silane as a cross-linker.Their adhesion per-formance was determined for plywood.FTIR spectra showed the formation of urethane bonds and the reaction between lignin and silane.The NIPU adhesives prepared with C-HKL showed the highest adhesion strength among the three lignin-based NIPU adhesives.As the silane addition level increased,the adhesion strength of NIPU adhesives increased whereas formaldehyde emission decreased for all NIPU adhesives prepared.These results indicate that NIPU adhesives based on technical kraft lignin have a great potential as polyol for the synth-esis of bio-based NIPU adhesives for wood bonding.

Preparation and properties of waste tea leaves particleboard

Urea-formaldehyde （UF） adhesive is the main source of formaldehyde emission from UF-bonded boards. The components in waste tea leaves can react with formaldehyde to serve as a raw material in the production of low formaldehyde emission boards. In our study, waste tea leaves and UF adhesive were employed in the preparation of waste tea leaves particleboard （WTLB）. An orthogonal experimental method was applied to investigate the effects of process parameters on formaldehyde emission and mechanical properties of WTLB. The results indicated that： 1） waste tea leaves had the ability to abate formaldehyde emission from boards; and 2） density of the WTLB was a significant factor affecting its modulus of rupture （MOR）, modulus of elasticity （MOE） and internal bonding （IB）.